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High-temp heat pump patent landscape 2026

High-Temperature Heat Pump Technology Landscape 2026 — PatSnap Insights
Innovation Intelligence

High-temperature heat pumps — delivering process heat above 100°C and up to 200°C — are fast becoming a linchpin of industrial decarbonisation. This patent-based landscape maps the four innovation clusters, dominant assignees, and emerging whitespace defining the HTHP field in 2026.

PatSnap Insights Team Innovation Intelligence Analysts 11 min read
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Reviewed by the PatSnap Insights editorial team ·

Four Innovation Clusters Shaping HTHP Development

High-temperature heat pump (HTHP) technology — defined here as systems delivering process heat above 100°C and in many architectures up to 200°C or beyond — organises into four distinct patent clusters: heat-driven compressor-based cycles, low-GWP working fluids, hybrid and integrated system architectures, and digital monitoring platforms. Each cluster addresses a different dimension of the core technical challenge: simultaneously achieving high supply temperature, high coefficient of performance (COP), and regulatory compliance with low global warming potential (GWP) and zero ozone depletion potential (ODP).

25+
Patents by Li Huayu (CN) in heat-driven compression cycles, 2016–2024
4
Primary technology sub-domains in the HTHP patent landscape
140°C+
Maximum condenser operating temperature enabled by E-HFO-1438mzz
2000
Year of earliest relevant HTHP filing in this dataset (GPV Management, DE)

The dominant cluster by filing volume is heat-driven compressor-based systems, covering Type-I, Type-III, and Type-IV cycles that exploit temperature differentials across high-temperature heat exchangers, expanders, and multi-stage compressors. Working fluid innovation — principally HFO-class refrigerants — forms the second cluster, driven almost entirely by DuPont’s filing activity beginning in 2014. Hybrid architectures integrating geothermal, solar, and waste-heat sources constitute the third cluster, while IoT, neural network, and digital-twin applications to performance monitoring and fault diagnosis represent the fourth and most recently active cluster, with filings as recent as 2025.

Dataset scope note

This landscape is derived from a targeted set of patent and literature records. It represents a snapshot of innovation signals within this dataset only and should not be interpreted as a comprehensive view of the full industry. All claims and statistics below are sourced from this dataset.

Figure 1 — High-Temperature Heat Pump Patent Clusters by Filing Activity
High-Temperature Heat Pump Patent Clusters by Filing Volume — HTHP Landscape 2026 0 10 20 30 Approx. Patent Count 25+ Heat-Driven Compression 4 Low-GWP Working Fluids 4 Hybrid & Integrated 3 Digital Monitoring Heat-Driven Compression Working Fluids Hybrid Systems Digital Monitoring
Heat-driven compression cycles dominate the dataset with over 25 patents, concentrated in a single inventor; the remaining three clusters each comprise fewer than five records, signalling significant whitespace in working fluid alternatives, hybrid integration, and digital analytics.

According to WIPO, heat pump technologies are classified under IPC subclass F25B, and the global race to decarbonise industrial heat — which accounts for roughly 20% of global energy consumption by some estimates — is accelerating filing activity across all four clusters. The concentration seen in this dataset is unusual: a single inventor dominates the largest cluster, while the smallest clusters represent the most commercially active recent filings.

Patent Concentration: One Inventor, One Refrigerant Maker, and the Rest

The geographic and assignee structure of HTHP patent activity in this dataset is unusually concentrated: China dominates by filing volume, driven overwhelmingly by a single inventor-assignee, Li Huayu, who holds more than 25 patent records across Type-I, Type-III, and Type-IV heat-driven compression heat pump series filed between 2016 and 2024. This concentration in a single inventor is described in the source data as “an unusual structural feature of this dataset.”

Chinese inventor Li Huayu holds more than 25 patent records covering Type-I, Type-III, and Type-IV heat-driven compression heat pump configurations, filed between 2016 and 2024 — making this individual the single largest patent holder in the high-temperature heat pump compression cycle space within the dataset analysed.

United States-origin assignees are represented principally through DuPont (E.I. du Pont de Nemours and successor entities), which filed working fluid patents in CN and TW jurisdictions rather than the US directly — a pattern consistent with a China-market-first prosecution strategy for refrigerant intellectual property. Japan contributes geothermal heat pump system design (Hokkaido University, 2024) and automotive thermal management (BYD filings in Japan, 2024–2026). South Korea contributes solar-heat-pump integration, geothermal sizing tools, district energy monitoring, and IoT energy management. Germany is represented by a single early filing from GPV Management in 2000, indicating early-stage but now inactive IP.

“Li Huayu (CN individual inventor) and DuPont (US) together account for the preponderance of core HTHP mechanism and working fluid IP — application-layer and system integration patents are more distributed across Korean and Japanese institutional assignees.”

Figure 2 — HTHP Patent Activity by Geography and Key Assignee Type
High-Temperature Heat Pump Patent Filing Geography — HTHP Landscape 2026 China (CN) 30+ USA (US) 4 South Korea (KR) 5 Japan (JP) 3 Germany (DE) 1 Approximate patent count (this dataset)
China’s dominance reflects Li Huayu’s concentrated filing programme; US assignee presence (DuPont) is filed into CN/TW rather than the US directly, suggesting a China-market-first refrigerant IP strategy.

Any entrant designing high-temperature heat pump systems for Chinese markets must conduct detailed freedom-to-operate (FTO) analysis against Li Huayu’s portfolio. According to the source data, many of these patents remain in active legal status. The European Patent Office and USPTO databases can be used to trace PCT family coverage and assess cross-jurisdictional exposure for teams entering this space.

Map freedom-to-operate risk across the Li Huayu HTHP portfolio with PatSnap Eureka’s patent analytics.

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Low-GWP Working Fluids and the Refrigerant Bottleneck

DuPont’s HFO refrigerant IP creates a working fluid bottleneck for teams developing high-temperature heat pumps targeting 100–150°C and above. E-HFO-1336mzz (E-1,1,1,4,4,4-hexafluoro-2-butene) enables single-stage and cascade heat pump configurations operating at 40–135°C, while E-HFO-1438mzz raises the maximum feasible condenser operating temperature above 140°C — including transcritical-cycle operation. Both fluids are positioned as low-GWP replacements for legacy refrigerants including CFC-114, HFC-245fa, HFC-236fa, HCFC-124, HFC-134a, and CFC-12.

DuPont (E.I. du Pont de Nemours) filed patents for E-HFO-1336mzz beginning in 2014 (TW) and 2015 (CN), covering heat pump applications at 40–135°C; a further filing in 2014 (CN) covers E-HFO-1438mzz for high-temperature heat pump operation above 140°C, including transcritical-cycle configurations.

The filing strategy is notable: DuPont prosecuted these patents in CN and TW jurisdictions rather than the US, suggesting a deliberate China-market-first approach to protecting refrigerant IP where heat pump manufacturing is most concentrated. Teams developing HTHPs must either license DuPont-lineage refrigerant IP, develop alternative HFO blends outside the claimed scope, or pursue transcritical CO₂ architectures not covered in this dataset.

Key finding: Refrigerant IP bottleneck

E-HFO-1336mzz and E-HFO-1438mzz filings in CN and TW, combined with likely broader PCT family coverage, mean that R&D teams developing HTHPs targeting temperatures of 100–150°C+ must either license DuPont-lineage refrigerant IP, develop alternative HFO blends, or pursue transcritical CO₂ architectures not covered in this dataset.

The global phase-down of high-GWP refrigerants under the Kigali Amendment to the Montreal Protocol — tracked by UNEP — makes this bottleneck strategically significant. As HFC phase-down schedules tighten through the late 2020s, the HFO-class fluids patented by DuPont are among the few commercially viable drop-in replacements for high-temperature applications, giving the patent holder substantial leverage in licensing negotiations with heat pump OEMs.

Li Huayu’s heat-driven compression cycles, by contrast, do not specify a single working fluid — they are architecture patents covering the thermodynamic cycle configurations. This means the working fluid and compression architecture IP layers are held by different parties, creating a stacked licensing consideration for any commercial HTHP developer targeting the Chinese market.

Application Domains: From Industrial Boilers to EV Battery Management

High-temperature heat pump patents in this dataset span five distinct application domains, each with different maturity levels and IP density. Industrial process heating is the most IP-dense domain, while automotive thermal management represents the most recent and fastest-moving frontier.

Industrial Process Heating

Li Huayu’s Type-I and Type-III heat-driven compression heat pump series directly addresses industrial heating needs, enabling supply of process heat from mid-grade and high-grade waste heat sources. The direct-combustion variants filed in 2024 explicitly extend the framework to fuel-driven industrial installations with co-generation capability — delivering both heat and power from a single HTHP system. Food processing, chemical, and textile sectors targeting intermediate process heat in the 100–200°C range are the primary industrial beneficiaries.

District Heating and Managed Services

New Oasis Energy Technology (CN, 2023) and State Grid Anhui Electric Power Research Institute (CN, 2025) both target large-scale district heating deployments — addressing COP benchmarking, climate-zone applicability, and energy efficiency rating across managed heat pump portfolios. The State Grid Anhui filing deploys particle-swarm-optimised neural networks to evaluate HTHP applicability across climate zones, incorporating comprehensive energy, cost, and carbon indicators.

Automotive and Electric Vehicles

BYD Company’s JP filings from 2024 to 2026 represent a leading-edge integration of heat pump technology into EV thermal architectures, combining battery heating, cabin conditioning, and battery self-heating in a unified control framework. This is identified in the source data as “early formalized IP in vehicle-integrated heat pump thermal management” — a space R&D teams should monitor closely for fast-developing claim boundaries.

BYD Company Limited filed integrated thermal management system patents incorporating heat pump subsystems in Japan between 2024 and 2026, placing a heat pump at the core of a vehicle’s combined passenger compartment conditioning and battery thermal management architecture.

Renewable Energy Integration and Buildings

Solar-heat-pump hybrid systems (Korea Institute of Machinery and Materials, KR, 2025) and energy-independent systems integrating energy storage systems (ESS) and heat pumps (Bandai & S Co., Ltd., KR, 2019) target the building sector. The Korea Institute of Machinery and Materials filing introduces priority-ordered dispatch logic — solar thermal first, heat pump second — targeting high-temperature fluid supply to industrial or building heat demand.

Geothermal Heating Systems

Hokkaido University (JP, 2024) addressed operation design and control for geothermal heat recovery heat pump (HR-GSHP) systems, covering load-balancing strategies for multi-pump ground-source installations. This institutional filing signals continued academic-led IP development in geothermal HTHP — a domain with relatively low commercial assignee concentration in this dataset.

Track emerging HTHP filings across all five application domains with real-time patent monitoring in PatSnap Eureka.

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Emerging Directions and IP Whitespace in 2025–2026

Filings from 2023–2026 in this dataset reveal four emerging directions and several areas of significant IP whitespace — gaps between what is being filed and what the technology roadmap requires. Understanding these gaps is as strategically important as mapping existing patent density.

1. Direct-Combustion and Energy Co-Synergy Architectures

Li Huayu’s 2024 filings introduce direct-combustion Type-I heat pumps with high-temperature regenerators and energy co-synergy configurations. These systems enable simultaneous use of low-grade and high-grade fuels with an enhanced supply temperature range and co-generation output — extending the HTHP framework beyond pure electrification into hybrid fuel-electric configurations relevant to industries that cannot yet fully electrify process heat.

2. AI and Neural Network Applicability Evaluation

State Grid Anhui Electric Power Research Institute (CN, 2025) deploys particle-swarm-optimised neural networks to evaluate HTHP applicability across climate zones, incorporating comprehensive energy, cost, and carbon indicators. This represents the first identified use of AI-driven applicability modelling for heat source tower heat pumps in this dataset — a methodology with broad potential application across district heating portfolio management.

3. Vehicle Integrated Thermal Management

BYD Company’s JP filings (2024–2026) represent early formalised IP in vehicle-integrated heat pump thermal management. The claim boundaries in this space are still forming, making it an active whitespace for R&D teams targeting higher temperature performance levels in EV thermal systems.

4. Solar-Heat Pump Hybridisation

The Korea Institute of Machinery and Materials’ solar-heat-pump fusion filing (KR, 2025) and J&G Co., Ltd.’s geothermal-solar hybrid (KR, 2017) suggest opportunity for more comprehensive system-level IP covering combined renewable-driven high-temperature heat delivery. This is particularly relevant for food processing, chemical, and textile sectors where intermediate process heat at 100–200°C is the decarbonisation target.

Key finding: Digital analytics is underprotected

IoT monitoring and neural network evaluation filings in this dataset (CN, 2022–2025) are relatively thin in claim scope and assignee concentration. There is significant whitespace for IP development in model-based predictive control, digital twin integration, and real-time COP optimisation for industrial HTHP installations.

Figure 3 — HTHP Innovation Timeline: Key Filing Milestones by Cluster
High-Temperature Heat Pump Patent Filing Timeline 2000–2026 — Key Milestones by Cluster 2000 GPV Mgmt (DE) 2014 DuPont HFO filing begins 2016 Li Huayu Type-I/III 2022 IoT monitoring (Zhuhai Santi) 2024 BYD EV & Li Huayu 2024 2026 BYD JP filing Compression Cycles Working Fluids Digital Monitoring EV / Automotive
The HTHP innovation timeline shows a long dormancy between the 2000 German filing and the 2014–2016 acceleration driven by DuPont’s refrigerant IP and Li Huayu’s compression cycle programme; digital monitoring and EV integration represent the most active frontier as of 2026.

The strategic implications for R&D and IP teams are clear. The digital performance analytics layer — encompassing IoT monitoring, model-based predictive control, digital twin integration, and real-time COP optimisation — is the most underprotected segment identified in this landscape. Solar-HTHP hybridisation for industrial decarbonisation also lacks deep IP concentration, particularly for food processing, chemical, and textile sectors where intermediate process heat at 100–200°C is the decarbonisation target. Research published by IEA consistently identifies industrial heat below 200°C as one of the most tractable near-term electrification opportunities — making HTHP whitespace in this range commercially significant.

Frequently asked questions

High-temperature heat pump technology — key questions answered

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References

  1. Type-III Heat-Driven Compression Heat Pump — Li Huayu, 2017, CN (PatSnap Eureka)
  2. Type-I Heat-Driven Compression Heat Pump — Li Huayu, 2017, CN (PatSnap Eureka)
  3. Type-IV Heat-Driven Compression Heat Pump — Li Huayu, 2020, CN (PatSnap Eureka)
  4. Direct-Combustion Type-I Heat-Driven Compression Heat Pump — Li Huayu, 2024, CN (PatSnap Eureka)
  5. Energy Co-Generation Direct-Combustion Type-I Heat-Driven Compression Heat Pump — Li Huayu, 2024, CN (PatSnap Eureka)
  6. Use of E-1,1,1,4,4,4-Hexafluoro-2-Butene in Heat Pumps — E.I. du Pont de Nemours (DuPont), 2015, CN (PatSnap Eureka)
  7. Use of E-1,1,1,4,4,4-Hexafluoro-2-Butene in Heat Pumps — E.I. du Pont de Nemours (DuPont), 2018, CN (PatSnap Eureka)
  8. Use of E-HFO-1336mzz in Heat Pumps — DuPont, 2014, TW (PatSnap Eureka)
  9. Use of E-HFO-1438mzz in High-Temperature Heat Pumps — E.I. du Pont de Nemours (DuPont), 2014, CN (PatSnap Eureka)
  10. IoT-Based Heat Pump Performance Monitoring System and Method — Zhuhai Santi Core Variable Frequency Technology Co., Ltd., 2022, CN (PatSnap Eureka)
  11. Analysis Method for Heat Pump Heating Managed Projects — New Oasis Energy Technology Co., Ltd., 2023, CN (PatSnap Eureka)
  12. Heat Source Tower Heat Pump Applicability Evaluation Model — State Grid Anhui Electric Power Research Institute, 2025, CN (PatSnap Eureka)
  13. Solar Heat Pump System and Design Method — Korea Institute of Machinery and Materials, 2025, KR (PatSnap Eureka)
  14. Integrated Thermal Management System and Vehicle — BYD Company Limited, 2024, JP (PatSnap Eureka)
  15. Integrated Thermal Management System and Vehicle — BYD Company Limited, 2026, JP (PatSnap Eureka)
  16. Operation Design Method and Control System for Geothermal Heat Recovery Heat Pump System — Hokkaido University, 2024, JP (PatSnap Eureka)
  17. WIPO — World Intellectual Property Organization (IPC Classification F25B: Refrigeration; Refrigerating Machines)
  18. European Patent Office — Espacenet Patent Database
  19. UNEP — Kigali Amendment to the Montreal Protocol: HFC Phase-Down Schedule
  20. International Energy Agency (IEA) — Industrial Heat Decarbonisation Research
  21. PatSnap Innovation Intelligence Platform — IP Analysis Solutions

All data and statistics in this article are sourced from the references above and from PatSnap‘s proprietary innovation intelligence platform. This landscape is derived from a targeted set of patent and literature records and represents a snapshot of innovation signals within this dataset only.

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