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Helix Microinnovations v. NXP USA — Chip-on-Board Patent Dismissed | PatSnap
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Case ID7:25-cv-00241
FiledMay 2025
ClosedSep 2025
Patent Litigation

Helix Microinnovations v. NXP USA: CoB Patent Case Dismissed With Prejudice

Helix Microinnovations LLC asserted US7238550B2 — covering methods and apparatus for fabricating Chip-on-Board modules — against NXP USA, Inc. in the Western District of Texas. The plaintiff voluntarily dismissed all claims with prejudice after just 126 days, before NXP filed an answer, closing the case permanently.

Resolution time
126days
126 days — resolved before defendant’s answer was due, suggesting early strategic recalibration
Patents asserted
1
US7238550B2 — methods and apparatus for fabricating Chip-on-Board (CoB) modules
Outcome
Voluntary dismissal
Voluntary dismissal with prejudice — Helix cannot re-file this claim against NXP USA
Cost ruling
Own Costs
Each party bears its own costs, expenses, and attorney fees per court order
Published by PatSnap Insights Team · Verified by PatSnap Eureka Data
Case overview

CoB Patent Assertion Against NXP USA Ends Before First Answer

On May 21, 2025, Helix Microinnovations LLC — represented by Rabicoff Law LLC — filed an infringement action in the Western District of Texas against NXP USA, Inc., asserting US7238550B2, which covers methods and apparatus for fabricating Chip-on-Board modules. NXP USA, a major semiconductor and embedded processing company, was represented by Norton Rose Fulbright LLP. The case, assigned case number 7:25-cv-00241, targeted a foundational packaging technology widely used across the semiconductor industry.

On September 23, 2025 — just 126 days after filing — Helix filed a Notice of Voluntary Dismissal With Prejudice under Federal Rule of Civil Procedure 41(a)(1)(A)(i). Because NXP USA had not yet served an answer or motion for summary judgment, the dismissal was self-effectuating and required no court order. The court issued a confirmation order on September 24, 2025, directing each party to bear its own costs, expenses, and attorney fees. The with-prejudice designation is legally significant: Helix is permanently barred from re-asserting the same claims against NXP USA.

The 126-day duration — ending before NXP even filed a responsive pleading — is consistent with a plaintiff who reconsidered litigation viability early, possibly following pre-answer correspondence, a claim mapping review, or informal licensing discussions that did not result in a public settlement. The public record does not disclose whether any consideration was exchanged. The cost-neutrality order and the absence of a settlement agreement on the docket suggest the parties may have reached a private arrangement, or that Helix concluded the assertion lacked sufficient merit to proceed against NXP’s legal team.

Case at a glance
Case no.7:25-cv-00241
DefendantNXP USA, Inc.
CourtTexas Western
JudgeN/A
FiledMay 21, 2025
ClosedSeptember 24, 2025
Duration126 days
OutcomeVoluntary dismissal
Verdict causeInfringement Action
BasisVoluntary dismissal
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Case timeline

Filing to Voluntary dismissal in 126 days

126 days — resolved before defendant’s answer was due, suggesting early strategic recalibration

Case timeline: Complaint filed MAY 21 2025, JUL–AUG — 126 days total Horizontal timeline showing the three key events in Helix Microinnovations LLC v NXP USA, Inc. from filing to resolution. Source: PACER, Texas Western District Court. MAY 21 2025 Complaint filed Pre-trial proceedings SEP 24 2025 Voluntary dismissal 126 DAYS TOTAL
Dismissal terms

Voluntary dismissal with prejudice: what each party’s position means

Legal mechanism

Rule 41(a)(1)(A)(i): self-effectuating dismissal, no court order needed

Fed. R. Civ. P. 41(a)(1)(A)(i) permits a plaintiff to dismiss an action unilaterally by filing a notice before the defendant serves an answer or a motion for summary judgment. Because NXP USA had not yet done either, Helix’s notice was self-effectuating — the case terminated automatically. The court’s September 24 order was confirmatory, not constitutive. The with-prejudice designation was Helix’s own election, making the dismissal more final than a default voluntary dismissal.

Rule 41(a)(1)(A)(i)
Finality analysis

With prejudice means Helix cannot re-sue NXP USA on these claims

A voluntary dismissal with prejudice operates as an adjudication on the merits under Rule 41(a)(1)(B), permanently extinguishing Helix’s right to re-assert US7238550B2 claims against NXP USA in any federal court. This is the most conclusive outcome short of a full merits ruling. Contrast this with a without-prejudice dismissal, which would allow re-filing. Helix’s election of the with-prejudice form strongly suggests either a private resolution or a strategic decision to permanently concede this particular defendant.

Permanent bar on re-filing
Defendant outcome

NXP USA exits without answering — a strong procedural position

NXP USA avoided the cost and exposure of full litigation without filing an answer, motion to dismiss, or summary judgment motion. Norton Rose Fulbright’s engagement likely created early pressure on Helix’s claim mapping and infringement theory. NXP faces no damages liability, no injunction risk, and no public findings on validity or infringement. The with-prejudice dismissal also eliminates any future re-assertion risk from Helix on US7238550B2, giving NXP clean freedom to operate against this specific patent holder.

No liability, full FTO
Commercial implications

CoB packaging IP remains unlitigated — sector risk persists

The dismissal produces no claim construction ruling, no validity finding, and no infringement determination on US7238550B2. For other semiconductor companies using Chip-on-Board fabrication techniques, the patent’s enforceability remains an open question. Helix retains the right to assert US7238550B2 against other defendants. Companies in the CoB packaging supply chain — substrate manufacturers, OSAT providers, and embedded module makers — should note that this patent is still in force and has been actively asserted.

Patent still enforceable vs. others
Legal analysis based on PACER docket records for case 7:25-cv-00241 and PatSnap Eureka litigation intelligence Search PatSnap Eureka ↗
Parties and representation

Full party and counsel information

RoleNameTypeDetail
PlaintiffHelix Microinnovations LLCCompanySemiconductor IP licensing entity — holder of US7238550B2 covering CoB fabricationSearch in Eureka ↗
DefendantNXP USA, Inc.CompanyNXP USA, Inc. — U.S. subsidiary of NXP Semiconductors, embedded processing and RF ICsSearch in Eureka ↗
Plaintiff counselIsaac RabicoffAttorneyCounsel for Helix Microinnovations LLCSearch in Eureka ↗
Plaintiff law firmRabicoff Law LLCLaw FirmRepresenting Helix Microinnovations LLCSearch in Eureka ↗
Defendant counselEric Conley GreenAttorneyCounsel for NXP USA, Inc.Search in Eureka ↗
Defendant counselRichard S. ZembekAttorneyCounsel for NXP USA, Inc.Search in Eureka ↗
Defendant law firmNorton Rose Fulbright LLPLaw FirmRepresenting NXP USA, Inc.Search in Eureka ↗
Presiding judgeJudge N/AJudgeTexas Western District CourtSearch in Eureka ↗
Official verdict

Official order — verbatim text

“Before the Court is the Plaintiff’s Notice of Voluntary Dismissal With Prejudice (Doc. 15) filed September 23, 2025. In its notice, Plaintiff voluntarily dismisses claims against the Defendant with prejudice under Federal Rule of Civil Procedure 41(a)(1)(A)(i). (Id.). Rule 41(a)(1)(A)(i) allows a plaintiff to voluntarily dismiss an action without a court order by filing a notice of dismissal before the opposing party serves an answer or a motion for summary judgment. Fed. R. Civ. P. 41(a)(1)(A)(i). The Defendant has not served an answer or a motion for summary judgment. Plaintiff’s notice is therefore “self-effectuating and terminates the case in and of itself; no order or other action of the district court is required.” In re Amerijet Int’l, Inc., 785 F.3d 967, 973 (5th Cir. 2015), as revised (May 15, 2015). Each party shall bear its own costs, expenses, and attorney fees. All pending motions, if any, are DENIED as MOOT”
Source: PACER Docket, Case 7:25-cv-00241, Texas Western District Court

The court’s order confirms the dismissal was self-effectuating under Rule 41(a)(1)(A)(i) — no merits determination was made on infringement, validity, or claim scope. The with-prejudice designation was Helix’s unilateral election, not a court-imposed sanction, which distinguishes this outcome from a merits adjudication. The cost-neutrality direction is standard for pre-answer voluntary dismissals. NXP USA’s legal position is fully protected, while Helix permanently surrenders its right to assert these specific claims against this defendant.

PACER case 7:25-cv-00241 · Public docket record Explore in Eureka ↗
Patent at issue

US7238550B2 — Chip-on-Board module fabrication methods and apparatus

Publication No.US7238550B2
Application No.US10/371800
Patent details
ProductMethods and apparatus for fabricating Chip-on-Board semiconductor modules
Cited in actionMay 21, 2025

US7238550B2, filed under application number US10/371800, covers methods and apparatus for fabricating Chip-on-Board modules — a semiconductor packaging technique in which bare dies are directly mounted and wire-bonded onto a substrate or PCB without an intermediate package. CoB technology is widely used in cost-sensitive, high-density applications including LED modules, RFID devices, consumer electronics, and industrial sensors. The patent’s claim language around fabrication methods could potentially reach a broad range of CoB manufacturing processes depending on how the claims are construed.

For the semiconductor and electronics packaging sector, US7238550B2 represents a potentially broad assertion vehicle given the ubiquity of CoB technology across supply chains. NXP USA — whose product portfolio spans microcontrollers, RF transceivers, and automotive-grade ICs — was the target here, but the patent’s commercial reach could extend to OSATs, LED manufacturers, and module integrators. The absence of any claim construction ruling means the patent’s enforceable scope remains undefined by judicial determination, preserving both assertion value for Helix and residual uncertainty for the industry.

Patent data sourced from USPTO via PatSnap Eureka patent database Search patent records in Eureka ↗
Freedom to operate

Should your team run an FTO analysis against US7238550B2?

Any company manufacturing, assembling, or contracting the production of Chip-on-Board modules — including bare-die attach, wire bonding, or encapsulation processes — should evaluate whether their process flows read on US7238550B2’s claims. This is particularly relevant for OSATs, LED module manufacturers, RFID device makers, automotive sensor producers, and electronics companies that source CoB-packaged components. The Helix v. NXP USA action confirms the patent is being actively asserted in U.S. federal court, and the with-prejudice dismissal does not limit risk to other market participants.

PatSnap Eureka’s FTO Search Agent allows R&D and IP teams to map your specific fabrication process steps against US7238550B2’s independent claims, identify prior art that may narrow enforceability, and benchmark against the patent’s prosecution history. Eureka can also surface related patents in Helix’s portfolio and flag similar CoB packaging patents that may present parallel assertion risk — giving your team a complete picture before committing to a new product architecture or manufacturing partnership.

PatSnap Eureka FTO Search

Run a freedom-to-operate analysis on US7238550B2 to assess your product’s exposure

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Related litigation

Similar Chip-on-Board and semiconductor packaging patent cases

Cases involving semiconductor packaging patent assertions by NPEs in the Western District of Texas, with comparable pre-answer dismissal or early resolution patterns.

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Helix Microinnovations LLC patent enforcement history, Texas Western case history, Helix Microinnovations LLC’s full IP portfolio, and comparable case analysis
CoB patent NPE cases W.D. Tex.Rabicoff Law semiconductor filingsNXP USA patent litigation historyPackaging IP pre-answer dismissals
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Strategic implications

What this case signals for the semiconductor packaging IP landscape

A pre-answer dismissal with prejudice in a CoB patent case raises questions about assertion strategy and patent enforceability that practitioners should track.

Pre-answer exit suggests Helix faced early claim mapping challenges

Voluntary dismissal before the defendant files any responsive pleading — particularly with prejudice — is consistent with a plaintiff who encountered difficulties mapping patent claims to the accused products or processes. NXP USA’s retention of Norton Rose Fulbright likely accelerated that recalibration. Competitors facing similar assertions from Helix should scrutinise whether their products genuinely read on US7238550B2’s claim language.

US7238550B2 remains live — other CoB manufacturers face residual risk

The dismissal with prejudice only bars Helix from re-suing NXP USA. The patent itself is valid and enforceable against all other parties. Semiconductor packaging companies, OSATs, and module integrators using Chip-on-Board architectures should conduct a freedom-to-operate review against US7238550B2 and monitor Helix’s filing history for new actions across other defendants.

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Full strategic analysis in PatSnap Eureka
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Rabicoff Law filing patternUS7238550B2 claim scopeCoB patent assertion risk map
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Frequently asked questions

Helix v NXP — key questions answered

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Monitor CoB patent risk before it reaches your product team

US7238550B2 is active and has been asserted in federal court. Run a freedom-to-operate analysis against your Chip-on-Board fabrication processes and set alerts for new Helix Microinnovations filings using PatSnap Eureka.

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