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Helix Microinnovations v. Penguin Solutions — Chip-on-Board Patent Dispute | PatSnap
Patent Litigation

Helix Microinnovations v. Penguin Solutions: Dismissed Without Prejudice in 110 Days

Helix Microinnovations LLC brought a patent infringement action against Penguin Solutions, Inc. in the Delaware District Court, asserting US7238550B2 covering Chip-on-Board module fabrication methods. The case closed without prejudice after just 110 days — before the defendant filed any answer or dispositive motion.

Resolution time
110days
Days from filing to dismissal — resolved before defendant answered
Patents asserted
1
US7238550B2 — Chip-on-Board module fabrication methods and apparatus
Outcome
Dismissed without Prejudice
Dismissed without prejudice — plaintiff retains right to refile the claim
Cost ruling
Not recorded
No costs ruling recorded in the available public docket
Published by PatSnap Insights Team · Verified by PatSnap Eureka Data
Case overview

Early exit: Helix dismisses CoB infringement claim before answer

On 31 December 2025, Helix Microinnovations LLC filed a patent infringement action against Penguin Solutions, Inc. in the Delaware District Court (Case No. 1:25-cv-01581) before Judge Colm F. Connolly. The sole patent asserted was US7238550B2, directed to methods and apparatus for fabricating Chip-on-Board (CoB) modules — a foundational packaging technology used in LED, memory, and embedded computing applications.

The recorded basis of termination is 'Dismissed without Prejudice.' The docket order states that, pursuant to Federal Rule of Civil Procedure 41(a)(1)(A)(i), plaintiff Helix Microinnovations LLC dismissed the action without prejudice, noting that defendant Penguin Solutions had not yet answered the complaint or moved for summary judgment. A Rule 41(a)(1)(A)(i) voluntary dismissal at this pre-answer stage is a matter of right and does not require court approval.

The dismissal arrived just 110 days after filing — an unusually short window that suggests the litigation did not progress to substantive engagement. What drove the decision to withdraw at this early stage, and whether Helix intends to refile or pursue alternative enforcement strategies, is not disclosed in the available public record. Notably, the verdict text references 'Defendant Cree LED, Inc.' rather than Penguin Solutions, Inc., which the public record does not explain.

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Case at a glance
CourtDelaware District Court
JudgeColm F. Connolly
FiledDecember 31, 2025
ClosedApril 20, 2026
Duration110 days
OutcomeDismissed without Prejudice
Verdict causeInfringement Action
BasisDismissed without Prejudice
Prior Art Intelligence
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Case timeline

Filing to Dismissed without Prejudice in 110 days

Days from filing to dismissal — resolved before defendant answered

Case timeline: Complaint filed DEC 31 2025 — 110 days total Horizontal timeline showing the three key events in Helix Microinnovations LLC v Penguin Solutions, Inc. from filing to resolution. Source: PACER, Delaware District Court. DEC 31 2025 Complaint filed Pre-trial proceedings APR 20 2026 Dismissed without Prejudice 110 DAYS TOTAL
Patent at issue

US7238550B2 — Chip-on-Board module fabrication methods and apparatus

Publication No.US7238550B2
Application No.US10/371800
Patent details
ProductMethods and apparatus for fabricating Chip-on-Board modules
Cited in actionDecember 31, 2025
Technical brief · sourced from PatSnap patent database
Patent figurePatent figure
Representative claim (1 of 11 independent)
1. A method of fabricating Chip-on-Board logic modules using selectively settable materials, said method comprising: mounting unpackaged die using a first layer of selectively-settable material; hardening a ring of said first layer of selectively-settable material around a periphery said unpackaged die; covering said first layer of selectively-settable material with a second layer of selectively-settable material; and capturing bonding wires connecting said unpackaged die to a printed circuit board in said second layer of selectively-settable material.
Technical background
RELATED APPLICATIONS The present invention claims the filing date of U.S. Provisional Patent 60/360,036, filed on Feb. 26, 2002, and references the related U.S. patent application Ser. No. 10/371,663, entitled “Improved Patching Methods and Apparatus for Fabricating Memory Modules,” filed Feb. 20, 2003, both of which are herein incorporated by this reference. TECHNICAL FIELD Selected embodiments of the present invention relate to electronic logic modules that use unpackaged die. More specifically, embodiments of th…
Patent family
4 family members across 2 jurisdictions (US, WO)
PatSnap Eureka · FTO Search Agent
Should your team run an FTO against US7238550B2?

Any organisation designing or manufacturing Chip-on-Board assemblies — including LED module makers, PCB assembly houses, embedded computing OEMs, and their contract manufacturers — should consider whether their fabrication methods fall within the claims of US7238550B2. The without-prejudice dismissal means the patent remains enforceable and Helix retains full rights to assert it against any market participant.

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Official verdict

Official order — verbatim text

Pursuant to Federal Rule of Civil Procedure 41(a)(1)(A)(i), Plaintiff Helix Microinnovations LLC hereby dismisses this action without prejudice. Defendant Cree LED, Inc. has not yet answered the Complaint or moved for summary judgment.
Source: PACER Docket, Case 1:25-cv-01581, Delaware District Court

The dismissal order invokes Rule 41(a)(1)(A)(i) and confirms the pre-answer procedural posture, meaning no merits were contested or resolved. Notably, the order names 'Defendant Cree LED, Inc.' rather than Penguin Solutions, Inc. — a discrepancy that the available public record does not explain. No finding was made on infringement, validity, or enforceability of US7238550B2.

PACER case 1:25-cv-01581 · Public docket record Explore in Eureka ↗
Dismissal terms

Dismissed without prejudice: what the voluntary exit means for both parties

Legal mechanism

Rule 41(a)(1)(A)(i): a dismissal as of right, no court approval needed

Under Federal Rule of Civil Procedure 41(a)(1)(A)(i), a plaintiff may voluntarily dismiss an action without prejudice before the defendant has served an answer or a motion for summary judgment. No court order is required. The docket confirms that Penguin Solutions had not yet answered, making this an automatic right of dismissal — the court had no discretion to deny it.

Pre-answer voluntary dismissal
Dismissal effect

Without prejudice: the door to refiling remains open

A dismissal without prejudice does not adjudicate the merits. Helix Microinnovations retains the right to refile the same infringement claims, subject to applicable statutes of limitations and any procedural constraints. No judgment was entered against either party, and no finding was made regarding the validity, enforceability, or infringement of US7238550B2. The specific reasons for withdrawal are not disclosed in the available record.

Merits not adjudicated
Defendant outcome

Penguin Solutions exits without a merits ruling — but exposure persists

Penguin Solutions, Inc. is released from this proceeding without any adverse judgment. However, because the dismissal is without prejudice, it does not confer the protection of res judicata. Helix could refile against Penguin Solutions or related entities in the same or a different venue. The defendant has obtained no declaratory judgment on non-infringement or invalidity from this proceeding.

No res judicata protection
Commercial implications

CoB module patent remains live — sector should monitor Helix's next move

US7238550B2 remains in force as an issued patent. Companies designing, manufacturing, or distributing Chip-on-Board modules — including those active in LED packaging, embedded computing, and memory modules — should monitor Helix Microinnovations' enforcement activity. A without-prejudice dismissal against one defendant is consistent with a portfolio enforcement strategy that may target additional players in the supply chain.

Patent remains enforceable
Legal analysis based on PACER docket records for case 1:25-cv-01581 and PatSnap Eureka litigation intelligence Search PatSnap Eureka ↗
Parties and representation

Full party and counsel information

RoleNameTypeDetail
PlaintiffHelix Microinnovations LLCCompany/Search in Eureka ↗
DefendantPenguin Solutions, Inc.Company/Search in Eureka ↗
Plaintiff counselBrian E. LutnessAttorneyCounsel for Helix Microinnovations LLCSearch in Eureka ↗
Plaintiff law firmSilverman, McDonald & FriedmanLaw FirmRepresenting Helix Microinnovations LLCSearch in Eureka ↗
Defendant counselDaniel Marcus AttawayAttorneyCounsel for Penguin Solutions, Inc.Search in Eureka ↗
Defendant law firmWomble Bond Dickinson (US) LLPLaw FirmRepresenting Penguin Solutions, Inc.Search in Eureka ↗
Presiding judgeJudge Colm F. ConnollyJudgeDelaware District CourtSearch in Eureka ↗
R&D signals

R&D signals in the Chip-on-Board packaging IP space

Forward-looking patent and innovation intelligence derived from Helix Microinnovations' assertion of US7238550B2 against Penguin Solutions in the CoB module technology domain.

Patent portfolio

Helix Microinnovations' CoB and semiconductor packaging filings

Helix Microinnovations' assertion of US7238550B2 suggests an active enforcement posture around CoB fabrication IP. Mapping their broader portfolio can reveal adjacent claim coverage in substrate attachment, thermal management, and die bonding — useful intelligence for any company in the CoB supply chain assessing litigation exposure.

Portfolio mapping
Technology landscape

Patent filing trends in Chip-on-Board module fabrication

CoB technology continues to evolve in LED, automotive lighting, and embedded computing applications. Tracking recent patent filings in CoB fabrication methods — including die attach, wire bonding, encapsulation, and substrate integration — can surface competitors building IP positions that may intersect with or design around US7238550B2.

Filing trends
Defendant IP posture

Penguin Solutions' IP position in advanced packaging and computing

Penguin Solutions operates in high-performance computing and advanced hardware solutions. Reviewing their patent filings and licensing activity in board-level packaging and module assembly can clarify whether they hold defensive IP relevant to CoB fabrication claims — and how they might respond to any refiled action.

Defensive IP review
White space

Design-around and adjacent opportunities near US7238550B2

US7238550B2's claim scope in CoB fabrication methods may leave adjacent white space in areas such as flip-chip CoB, wafer-level packaging, and additive manufacturing-based board assembly. R&D teams seeking design-around strategies or new filing opportunities should map claim boundaries against emerging fabrication techniques in these adjacent domains.

Design-around opportunity
Related litigation

Similar Chip-on-Board and semiconductor packaging patent cases

Explore patent infringement cases in semiconductor packaging and CoB module technology litigated in Delaware and comparable federal district courts.

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Helix Microinnovations LLC patent enforcement history, Delaware District Court case history, Helix Microinnovations LLC's full IP portfolio, and comparable case analysis
CoB module patent casesLED packaging disputesHelix Microinnovations filingsDelaware semiconductor IP cases
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Strategic implications

What this case signals for the Chip-on-Board IP landscape

A pre-answer dismissal without prejudice rarely signals the end of an enforcement campaign — it more often signals a reset.

Early dismissal preserves plaintiff's optionality — watch for refilings

A Rule 41(a)(1)(A)(i) dismissal before answer is a low-cost reset. Helix Microinnovations retains full ability to refile against Penguin Solutions or expand to other CoB module manufacturers. Companies in this supply chain should treat this as a signal, not a resolution.

CoB module fabrication patents are a live enforcement vector in Delaware

The Delaware District Court remains a preferred venue for patent assertion. US7238550B2 covers foundational CoB fabrication methods relevant to LED, memory, and embedded computing — a broad enough claim scope to implicate multiple product lines and multiple potential defendants.

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Full strategic analysis in PatSnap Eureka
Unlock enforcement pattern analysis and FTO risk signals for the Chip-on-Board sector from this Delaware District Court case.
Refilings & venue riskCoB supply chain exposureHelix portfolio strategy
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Frequently asked questions

Helix v Penguin — key questions answered

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Track Helix Microinnovations and protect your CoB product line

This without-prejudice dismissal leaves US7238550B2 fully enforceable. Run a targeted FTO on your Chip-on-Board fabrication workflows and set litigation alerts on Helix Microinnovations to catch any refiling before it reaches your legal team.

Disclaimer

This page is compiled from public court dockets and third-party patent and litigation data via PatSnap Eureka, and is provided for general informational purposes only. The information shown — including party names, patent and application numbers, dates, case status, outcomes, and any analysis — may be incomplete, may not reflect the most recent filings or legal status, and may contain errors or omissions. Verify all details against official court records (for example, PACER) and the relevant patent office before relying on them.

Nothing on this page constitutes legal advice or a legal opinion on the validity, infringement, enforceability, or scope of any patent or case, and no attorney‑client relationship is created by its use. Any description of an outcome (such as a dismissal, settlement, or consent judgment) is a general summary, not a legal determination. All patents, trademarks, and company or law‑firm names are the property of their respective owners. PatSnap makes no warranty as to the accuracy or completeness of this content and disclaims, to the fullest extent permitted by law, all liability for reliance on it. For advice on a specific matter, consult qualified legal counsel.

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