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Imberatek v. Apple: 9-Patent SoC Packaging Suit Settled | PatSnap
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Case ID3:25-cv-02206
FiledMar 2025
ClosedMay 2025
Patent Litigation

Imberatek LLC v. Apple Inc. — 9-Patent SoC Packaging Dispute Settled in 63 Days

Imberatek LLC, a patent-assertion entity, filed suit against Apple in the Northern District of California asserting nine patents covering semiconductor device packaging technology across Apple’s entire A-series and M-series SoC portfolio. The case resolved by confidential settlement and was dismissed with prejudice in just 63 days — an unusually compressed timeline for multi-patent litigation of this technical scope.

Resolution time
63days
63 days — well below the multi-year median for N.D. Cal. multi-patent cases; suggests pre-filing settlement dialogue or rapid commercial resolution
Patents asserted
9
US11071207B2 and 8 further patents asserted — semiconductor device packaging, SoC stacking, and interconnect architecture
Outcome
Dismissed with Prejudice
Dismissed with prejudice by court order following joint announcement of settlement; each party bears its own fees and costs
Cost ruling
Each Party Pays
Court ordered all attorneys’ fees, costs, and expenses borne by each party incurring the same — no fee-shifting awarded
Published by PatSnap Insights Team · Verified by PatSnap Eureka Data
Case overview

Rapid settlement ends broad semiconductor packaging assault on Apple

Filed on 4 March 2025 before Judge Richard Seeborg in the Northern District of California, Imberatek LLC’s complaint targeted virtually every Apple A-series chip (A12 through A17 Pro) and M-series processor (M1 through M3 Max), spanning iPhones, iPads, MacBooks, Mac Studios, Mac Pros, and Vision Pro. The nine asserted patents — including US11071207B2, US7732909B2, US8368201B2, US7989944B2, US9107324B2, US8238113B2, US8222723B2, US7609527B2, and US11716816B2 — collectively cover semiconductor device packaging architectures involving stacked components, insulating layers, and conductive interconnects.

On 6 May 2025, just 63 days after filing, the parties jointly announced to the court that they had reached a settlement. Judge Seeborg entered an order dismissing all claims with prejudice, with each side bearing its own attorneys’ fees, costs, and expenses. A dismissal with prejudice is a final adjudication on the merits: Imberatek is permanently barred from reasserting the same claims against Apple on the same patents, and Apple receives no ongoing judicial protection beyond that preclusion.

A 63-day resolution is notably swift for a nine-patent, multi-product infringement action in N.D. California, where discovery alone typically takes far longer to commence. The speed suggests either pre-filing settlement negotiations were already advanced, or Apple moved rapidly toward a commercial resolution rather than engaging in costly claim-construction litigation across nine patents and dozens of SoC generations. The financial terms of any settlement remain confidential and are not reflected in the public record.

Case at a glance
Case no.3:25-cv-02206
CourtCalifornia Northern
JudgeRichard Seeborg
FiledMarch 4, 2025
ClosedMay 6, 2025
Duration63 days
OutcomeDismissed with Prejudice
Verdict causeInfringement Action
BasisDismissed with Prejudice
Prior Art Intelligence
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Case data sourced from PACER / California Northern District Court via PatSnap Eureka Litigation Intelligence Explore similar cases ↗
Case timeline

Filing to Dismissed with Prejudice in 63 days

63 days — well below the multi-year median for N.D. Cal. multi-patent cases; suggests pre-filing settlement dialogue or rapid commercial resolution

Case timeline: Complaint filed MAR 4 2025, APR–MAY — 63 days total Horizontal timeline showing the three key events in Imberatek, LLC v Apple Computer, Inc. from filing to resolution. Source: PACER, California Northern District Court. MAR 4 2025 Complaint filed Pre-trial proceedings MAY 6 2025 Dismissed with Prejudice 63 DAYS TOTAL
Dismissal terms

Dismissed with prejudice: what the settlement order means for both parties

Legal mechanism

Dismissal with prejudice forecloses future suit on these patents

A dismissal with prejudice, entered pursuant to the parties’ settlement announcement, operates as a final judgment on the merits. Imberatek cannot refile the same infringement claims against Apple on any of the nine asserted patents. This is the strongest form of claim closure available short of a full trial verdict, and it is typically the outcome Apple’s counsel would have required before agreeing to settle.

Res judicata applies
Plaintiff outcome

Imberatek obtains confidential value — then surrenders its litigation position

By accepting a with-prejudice dismissal, Imberatek has permanently relinquished its right to pursue Apple on these nine patents. PAEs typically accept this structure only when compensated — suggesting a licensing payment or other consideration was exchanged, though no financial terms appear in the public record. Imberatek retains the patents and may assert them against other parties in the semiconductor packaging space.

Terms undisclosed
Defendant outcome

Apple secures claim closure across its entire SoC portfolio

Apple’s A-series and M-series chips — the engines of its entire hardware lineup — are effectively cleared from this specific patent threat. The with-prejudice structure means Imberatek cannot repackage these claims in a future action. Apple’s legal team at Fish & Richardson secured this closure without any fee-shifting, and the case did not proceed to claim construction, preserving Apple’s strategic positions on these packaging technologies.

Full portfolio cleared
Commercial implications

Nine semiconductor packaging patents remain live against the broader market

Imberatek’s portfolio — covering stacked semiconductor packaging, insulating layers, and conductive interconnects — is still enforceable against other chipmakers and device manufacturers. Companies relying on similar SoC-in-package or 3D-stacking architectures (including Qualcomm, MediaTek, Samsung, and others) should treat this case as an early signal of Imberatek’s enforcement posture. The 63-day settlement timeline suggests the patents are commercially viable licensing assets.

Portfolio still active
Legal analysis based on PACER docket records for case 3:25-cv-02206 and PatSnap Eureka litigation intelligence Search PatSnap Eureka ↗
Parties and representation

Full party and counsel information

RoleNameTypeDetail
PlaintiffImberatek, LLCCompanyPatent-assertion entity — holder of 9 semiconductor packaging patents including US11071207B2Search in Eureka ↗
DefendantApple Computer, Inc.CompanyApple Inc. — designer of A-series and M-series SoCs used across iPhone, iPad, and Mac product linesSearch in Eureka ↗
Plaintiff counselAlan M. GrimaldiAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselBrett Aaron MangrumAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselClark S. BakewellAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselCliff Allan MaierAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselCourtney M. KrawiceAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselJames A. Fussell , IIIAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselJulia HainesAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselJulia Leslie HainesAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselMark D. SiegmundAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselMichelle N. WebsterAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff counselReginald R. GoekeAttorneyCounsel for Imberatek, LLCSearch in Eureka ↗
Plaintiff law firmEtheridge Law Group PLLCLaw FirmRepresenting Imberatek, LLCSearch in Eureka ↗
Plaintiff law firmLaw Firm of Walt Fair PLLCLaw FirmRepresenting Imberatek, LLCSearch in Eureka ↗
Plaintiff law firmMayer Brown LLPLaw FirmRepresenting Imberatek, LLCSearch in Eureka ↗
Defendant counselAndrew Gordon PearsonAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselFrancis J. AlbertAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselJoy B. KeteAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselJoy Backer KeteAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselKathryn A. QuisenberryAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselRobert Pierce EarleAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselRoger Alen DenningAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselRoger Allen DenningAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselSeth M. SproulAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselSeth McCarthy SproulAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselStephen BurbankAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselSteven J. WingardAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant counselTyler TrainAttorneyCounsel for Apple Computer, Inc.Search in Eureka ↗
Defendant law firmFish & Richardson – San DiegoLaw FirmRepresenting Apple Computer, Inc.Search in Eureka ↗
Defendant law firmFish & Richardson, PCLaw FirmRepresenting Apple Computer, Inc.Search in Eureka ↗
Defendant law firmScott Douglass & McConnico LLPLaw FirmRepresenting Apple Computer, Inc.Search in Eureka ↗
Presiding judgeJudge Richard SeeborgJudgeCalifornia Northern District CourtSearch in Eureka ↗
Official verdict

Official order — verbatim text

“On this day, Plaintiff IMBERATEK LLC and Defendant APPLE INC. announced to the Court that they have settled their respective claims for relief asserted in this action. The Court, having considered this request, is of the opinion that their dismissal should be granted. IT IS THEREFORE ORDERED that all claims for relief asserted herein are dismissed, with prejudice; and IT IS FURTHER ORDERED that all attorneys’ fees, costs of court, and expenses shall be borne by each party incurring the same.”
Source: PACER Docket, Case 3:25-cv-02206, California Northern District Court

The court’s order adopts the precise language of the parties’ joint announcement: all claims for relief are dismissed with prejudice, with fee allocation explicitly symmetric — each party bears its own costs. The with-prejudice formulation is legally significant: it operates as a final adjudication, triggering res judicata and preventing Imberatek from relitigating the same patent claims against Apple. The absence of fee-shifting indicates neither party sought nor obtained an ‘exceptional case’ designation under 35 U.S.C. § 285. No royalty rate, license term, or monetary consideration appears in the public record.

PACER case 3:25-cv-02206 · Public docket record Explore in Eureka ↗
Patent at issue

US11071207B2 — semiconductor device packaging and SoC stacking architecture

Publication No.US11071207B2
Application No.US17/005527
Patent details
Productsemiconductor device package with stacked components and insulating layers
Cited in actionMarch 4, 2025

Publication No.US7732909B2
Application No.US11/797609
Patent details
Productstacked semiconductor chip package with conductive interconnects
Cited in actionMarch 4, 2025

Publication No.US8368201B2
Application No.US13/185165
Patent details
Productmulti-layer semiconductor package with insulating and conductive materials
Cited in actionMarch 4, 2025

Publication No.US7989944B2
Application No.US11/878557
Patent details
Productsemiconductor chip packaging with integrated circuit interconnection
Cited in actionMarch 4, 2025

Publication No.US9107324B2
Application No.US14/231758
Patent details
Productstacked semiconductor package with substrate integration
Cited in actionMarch 4, 2025

Publication No.US8238113B2
Application No.US12/842052
Patent details
Productmulti-chip module packaging with insulating layer architecture
Cited in actionMarch 4, 2025

Publication No.US8222723B2
Application No.US12/699628
Patent details
Productsemiconductor package with stacked die and conductive bonding
Cited in actionMarch 4, 2025

Publication No.US7609527B2
Application No.US11/907795
Patent details
Productsemiconductor device package with chip-on-chip stacking
Cited in actionMarch 4, 2025

Publication No.US11716816B2
Application No.US17/364593
Patent details
Productadvanced semiconductor packaging with vertical interconnect structures
Cited in actionMarch 4, 2025

The nine asserted patents — spanning application dates from the mid-2000s through the early 2020s — collectively protect architectures for semiconductor device packages in which multiple semiconductor components are arranged vertically, separated by insulating materials, and connected by conductive pathways. US11071207B2 and US11716816B2 represent the most recently issued patents in the portfolio, suggesting continued prosecution activity to capture evolving chip packaging methods. The technical domain — heterogeneous integration and 3D stacking — is central to how modern SoCs achieve performance-per-watt efficiency.

Advanced packaging is no longer a manufacturing afterthought: it is a primary competitive differentiator for Apple Silicon, Qualcomm Snapdragon, and comparable platforms. Patents in this space carry meaningful licensing leverage because the underlying architectures are deeply embedded in foundry-level production processes, making design-arounds technically and commercially costly. Imberatek’s portfolio, which tracks the progression from early chip-stacking methods (US7609527B2, filed 2007) to current-generation integration (US11071207B2, filed 2020), is structured to cover incremental improvements across chip generations — a classic portfolio-bracketing strategy.

Patent data sourced from USPTO via PatSnap Eureka patent database Search patent records in Eureka ↗
Freedom to operate

Should you run an FTO against US11071207B2 and Imberatek’s packaging portfolio?

Any company designing, manufacturing, or importing products incorporating stacked SoC packaging — including 3D-integrated chiplets, package-on-package (PoP) designs, or heterogeneous integration modules — should treat Imberatek’s nine-patent portfolio as an active enforcement risk. The claims cover semiconductor components arranged on top of each other with insulating materials between them and conductive connections, language broad enough to implicate widely used advanced packaging formats across mobile, PC, and datacenter chip categories.

PatSnap Eureka’s FTO Search Agent can map each of the nine Imberatek patents against your product’s packaging architecture, identify claim elements most likely to read on your specific implementation, and surface prior art or design-around pathways. Given that Imberatek has already demonstrated willingness to assert these patents against the world’s largest chipmaker — and resolved that action with apparent commercial success — proactive FTO analysis is the lower-cost alternative to reactive litigation defence.

PatSnap Eureka FTO Search

Run a freedom-to-operate analysis on US11071207B2 to assess your product’s exposure

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Related litigation

Similar semiconductor packaging patent cases in N.D. California

Patent infringement actions asserting semiconductor device packaging and SoC stacking claims against chip OEMs in the Northern District of California.

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Strategic implications

What this case signals for the semiconductor packaging IP landscape

A nine-patent broadside against Apple’s entire SoC lineup — resolved in 63 days — sends clear signals to chipmakers and device OEMs about Imberatek’s enforcement strategy.

63-day resolution suggests pre-filing leverage, not litigation attrition

When a multi-patent case against a defendant of Apple’s litigation resources closes in 63 days, it typically signals one of two dynamics: pre-filing licensing dialogue that was close to resolution, or a portfolio with genuine claim-construction risk that Apple preferred to monetize quietly. Either way, Imberatek appears to have extracted value efficiently — a model other PAEs in the semiconductor packaging space are likely to study.

Nine-patent breadth signals portfolio licensing posture, not targeted enforcement

Asserting nine patents across A12 through M3 Max — covering essentially every Apple silicon product of the past six years — is consistent with a licensing-first strategy designed to maximise royalty base. The asserted patents span multiple application numbers and issuance dates, suggesting Imberatek has deliberately assembled a portfolio that tracks the evolution of advanced chip packaging. Companies with similar SoC stacking architectures should audit their exposure now.

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Frequently asked questions

Imberatek v Apple — key questions answered

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Monitor semiconductor packaging patent risk before demand letters arrive

Imberatek’s nine-patent portfolio remains active against any manufacturer using stacked SoC packaging. PatSnap Eureka can run a targeted FTO analysis and monitor new assertions across the semiconductor packaging IP landscape.

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