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LED Wafer Solutions v. Samsung Electronics | Patent Lawsuit 4:22-cv-04809

LED Wafer Solutions, LLC v. Samsung Electronics Co., Ltd.

4:22-cv-04809 N.D. Cal. Closed 3 patents
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Infringement action filed 22 Aug 2022 in the United States District Court for the Northern District of California and closed 24 Jun 2026, with 3 patents asserted. Recorded basis of termination: case dismissed.

Case recordPatsnap Litigation Data·

Case record

Case no.
4:22-cv-04809
Verdict cause
Infringement action
Court
N.D. Cal.
Court level
District Court
Case region
California
Chief judge
None recorded
Trial level
First instance
Filed – Closed
22 Aug 2022 – 24 Jun 2026
Duration
1402 days
Basis of termination
Case Dismissed
Products & marks
Light emitting diode package and method of manufacture
Source: Patsnap Litigation Data. Case 4:22-cv-04809, United States District Court for the Northern District of California. Open this record in Eureka
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Patent at issue
US9786822B2 Active App. US14/570449

Light emitting diode package and method of manufacture

A light emitting diode (LED) device and packaging for same is disclosed. In some aspects, the LED is manufactured using a vertical configuration including a plurality of layers. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids design problems, including manufacturing complexities, costs and heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate or wafer stacked over a semiconductor LED and positioned using one or more alignment markers.

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Patent standing
Legal status
Active
Granted
10 Oct 2017
Earliest priority
6 Mar 2011
Est. expiry
6 Aug 2032
Validity challenges
2 on record90015130 · EPR · filed by SAMSUNG ELECTRONICS CO., LTDIPR2021-01526 · Other · filed by SAMSUNG ELECTRONICS CO., LTD.
Licences recorded
None recorded
Classification
H01L33/50H01L33/64H01L33/62H01L33/00H01L33/56H01L33/44H01L33/40H01L33/52H01L33/58H01L33/32H01L33/60H10P95/00
Prosecution counsel
Intrinsic Law Corp.
Examiner
FEENEY, BRETT
US9786822B2 patent drawing, figure 1
Fig. 1
US9786822B2 patent drawing, figure 2
Fig. 2
US8952405B2 Active App. US13/413293

Light emitting diode package and method of manufacture

A light emitting diode (LED) device and packaging for same is disclosed. In some aspects, the LED is manufactured using a vertical configuration including a plurality of layers. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids design problems, including manufacturing complexities, costs and heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate or wafer stacked over a semiconductor LED and positioned using one or more alignment markers.

Read claims and description in Eureka
Patent standing
Legal status
Active
Granted
10 Feb 2015
Earliest priority
6 Mar 2011
Est. expiry
6 Mar 2032
Validity challenges
5 on recordIPR2021-01491 · filed by Samsung Electronics Co., Ltd90015156 · EPR · filed by PAUL HASTINGS LLP90015090 · EPR90015155 · EPR · filed by PAUL HASTINGS LLPIPR2021-01479 · Other · filed by Seoul Semiconductor, Co. Ltd.
Licences recorded
None recorded
Classification
H01L33/00H01L21/00H01L33/50H01L33/52H01L33/58H01L33/60H10P95/00
Prosecution counsel
Intrinsic Law Corp.
Examiner
WILCZEWSKI, MARY
US8952405B2 patent drawing, figure 1
Fig. 1
US8952405B2 patent drawing, figure 2
Fig. 2

Also asserted in this case

1 more

The docket lists 3 asserted patents. Full bibliographic detail, drawings and prosecution history for the remaining asserted patent are one query away in Eureka.

Source: Patsnap patent data + case record. Bibliographic fields and drawings reproduced from the published patent document. Break down the claims
Parties & counsel

Parties of record

Plaintiff

LED Wafer Solutions, LLC

Core tech
H01L33/50H01L33/64H01L33/62H01L33/00
Counsel
Anita Liu · Bradley David Liddle · Charles Wizenfeld · Daniel L. Schmid · Edgar Leon Carter · Enoch H Liang · Eric Maurer · Erick Scott Robinson · Howard Lithaw Lim · Jon A. Birmingham · Jordan T. Bergsten · Joshua J. Bennett · Karen J. Wang · Mark S. Raskin · Michael Amberg · Michael C. Pomeroy · Nathan I. Cox · Robert A. Whitman · Ryan D. Dykal · Ryan David Dykal · Scott W. Breedlove · Theresa M. Dawson · Yiren Yu
Firm
Boies, Schiller & Flexner LLP, Carter Arnett Bennett & Perez PLLC, Carter Arnett PLLC, Cherry Johnson Siegmund James PC, Fitch, Even, Tabin & Flannery LLP, King & Wood LLP, King & Wood Mallesons LLP, Skiermont Derby LLP
Defendant

Samsung Electronics Co., Ltd.

Core tech
Not recorded
Counsel
Alexander Landyshev · Alexandra E. Kochian · Austin Michael Schnell · Benjamin Norenberg Luehrs · Brian Christopher Nash · Cosmin Maier · David J Cho · Frederick J. Ding · Gillian Moore · John M. Desmarais · Jordan Owens · Michael E. Jones · Patrick W Reilly · Paul A. Bondor · Robert Blake Dunteman · Shaun William Hassett · Taeg Sang Cho · Yung-Hoon Ha
Firm
Desmarais LLP, McGuireWoods LLP, Morrison & Foerster LLP, Potter Minton PC

Counsel of record

AttorneyForRole
Anita LiuLED Wafer Solutions, LLCPlaintiff
Bradley David LiddleLED Wafer Solutions, LLCPlaintiff
Charles WizenfeldLED Wafer Solutions, LLCPlaintiff
Daniel L. SchmidLED Wafer Solutions, LLCPlaintiff
Edgar Leon CarterLED Wafer Solutions, LLCPlaintiff
Enoch H LiangLED Wafer Solutions, LLCPlaintiff
Eric MaurerLED Wafer Solutions, LLCPlaintiff
Erick Scott RobinsonLED Wafer Solutions, LLCPlaintiff
Howard Lithaw LimLED Wafer Solutions, LLCPlaintiff
Jon A. BirminghamLED Wafer Solutions, LLCPlaintiff
Jordan T. BergstenLED Wafer Solutions, LLCPlaintiff
Joshua J. BennettLED Wafer Solutions, LLCPlaintiff
Karen J. WangLED Wafer Solutions, LLCPlaintiff
Mark S. RaskinLED Wafer Solutions, LLCPlaintiff
Michael AmbergLED Wafer Solutions, LLCPlaintiff
Michael C. PomeroyLED Wafer Solutions, LLCPlaintiff
Nathan I. CoxLED Wafer Solutions, LLCPlaintiff
Robert A. WhitmanLED Wafer Solutions, LLCPlaintiff
Ryan D. DykalLED Wafer Solutions, LLCPlaintiff
Ryan David DykalLED Wafer Solutions, LLCPlaintiff
Scott W. BreedloveLED Wafer Solutions, LLCPlaintiff
Theresa M. DawsonLED Wafer Solutions, LLCPlaintiff
Yiren YuLED Wafer Solutions, LLCPlaintiff
Alexander LandyshevSamsung Electronics Co., Ltd.Defendant
Alexandra E. KochianSamsung Electronics Co., Ltd.Defendant
Austin Michael SchnellSamsung Electronics Co., Ltd.Defendant
Benjamin Norenberg LuehrsSamsung Electronics Co., Ltd.Defendant
Brian Christopher NashSamsung Electronics Co., Ltd.Defendant
Cosmin MaierSamsung Electronics Co., Ltd.Defendant
David J ChoSamsung Electronics Co., Ltd.Defendant
Frederick J. DingSamsung Electronics Co., Ltd.Defendant
Gillian MooreSamsung Electronics Co., Ltd.Defendant
John M. DesmaraisSamsung Electronics Co., Ltd.Defendant
Jordan OwensSamsung Electronics Co., Ltd.Defendant
Michael E. JonesSamsung Electronics Co., Ltd.Defendant
Patrick W ReillySamsung Electronics Co., Ltd.Defendant
Paul A. BondorSamsung Electronics Co., Ltd.Defendant
Robert Blake DuntemanSamsung Electronics Co., Ltd.Defendant
Shaun William HassettSamsung Electronics Co., Ltd.Defendant
Taeg Sang ChoSamsung Electronics Co., Ltd.Defendant
Yung-Hoon HaSamsung Electronics Co., Ltd.Defendant
Source: case record + Patsnap company data. Attorney names appear as recorded in the docket. Compare both portfolios
Outcome

Basis of termination

From the record · verbatim

“For the foregoing reasons, the Court GRANTS Samsung’s and Seoul Semiconductor’s respective partial motions to dismiss. The Court DISMISSES LED Wafer’s claims of willful infringement as to the ’137 patent, the ’405 patent, and ’822 patent against Samsung and Seoul Semiconductor, with prejudice and without leave to amend. The Court DISMISSES LED Wafer’s claims of induced infringement and contributory infringement as to the ’137 patent, the ’405 patent, and ’822 patent against Samsung and Seoul Semiconductor, with prejudice and without leave to amend. The Court GRANTS LED Wafer’s voluntary motion to dismiss. Given the lack of legal prejudice to Defendants, the Court DISMISSES LED Wafer’s remaining claims on the ’405 patent and ’822 patent without prejudice in accordance with LED Wafer’s voluntary dismissal. Also in accordance with LED Wafer’s voluntary dismissal, all claims on the ’137 patent are dismissed with prejudice to re-filing against Samsung on currently released products. The Court declines to exercise jurisdiction over Samsung’s counterclaims for declaratory relief arising from the same patents and DISMISSES the counterclaims as well.”

Case 4:22-cv-04809 · N.D. Cal. · closed 24 June 2026
Source: case record, verbatim. The quoted paragraph is the basis-of-termination text as filed.

Related cases

Three questions this record usually leads to. Each one runs against the full litigation and patent corpus, and cites what it finds.

FAQ

Frequently asked questions

What is case 4:22-cv-04809?

4:22-cv-04809 is a patent infringement action brought by LED Wafer Solutions, LLC against Samsung Electronics Co., Ltd., filed on 22 Aug 2022 in the United States District Court for the Northern District of California. The case closed on 24 June 2026.

Which patents were asserted in 4:22-cv-04809?

US9786822B2 (“Light emitting diode package and method of manufacture”), assigned to LED WAFER SOLUTIONS LLC, currently active; US8952405B2 (“Light emitting diode package and method of manufacture”), assigned to LED WAFER SOLUTIONS LLC, currently active; US8941137B2 (“Light emitting diode package and method of manufacture”), assigned to LED WAFER SOLUTIONS LLC. The record also lists Light emitting diode package and method of manufacture.

How was case 4:22-cv-04809 terminated?

The recorded basis of termination is case dismissed. The termination text reads: “For the foregoing reasons, the Court GRANTS Samsung’s and Seoul Semiconductor’s respective partial motions to dismiss. The Court DISMISSES LED Wafer’s claims of willful infringement as to the ’137 patent, the ’405 patent, and ’822 patent against Samsung and Seoul Semiconductor, with prejudice and without leave to amend. The Court DISMISSES LED Wafer’s claims of induced infringement and contributory infringement as to the ’137 patent, the ’405 patent, and ’822 patent against Samsung and Seoul Semiconductor, with prejudice and without leave to amend. The Court GRANTS LED Wafer’s voluntary motio

What does dismissal with prejudice mean?

A dismissal with prejudice permanently ends the claims that were filed, so the same claims cannot be brought again against that defendant. It is the usual form when the parties have settled.

How long did case 4:22-cv-04809 take?

1402 calendar days, from filing on 22 Aug 2022 to closure on 24 June 2026.

Who were the attorneys and the judge in 4:22-cv-04809?

Anita Liu, Bradley David Liddle, Charles Wizenfeld, Daniel L. Schmid, Edgar Leon Carter, Enoch H Liang, Eric Maurer, Erick Scott Robinson, Howard Lithaw Lim, Jon A. Birmingham, Jordan T. Bergsten, Joshua J. Bennett, Karen J. Wang, Mark S. Raskin, Michael Amberg, Michael C. Pomeroy, Nathan I. Cox, Robert A. Whitman, Ryan D. Dykal, Ryan David Dykal, Scott W. Breedlove, Theresa M. Dawson and Yiren Yu are recorded as counsel for plaintiff LED Wafer Solutions. Alexander Landyshev, Alexandra E. Kochian, Austin Michael Schnell, Benjamin Norenberg Luehrs, Brian Christopher Nash, Cosmin Maier, David J Cho, Frederick J. Ding, Gillian Moore, John M. Desmarais, Jordan Owens, Michael E. Jones, Patrick W Reilly, Paul A. Bondor, Robert Blake Dunteman, Shaun William Hassett, Taeg Sang Cho and Yung-Hoon Ha appear for defendant Samsung Electronics.

Answers reproduce fields from the case record for 4:22-cv-04809 and do not constitute legal advice. Ask your own question

Disclaimer. This page reproduces publicly available court docket data for case 4:22-cv-04809 and is provided for general information and reference only. It is not legal advice and must not be relied upon as such.

Docket data has limits. Records are drawn from a snapshot and may lag the live docket. Sealed filings, amended complaints, counterclaims and post-closure motions may not be reflected. Party names, attorney names and firm affiliations are reproduced as recorded and may contain omissions. Where a field is absent from the record, this page marks it as not recorded rather than inferring a value.

No characterisation of the parties or the outcome. This page reports what the record contains. Nothing here should be read as an assertion that any party infringed, that any patent is valid or invalid, that any settlement occurred, or that any party prevailed.

No FTO or validity opinion. Nothing on this page constitutes a freedom-to-operate, novelty, validity or infringement opinion. Any decision touching a live patent dispute should be verified independently and reviewed with qualified patent counsel.

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