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Low-Loss Dielectric Materials for 5G/6G — PatSnap Eureka

Low-Loss Dielectric Materials for 5G/6G — PatSnap Eureka
Materials Intelligence · 2026

Low-Loss Dielectric Materials for 5G/6G Millimeter-Wave Applications

A structured 2026 landscape of polymer, ceramic, porous inorganic, and liquid crystal dielectric platforms enabling mmWave and sub-THz communication — with measured benchmarks, active patents, and leading institutional contributors drawn from 20+ sources.

Dielectric Constant (εr) by Material Family: Porous Silica 1.018, Ultra-Porous Alumina 1.2, Toray PI 2.7, Conventional PI 3.0–4.0, Indialite Glass-Ceramic 4.7, Murata LTCC 8.8 Horizontal bar chart comparing dielectric constant (εr) across six key material families for 5G/6G mmWave substrates. Porous silica foam achieves the lowest εr of 1.018 at 300 GHz, approaching free-space permittivity. Data sourced from patent and literature analysis via PatSnap Eureka. εr 1.018 Porous Silica εr 1.2 Ultra-Porous Al₂O₃ εr 2.7 Toray PI εr 3.0–4.0 Conventional PI εr 4.7 Indialite Glass-Ceramic εr 8.8 Murata LTCC Dielectric Constant (εr) — lower is better for mmWave
1.018
Lowest εr achieved — porous silica foam at 300 GHz
<3×10⁻⁴
tan δ of porous silica foam at 300 GHz (Univ. Oulu, 2021)
200k+
Qf (GHz) of indialite/cordierite glass-ceramics for 5G/6G
20+
Patents & literature sources spanning 2000–2023
Four Dominant Technical Families

The 2026 Low-Loss Dielectric Materials Landscape

The materials landscape for 5G/6G mmWave divides into four dominant technical families, each with distinct performance profiles, processing routes, and IP activity — surveyed across 20+ patents and literature sources spanning 2000–2023.

Family 01 · Polymer Systems

Advanced Polyimide & Liquid Crystal Polymer

Polyimide (PI) materials have attracted substantial research attention as flexible, processable dielectric candidates. Conventional PI exhibits Dk of 3.0–4.0 and dielectric loss of approximately 0.02 — insufficient for 5G high-frequency circuits. Toray Industries achieved Df = 0.002 and Dk = 2.7 through molecular motion restriction and polarity reduction. Liquid crystal polymer (LCP) offers stable dielectric constant and loss tangent specifically across the millimeter-wave frequency range.

Target: Dk < 2.5, Df < 0.002
Family 02 · Ceramic & Glass-Ceramic

LTCC, Silicate Ceramics & Glass-Ceramic Composites

Inorganic materials remain a foundational class for precision mmWave components such as resonators, filters, and LTCC substrates. Indialite/cordierite glass-ceramics yield Dk = 4.7 and Qf exceeding 200 × 10³ GHz. Murata's LTCC composite achieves Dk = 8.8, Q = 1620 at 25 GHz, and temperature coefficient τε of +16 ppm/°C. High quality factors arise from ordered SiO₄ tetrahedral connectivity in silicate ceramics.

Qf > 200,000 GHz · near-zero τε
Family 03 · Porous Inorganic / Ultra-Low εr

Porous Silica Foams & Ultra-Porous Alumina for 6G

As operating frequencies advance toward 300 GHz and above for next-generation wireless, minimizing substrate permittivity as close to unity (air) as possible becomes the dominant design philosophy. University of Oulu's porous silica foam (98.9% porosity, density 0.025 g/cm³) achieved εr = 1.018 ± 0.003 at 300 GHz. Ultra-porous alumina (99% porosity) achieves εr ≈ 1.2 at 130–165 GHz.

εr = 1.018 at 300 GHz · 6G-ready
Family 04 · Tunable Platforms

Liquid Crystal Tunable Dielectrics for Phase Shifters

Liquid crystal (LC) materials offer tunability absent in passive ceramic or polymer substrates. University of Southampton demonstrated LC in the nematic phase at 66 GHz, fabricated into phase shifters delivering 0–π tunability with insertion loss of −4 dB. This validates the LC approach as a low-power continuous alternative to semiconductor-based or MEMS-based phase switching in mmWave beamforming networks. Quasi-optical LC-loaded Fresnel lenses have also been demonstrated using 3D-printed structures.

0–π tunability · −4 dB insertion loss at 66 GHz
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Search active patents from Shin-Etsu, Murata, Fenghua and more — filtered by material family, jurisdiction, and filing date.

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Measured Performance Benchmarks

Key Dielectric Metrics Across Material Families

All data points drawn directly from patents and peer-reviewed literature in the dataset. Loss tangent (tan δ) and dielectric constant (εr) are the two primary figures of merit for mmWave substrate qualification.

Loss Tangent (tan δ) — Key Material Benchmarks

Porous silica foam achieves the lowest tan δ of 3×10⁻⁴ at 300 GHz; conventional PI baseline is ~100× higher at 0.02.

Loss Tangent (tan δ) Comparison: Porous Silica Foam 0.0003 at 300 GHz, COP RS420-LDS 0.00075 at 40 GHz, Toray PI 0.002 at 10–100 GHz, Ultra-Porous Alumina ~0.001 at 130–165 GHz, Conventional PI ~0.02 baseline Horizontal bar chart showing loss tangent (tan δ) for five dielectric material systems relevant to 5G/6G mmWave. Lower values indicate less signal attenuation. Porous silica foam from University of Oulu leads with tan δ < 3×10⁻⁴ at 300 GHz. Data from patent and literature analysis via PatSnap Eureka. 0.0003 Porous Silica 0.00075 COP RS420 ~0.001 Ultra-Porous Al₂O₃ 0.002 Toray PI ~0.02 Conventional PI Loss Tangent (tan δ) — lower is better · log scale representation

Quality Factor & Key LTCC Metrics

Indialite/cordierite glass-ceramics achieve Qf > 200,000 GHz; Murata LTCC delivers Q = 1620 at 25 GHz with τε = +16 ppm/°C.

Quality Factor Metrics for mmWave Dielectric Materials: Indialite/Cordierite Qf >200,000 GHz at Dk 4.7; Murata LTCC Q=1620 at 25 GHz, Dk=8.8, τε=+16 ppm/°C; LC Phase Shifter 0–π tunability at 66 GHz, insertion loss −4 dB Stat card layout summarising quality factor and key performance metrics for three ceramic and tunable dielectric systems for 5G/6G mmWave. Indialite/cordierite glass-ceramic from University of Oulu leads with Qf exceeding 200,000 GHz. Data from patent and literature analysis via PatSnap Eureka. INDIALITE / CORDIERITE Qf >200k GHz · Dk = 4.7 Crystallised at 1300°C · Univ. Oulu 2019 MURATA LTCC COMPOSITE Q 1620 at 25 GHz · Dk = 8.8 τε = +16 ppm/°C · Cu co-fireable LIQUID CRYSTAL PHASE SHIFTER 0–π @ 66 GHz Insertion loss −4 dB Nematic LC · Univ. Southampton 2020 TORAY POLYIMIDE Df 0.002 Dk = 2.7 · 10–100 GHz Photosensitive RDL-compatible · 2020 Source: PatSnap Eureka patent & literature analysis · eureka.patsnap.com

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Ultra-Low Permittivity · 6G Frontiers

Porous Inorganic Substrates: Approaching Free-Space Permittivity

As operating frequencies advance toward 300 GHz and above for 6G, minimizing the dielectric substrate permittivity as close to unity (air) as possible becomes the dominant design philosophy. The University of Oulu's work on lightweight porous silica foams (2021) achieved a relative permittivity of εr = 1.018 ± 0.003 at 300 GHz with tan δ < 3 × 10⁻⁴ at the same frequency, using highly porous (98.9%) lightweight silica foams with density of just 0.025 g/cm³, synthesized by template-assisted sol-gel.

After coating with cellulose nanofibers to improve surface smoothness, silver thin films were sputtered through shadow masks — demonstrating printable electronics compatibility critical toward manufacturable 6G substrate integration. The same group's 2020 work on hollow SiO₂ nanoshells reinforced with cellulose nanofibers yielded a composite mass density of 0.19 g/cm³, leveraging polystyrene nanosphere templating followed by polymer burnout.

Cyclo-olefin polymer (COP) RS420-LDS from Zeon achieves a loss tangent of 7.5 × 10⁻⁴ at 40 GHz, enabling high-Q substrate integrated waveguide (SIW) bandpass filters fabricated by molding and laser direct structuring (LDS) metallization — a production-compatible route to mmWave cavity filters in the 30–60 GHz range, as demonstrated by UBO Lab-STICC.

Ultra-porous alumina (UPA) with porosity approaching 99% achieves εr ≈ 1.2 at 130–165 GHz and tan δ ≈ 10⁻³. Hydrophobic surface treatment can further reduce loss. ITU spectrum allocations for 6G sub-THz bands make these ultra-low permittivity substrates increasingly critical for high-capacity backhaul link design.

1.018
εr of porous silica foam at 300 GHz (98.9% porosity)
<3×10⁻⁴
tan δ of porous silica foam at 300 GHz
0.025
g/cm³ — density of porous silica foam substrate
7.5×10⁻⁴
tan δ of COP RS420-LDS at 40 GHz
6G Frequency Context
  • D-band (110–170 GHz): cannot penetrate thick building materials
  • 300 GHz target: requires εr approaching unity for low-loss propagation
  • Sub-THz bands: porous foams & COP are primary substrate candidates
  • Indoor deployments: low-loss transparent dielectric panels required
Search 6G Substrate Patents
Institutional IP Landscape

Leading Contributors by Material Family & Application

Analysis of the dataset reveals clear institutional clustering by material family and application type — spanning academic research groups and industrial IP holders across Japan, China, South Korea, Finland, and Europe.

🔒
Unlock the Full Institutional IP Map
See all 10 key contributors with their material focus, active patents, and competitive positioning — searchable on PatSnap Eureka.
Shin-Etsu active US patent Fenghua JP patent 2023 Murata LTCC data + 7 more
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Track Active Patents from Shin-Etsu, Murata & Fenghua

Monitor competitive IP filings across mmWave dielectric substrate families in real time with PatSnap Eureka.

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Active IP · Patent Spotlight

Key Active Patents Shaping the mmWave Substrate Landscape

Patent landscape analysis via PatSnap Eureka identifies three active patents with direct commercial relevance to 5G/6G substrate manufacturing. Shin-Etsu Chemical's 2023 US patent describes a composite substrate combining quartz glass cloth (Df of 0.0001–0.0015, Dk of 3.0–3.8 at 10 GHz) with an organic resin matched to within 80–150% of the cloth's loss tangent — designed to eliminate differential propagation time between wiring segments at mmWave speeds.

Guangdong Fenghua Advanced Technology's 2023 patent (active in Japan) describes a Ba₅Si₈O₂₁ composition with tunable (Mg,Ca,Sr,Ba)WO₄ content combined with Ba-B-Si glass. By adjusting the phase ratio, the temperature coefficient of resonant frequency can be brought near zero — enabling stable signal transmission in 5G radio frequency applications and reflecting growing Chinese industrial IP presence in LTCC for 5G hardware.

These active filings, alongside Murata's established LTCC portfolio and Toray's photosensitive PI work, define the commercial IP frontier. PatSnap customers in the RF materials space use Eureka to monitor competitor filings, identify white spaces, and track prosecution status across jurisdictions. According to EPO data, mmWave component-related filings have grown significantly alongside 5G infrastructure rollout, with Asia-Pacific jurisdictions accounting for a growing share of active grants.

For R&D teams working on next-generation PCB laminates, LTCC filters, or polymer redistribution layers, understanding the active IP landscape is essential to both freedom-to-operate analysis and identifying collaboration opportunities with academic institutions such as the University of Oulu or University of Southampton.

Active Patent Summary
Shin-Etsu Chemical
US jurisdiction · 2023 · Active
Quartz glass cloth composite — Dk 3.0–3.8, Df 0.0001–0.0015 at 10 GHz
Guangdong Fenghua
JP jurisdiction · 2023 · Active
Ba₅Si₈O₂₁ LTCC — tunable τf near zero for 5G RF stability
Murata Manufacturing
Industrial literature · 2014
Mg₂SiO₄/SrTiO₃/glass LTCC — Q 1620 at 25 GHz, Cu co-fireable
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Track prosecution status across US, JP, CN & EP jurisdictions
Frequently asked questions

Low-Loss Dielectric Materials for 5G/6G — key questions answered

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References

  1. Research on Penetration Loss of D-Band Millimeter Wave for Typical Materials — Key Laboratory for Information Science of Electromagnetic Waves, Fudan University, 2022
  2. Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications — Unimicron Technology Corporation, 2022
  3. Structural Designs of Transparent Polyimide Films with Low Dielectric Properties and Low Water Absorption: A Review — Pusan National University, 2023
  4. Lightweight porous silica foams with extreme-low dielectric permittivity and loss for future 6G wireless communication technologies — University of Oulu, 2021
  5. Ultra-low permittivity porous silica-cellulose nanocomposite substrates for 6G telecommunication — University of Oulu, 2020
  6. Micro/Millimeter-Wave Dielectric Indialite/Cordierite Glass-Ceramics Applied as LTCC and Direct Casting Substrates — Microelectronics Research Unit, University of Oulu, 2019
  7. Silicate dielectric ceramics for millimetre wave applications — Technische Universitaet Berlin, 2021
  8. Dielectric parameters of the modern low-loss ceramics in the microwave, millimeter, and submillimeter ranges — Public Corporation "Magneton", St.-Petersburg, 2018
  9. Synthesis and applications of low dielectric polyimide — Shenyang University of Chemical Technology, 2023
  10. Low Df Polyimide with Photosensitivity for High Frequency Applications — Toray Industries, Inc., 2020
  11. Progress of liquid crystal polyester (LCP) for 5G application — University of Electronic Science and Technology of China, 2020
  12. LDS Realization of High-Q SIW Millimeter Wave Filters with Cyclo-Olefin Polymers — UBO, Lab-STICC UMR 6285 CNRS, 2018
  13. Low-loss tunable dielectrics for millimeter-wave phase shifter: from material modelling to device prototyping — University of Southampton, 2020
  14. Potential of Liquid-Crystal Materials for Millimeter-Wave Application — Akita Prefectural University, 2018
  15. Dielectric properties of new LTCC material applied to high frequencies — Murata Manufacturing Co., Ltd., 2014
  16. LTCC microwave dielectric material and its manufacturing method — Guangdong Fenghua Advanced Technology, 2023
  17. Low dielectric substrate for high-speed millimeter-wave communication — Shin-Etsu Chemical Co., Ltd., 2023
  18. Complex Permittivity Measurement of Low-Loss Anisotropic Dielectric Materials at Hundreds of Megahertz — Northwestern Polytechnical University, 2022
  19. Ultra-porous alumina for microwave planar antennas — Université Paris Diderot, 2015
  20. European Patent Office (EPO) — mmWave component patent filing trends and jurisdiction data
  21. International Telecommunication Union (ITU) — 6G sub-THz spectrum allocation framework
  22. Université de Bretagne Occidentale (UBO) / Lab-STICC — COP SIW filter fabrication research

All data and statistics on this page are sourced from the references above and from PatSnap's proprietary innovation intelligence platform, PatSnap Analytics, and PatSnap Trust Center.

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