6G RF Front-End Integration Patent Snapshot 2026
Applied Materials and Samsung Electronics together account for the largest share of activity in this still-nascent field, which peaked in filing volume around 2021 and has since eased. The corpus remains small enough that a focused entrant filing in adjacent branches — particularly waveguides, filters, or system-level transmission — could establish a meaningful position quickly.
Two industry incumbents lead a fragmented, early-stage field
Applied Materials holds the top-ranked position with 9 patent records, followed by Samsung Electronics with 7. Together they account for the two visible positions in a evidence snapshot where most other participants hold only a single record each.
The top five filers account for 48% of the combined total among the ranked applicants visible in this query, indicating moderate-to-high concentration at the top tier, but the tail is long and populated largely by individual inventors and academic institutions — a structural sign of a field that has not yet consolidated around a stable set of industrial players.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Applied Materials, Inc. | 9 | |
| 2 | Samsung Electronics Co., Ltd. | 7 | |
| 3 | Bapatla Engineering College | 2 | |
| 4 | LG Electronics Inc. | 2 | |
| 5 | Anhui Lanxun Communications Technology Co., Ltd. | 1 | |
| 6 | Uppala Srinivasa Rao | 1 | |
| 7 | Holypao | 1 | |
| 8 | D. Swetha | 1 | |
| 9 | Tatikonda Krishna Chaitanya | 1 | |
| 10 | P. Ratna Priya | 1 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 11 | B N V Sampath Kumar | 1 | |
| 12 | Anhui Lanyu Electronic Technology Co., Ltd. | 1 | |
| 13 | Bhumireddy Sai Namitha | 1 | |
| 14 | Lakhinana Sai Krishna | 1 | |
| 15 | Billa Anand Emmanuel Raju | 1 | |
| 16 | V. Abhishek | 1 | |
| 17 | K. Nagaraju | 1 | |
| 18 | M. Suneel | 1 | |
| 19 | T. Krishna Chaitanya | 1 | |
| 20 | Beijing Tianzhuо IoT Technology Co., Ltd. | 1 |
Applied Materials’ emphasis on semiconductor device and antenna co-integration, and Samsung’s focus on antenna arrays and waveguide elements, suggests the two leaders are staking out complementary rather than directly competing positions — a pattern that may leave room for challengers specialising in system-level integration or novel substrate approaches.
The most recent 18–24 months of filings are likely under-counted due to standard patent publication lag; apparent softness in 2024–2025 data should not be read as a real decline in activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Filing activity peaked in 2021; antenna and semiconductor integration dominate the technology mix
The annual filing trend and the IPC technology composition together reveal both the pacing of the field and the branches where technical effort is concentrated — and by contrast, where it is sparse.
Annual filing trend
Filings were negligible before 2020, rose to a peak of 7 records in 2021, then eased to 6 in 2022 and further to 3 in each of 2023 and 2024. The 2025 and 2026 data are almost certainly under-counted due to publication lag and should not be interpreted as a continuation of the downward trend.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01Q (Antennas) is the visible branch, reflecting the centrality of antenna-in-package and phased-array design to RF front-end integration. H01L and H10D (semiconductor device branches) are the next largest clusters, consistent with the chiplet and heterogeneous integration approaches pursued by the visible assignees. Lower-volume branches — H04B, H01P, H03M, H04W — represent areas of current sparsity that may be under-served relative to technical need.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Mm-wave signal power divider and antenna array
The present disclosure relates to a 5G communication system or a 6G communication system for supporting higher data rates beyond a 4G communication system such as long term evolution (LTE). The present invention relates to an mm-wave signal power divider implemented on a PCB that includes an input arm, two output arms and a termination load embedded into… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Reconstituted substrate for radio frequency applic… | 52 |
| 2 | Reconstituted substrate for radio frequency applic… | 6 |
| 3 | Antenna module and electronic device including same | 4 |
| 4 | Antenna module and electronic device including same | 4 |
| 5 | 一种Sub-6G-LTCC射频前端微系统模块 | 3 |
| 6 | Antenna module and electronic device including same | 2 |
| 7 | Antenna module and electronic device including same | 1 |
| 8 | 一种金属边框天线组件及移动设备 | 1 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Applied Materials
Applied Materials holds 9 patent records, the highest count in the corpus, with a technology focus spanning H01L semiconductor devices, H01Q antenna integration, and H10D general semiconductor structures — indicating a whole-stack packaging and substrate approach to RF front-end integration. The momentum data classifies the company as a new entrant in the recent filing window, suggesting its position was established quickly rather than incrementally.
patent records: 9Samsung Electronics
Samsung Electronics holds 7 patent records, concentrated in H01Q antenna arrays and H01P waveguide elements — a profile oriented toward mmWave and sub-THz beam-steering modules rather than substrate integration. Like Applied Materials, Samsung is classified as a new entrant in the recent window, meaning its 6G-specific front-end portfolio is being built now rather than carried over from prior generations.
patent records: 7Frequently asked questions
The current corpus covers 25 patent families in scope. This is a small dataset consistent with an early-stage technology that began attracting systematic filing activity only around 2020.
Applied Materials leads with 9 patent records, followed by Samsung Electronics with 7. LG Electronics and Bapatla Engineering College each hold 2 records. All other ranked applicants hold a single record each.
H01Q (Antennas) is the most-represented IPC branch, followed by H01L and H10D (semiconductor device branches) and H05K (printed circuits and assemblies). This distribution reflects the centrality of antenna-in-package and heterogeneous integration approaches to 6G RF front-end design.
The United States is the lead filing jurisdiction with 12 patent records. China follows with 5, India and Taiwan with 3 each, and Europe with 2. Note that these counts are at the patent-record level, so a single patent family can appear in multiple jurisdictions.
The evidence places the field at a maturity stage where annual filings have plateaued near their 2021 peak. The multi-year growth window remains positive, but the rapid annual ramp-up observed from 2020 to 2021 has eased. The most recent 18–24 months of data are subject to publication lag.
No co-applicant or joint-filing relationships were identified in the current corpus. All visible assignees appear to be filing independently, which is typical for a field where core IP positions are still being established.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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