The assignee ranking for this dataset covers 100 companies across 402 records, with one assignee holding 40 records well ahead of the rest of the field. The next four assignees combined bring the top 5 to 20.9% of all 402 records, and the top 10 combined reach 32.8%. That leaves the majority of records held by assignees outside the ranked leadership, so no single company controls the field even though one is clearly ahead.

Filings rose from 14 in 2017 to a peak of 29 in 2022, then fell to 9 by 2024, a 25% decline over that three-year window. The years after 2024 should not be read as continuing that decline, because publication typically lags filing by around 18 months and the most recent years in any patent trend are understated until later filings clear publication. The honest read is that growth has cooled from its 2022 peak, not that the technology has stopped attracting filings.

H05K (printed circuits & assemblies) covers 40.5% of the 402 records and H01Q (antennas) covers 29.6%, making structural and integration claims the largest single categories. Material-side classes — C08L polymer compositions, B32B laminates, C08K polymer additives, and C09K materials for miscellaneous applications — each sit between roughly 15% and 21%. Because a single record often carries several of these classes at once, the practical takeaway is that claims combining a specific material with a specific structural placement are common, not that one class dominates outright.