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Additive Manufacturing Patents: Top Companies & Filing Trends 2026

Additive Manufacturing Patents: Top Companies & Filing Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/additive-manufacturing-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Additive Manufacturing
Additive manufacturing patents: who is filing, what they claim, and where the field is still open
  • Filing has cooled from its 2018 peak of 1,457 records, with the 2021→2024 span down 39% (1,202 to 739) — though 2025 onward is still filling in as publication lags filing.
  • The top 5 assignees hold 18.0% of all 12,769 records, and the top 10 hold 25.0% — concentrated, but with a long tail of single-digit filers behind them.
  • B33Y and B29C each touch roughly half of all records, showing that plastics-shaping process claims and core additive-manufacturing claims overlap on the same filings rather than sitting in separate silos.
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12.8K
Published Records
18%
Top-5 Share of All Records
-39%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (1,202 records) with 2024 (739) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 12,769 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··8 min readSourced from Patsnap Eureka
Overview

What the additive manufacturing patent record actually shows

The search set covers 12,769 published records filed against additive manufacturing process terms — process temperature, tool geometry, material feed, dimensional tolerance, tool path — rather than the broader 3D-printing literature as a whole. That framing matters: it pulls in process-control and metrology claims alongside the machines themselves, which is why control-systems and data-processing subclasses show up at meaningful share alongside the core additive-manufacturing and plastics-shaping classes.

Filing volume peaked in 2018 and has since declined through the most recent complete year, 2024. The most recent one or two years in any such trend will always look thinner than they eventually turn out to be, because publication typically lags filing by around 18 months — so the apparent 2025-26 drop-off is partly an artefact of the data cut-off, not necessarily a slowdown in filing activity itself.

Filing volume by year, 2015-2026
  1. 1STRATASYS INC666
  2. 2GENERAL ELECTRIC CO596
  3. 3CARBON INC368
  4. 4MARKFORGED INC354
  5. 5SEURAT TECHNOLOGIES INC312
  6. 6XEROX CORP219
  7. 7HALDOR TOPSOE AS189
  8. 8NORSK TITANIUM AS162
  9. 9ALIGN TECHNOLOGY INC161
  10. 10DESKTOP METAL INC159
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Additive Manufacturing Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Numbers

Filing trend and technology composition

Two views of the same 12,769-record set: how filing volume has moved year over year, and which IPC subclasses carry the claim density today.

A 2018 peak followed by a multi-year pullback

Annual filings ran from 1,223 in 2017 to a peak of 1,457 in 2018, then eased across the following years to 112 in 2026 (a partial year). The clearest complete-year comparison in the data is 2021 to 2024, where filings fell 39% (1,202 to 739) — a real contraction, but one that predates any read on 2025-26, which are still filling in.

A 2018 peak followed by a multi-year pullback03757501,1251,5001,22320171,457201820192020202120222023202420251122026Most recent year is partial — publication lag means later filings are not yet visible.

Core additive claims sit alongside plastics-shaping and control-systems classes

B33Y (additive manufacturing / 3D printing) appears on 50.0% of the 12,769 records and B29C (shaping of plastics) on 45.4% — the two largest classes overlap heavily rather than partition the field. B22F (powder metallurgy) follows at 24.6%, with B23K (welding, soldering & brazing) at 11.2% and G05B (control & regulating systems) at 9.6%, showing that a meaningful slice of the corpus is about controlling the process, not just describing the build.

Core additive claims sit alongside plastics-shaping and control-systems classesB33Y · Additive manufacturing (3D pri…6,38250.0%B29C · Shaping of plastics5,79845.4%B22F · Powder metallurgy3,14524.6%B23K · Welding, soldering & brazing1,42811.2%G05B · Control & regulating systems1,2229.6%G06F · Electric digital data processi…9377.3%B29K · Plastics moulding materials (i…5804.5%B28B · Shaping clay & cement products5023.9%Other11,27188.3%

Shares are the percentage of the 12,769 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Additive Manufacturing Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

A representative claim: tool-path generation for additive manufacturing

Representative record
US20230060941A12023-03-02

Method for generating a tool path for additive manufacturing of a workpiece

OPEN MIND TECHNOLOGIES AG

The claim covers generating a tool path for an application tool used in additive manufacturing — specifically buildup welding — of a substantially rotationally symmetric workpiece, built from cross-sectional contour data and axis data describing the workpiece's rotation axis.Filed by OPEN MIND TECHNOLOGIES AG; published 2023-03-02 as US20230060941A1.

US20230060941A1 — patent drawing 1US20230060941A1 — patent drawing 2
View full record
Most-cited records in the corpus
#Publication no.Patent titleCitations
1US20100137990A1Porous Substrates for Implantation1,118
2US9205601B2Continuous liquid interphase printing779
3US20140291886A1Three dimensional printing750
4US20200348662A1Platform for facilitating development of intelligence in an industrial internet of things system733
5US20210157312A1Intelligent vibration digital twin systems and methods for industrial environments716
6US9216546B2Method and apparatus for three-dimensional fabrication with feed through carrier621
7US9211678B2Method and apparatus for three-dimensional fabrication610
8US9453142B2Polyurethane resins having multiple mechanisms of hardening for use in producing three-dimensional objects603
9US9815118B1Fabricating multi-part assemblies600
10US20170032281A1System and Method to Facilitate Welding Software as a Service576

Citation counts favour older filings that have had more time to accumulate citations inside this searched corpus — read them as a signal of influence, not of current technical importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Additive Manufacturing Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three patterns worth acting on: where claim density already sits, how concentrated ownership is, and what the recent momentum data does and does not tell you.

Concentration
18.0% / 25.0%
top 5 / top 10 share of 12,769 records

Ownership is concentrated but not locked up

The top 5 assignees combined account for 18.0% of all records in scope, and the top 10 for 25.0%. That leaves three-quarters of the corpus held outside the ranked leaders — a long tail of single- and few-filing entrants rather than a market fully staked out by a handful of firms.

Ranked leaders: 100 companies in the assignee ranking
Process control overlap
9.6% / 7.3%
share of records in G05B / G06F

Control and data-processing claims are a real sub-market

G05B (control & regulating systems) and G06F (electric digital data processing) touch 9.6% and 7.3% of records respectively. That is a smaller share than the core printing classes, but it signals that process-parameter and tool-path software claims are being filed as a distinct layer on top of the hardware.

Based on IPC subclass tagging across 12,769 records
Momentum caution
-39% (2021→2024)
complete-year filing change

Read recent-year drops with the publication lag in mind

Filings fell from 1,202 in 2021 to 739 in 2024, a genuine three-year decline. The sharper-looking falls reported for individual assignees in 2025-26 reflect the same 18-month publication lag rather than an abrupt stop in filing activity, so they should not be read as the current run rate.

2024 is the most recent year treated as complete
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Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to additive manufacturing patent landscape, with the prior art for and against each one.

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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Additive Manufacturing Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Who's Filing

Leaders, collaboration patterns and where the gaps sit

The ranked leaders span industrial equipment makers, materials suppliers and software-focused entrants — but the co-filing pattern and recent-year momentum both point to a field still being actively reshuffled rather than settled.

Leader
666 records
leading assignee

One clear leader, then a steep drop to a broad group

The leading assignee holds 666 records, more than double the fifth-place figure of 312 and over four times the tenth-place figure of 159. The gap from first to fifth is steep; the gap from fifth to tenth is comparatively shallow, which is the shape of a field with one dominant filer and a broad second tier.

Assignee ranking: 100 companies, counted in records
Collaboration
10 co-assignee pairs
recurring joint-filing relationships

Co-filing is rare and concentrated in a few pairs

Only 10 recurring co-assignee pairs appear across the dataset, the strongest at 11 shared records. Most of these pairs sit inside corporate groups (parent and subsidiary, or two divisions of the same company) rather than across competitors, so they say more about internal structure than about industry-wide alliances.

Strongest pair: 11 shared records
Momentum
-82% to -100% YoY
latest-year change, leading filers

Leading filers show sharp year-over-year drops

Every one of the assignees tracked for recent-year momentum shows a steep decline into the latest year, several down to zero. Given the 18-month publication lag, this is expected for the most recent filing years and should not be read as those companies exiting the space — it is the data catching up, not a market signal.

Latest year is partial in this dataset
🔍
Sub-areas that show up thin in the record
These branches carry claims but at low density relative to the core printing and materials classes — a first mover with a well-drafted claim still has room.
in-process dimensional tolerance feedback loopsmaterial feed rate control for multi-material buildsclosed-loop tool-path correction during buildup weldingclay and cement shaping process claims (B28B)plastics moulding material formulations indexed under B29K
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
General Electric Co2-82%
Seurat Technologies Inc1-83%
Align Technology Inc1-96%
Stratasys Inc0-100%
Carbon Inc0-100%
Markforged Inc0
Xerox Corp0-100%
Haldor Topsoe AS0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Additive Manufacturing Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this from here

The dataset points to three practical next steps depending on whether you are scoping freedom-to-operate, deciding where to file, or tracking a competitor.

Check freedom-to-operate against the densest classes

B33Y and B29C together sit on nearly half the corpus each, so any new filing touching core additive process or plastics-shaping claims needs a targeted prior-art search in those two subclasses before drafting.

Run a freedom-to-operate search in Eureka

Draft into the thinner control-systems layer

G05B and G06F carry lower density than the hardware classes, and process-parameter or tool-path software claims are still being actively filed there — a narrower window than the core classes, but a real one.

Explore the control-layer white space in Eureka

Track the leader's next moves, not just its stock

With one assignee holding 666 records against a fifth-place figure of 312, watching that leader's continuation filings and recent applications tells you more about where the field moves next than the aggregate trend does.

Set up assignee tracking in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Additive Manufacturing Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on additive manufacturing patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Additive Manufacturing Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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