Structural Acrylic Adhesive Patents: Who Leads & White Space 2026
A data-led view of structural acrylic adhesive patents: 1,983 records, filing trends from 2017-2026, IPC composition across C09J and B32B, and where the ranked leaders concentrate their filings.
Filing growth = 2021 (65 records) → 2024 (63); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 1,983 records in scope (CR5), not the ranked leaders only.
What this landscape covers
This landscape draws on 1,983 published records matching structural acrylic adhesive claims, filed between 2015 and the 2026 data cut-off. Coverage spans core adhesive composition claims (C09J), laminate and layered-product applications (B32B), and a set of narrower application classes including building structures, fenestration and semiconductor devices. The representative filing, US5865936A, illustrates the two-part redox-cure chemistry that defines much of the field’s earliest claim scope.
Filing activity peaked in 2019 and has since held at a comparable pace through the most recent complete year, indicating a field that is actively maintained rather than rapidly expanding. Because publication lags filing by roughly 18 months, the final one to two years of any trend line will understate true filing activity.
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Filing trends and technology composition
The dataset spans 1,983 published records filed between 2015 and the 2026 cut-off, giving a decade-scale view of where structural acrylic adhesive claims concentrate and how filing activity has moved year over year.
Filing activity: steady after a 2019 peak
Filings rose from 82 in 2017 to a peak of 83 in 2019, then held in a comparable band through the most recent complete year; 2021's 65 records moved to 63 by 2024, a -3% change. Because publication lags filing by roughly 18 months, 2025 and 2026 figures are still filling in and should not be read as a decline.
Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.
Technology composition by IPC subclass
C09J (adhesives) carries 38.4% of the 1,983 records in scope, with B32B (layered products and laminates) second at 22.1%. Addition polymers (C08F), polymer compositions (C08L) and plastics shaping (B29C) each cover a mid-single-digit to high-single-digit share, while building structures (E04B), fenestration (E06B) and semiconductor devices (H01L) mark the thinner, application-specific edges of the field.
Shares are the percentage of the 1,983 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Adhesives & Sealants: Structural Acrylic Adhesive Patent Landscape with Eureka
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Try EurekaA representative claim and the most-cited prior art
US5865936A — Rapid curing structural acrylic adhesive
A two part structural acrylic adhesive contains as a first part a mixture of acrylate or methacrylate monomers or oligomers, maleic acid, a hydroperoxide, and a source of ferric ions, and as a second activator part a substituted dihydropyridine. The adhesive is fast-curing and stable.Filed by National Starch and Chemical Investment Holding Corporation; published 1999-02-02.
View full record| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US3761418A | Detergent compositions containing particle deposition enhancing agents | 1,044 |
| 2 | US3723325A | Detergent compositions containing particle deposition enhancing agents | 427 |
| 3 | US5765332A | Fire barrier protected dynamic joint | 258 |
| 4 | WO2007113597A2 | Adhesive laminates and applications thereof | 249 |
| 5 | US6131651A | Flexible heat transfer device and method | 241 |
| 6 | US20100159192A1 | Adhesive laminates and applications thereof | 233 |
| 7 | US6271156B1 | Fire-resistant core for a combustible fire-rated panel | 189 |
| 8 | US5993849A | Hydrophilic adhesive and binder for medications | 185 |
| 9 | US5192612A | Positionable-repositionable pressure-sensitive adhesive | 184 |
| 10 | US5974750A | Fire barrier protected dynamic joint | 181 |
Citation counts reflect influence within this searched corpus and skew toward older records; they are not a measure of current commercial importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the filing data signals
Four figures from the dataset point to where claim density is highest, where it is thinnest, and how stable the field's filing pace has been.
Top 10 hold under a third of the field
The ten most-active filers combine for 576 records, 29.0% of the 1,983 records in scope. That leaves the large majority of filings spread across the remaining ranked companies and unranked entrants, so freedom-to-operate analysis cannot rely on clearing just the leading names.
A steady field, not a growing one
Filings moved from 65 in 2021 to 63 in 2024, a -3% change over three years, following a 2019 peak of 83. Because publication lags filing by roughly 18 months, 2025-2026 counts will rise as more applications post, but the underlying pace has been flat rather than accelerating.
C09J is where the claim density sits
Adhesives proper (C09J) carries the largest single IPC share at 38.4% of records, meaning any new formulation claim is most likely to encounter prior art here first, ahead of laminate or application-specific classes.
Semiconductor bonding is the thinnest class
H01L (semiconductor devices) covers only 3.9% of the 1,983 records in scope, the smallest of the eight IPC subclasses tracked here, marking it as the least-claimed application-specific branch of the field.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to adhesives & sealants: structural acrylic adhesive patent landscape, with the prior art for and against each one.
Where to take this analysis next
The figures above set the boundaries of the field. Turning them into a filing or freedom-to-operate decision means going deeper into specific claims and specific competitors.
Check clearance against the core chemistry
C09J carries the densest claim scope in this field. Before filing a new acrylic adhesive composition, run the specific cure chemistry and additive combination against the leading assignees' claims.
Search claims in EurekaWatch the ranked leaders' recent filings
With the top 10 covering 29.0% of the 1,983 records in scope, tracking their newest applications is the fastest way to see where the field's claim boundaries are moving.
Track assignees in EurekaTest the under-claimed application classes
Semiconductor bonding and fenestration applications carry the thinnest IPC shares in this dataset. A narrowly scoped application claim there faces less prior art than a new formulation claim in C09J.
Explore white space in EurekaFrequently asked questions
The assignee ranking covers 100 companies, with the ranked leader holding 157 of the 1,983 records in scope. The top 5 combined account for 19.8% of all records, and the top 10 combined account for 29.0%, so there is a clear leading cluster but no single dominant monopoly — a long tail of single- and few-filing entrants makes up the rest of the ranking. Filing concentration is measured in patent families rather than raw document counts, which neutralises duplicate continuation filings.
Based on the representative claim scope in this dataset, structural acrylic adhesive is a two-part or activator-cured bonding system designed to hold load-bearing joints, not just cosmetic or non-structural bonds. The IPC composition shows the largest application classes outside core adhesive chemistry are layered products/laminates (B32B, 22.1% of records) and building structures (E04B, 6.0%), meaning the bulk of claimed use is in laminated assemblies and structural construction elements. A smaller but present share extends into fenestration (E06B) and semiconductor packaging (H01L), which are the more specialised commercial uses.
Filing activity peaked in 2019 at 83 records and has stayed in a broadly similar range since, with 2021's 65 records moving to 63 by 2024 — a -3% change over that span. That is closer to a mature, steady field than a rapidly growing or collapsing one. Note that the most recent one to two years in any filing trend are understated because publication lags filing by roughly 18 months, so figures for 2025 and 2026 will rise as more applications publish.
US5865936A claims a specific two-part structural acrylic adhesive: a first part combining acrylate/methacrylate monomers or oligomers, maleic acid, a hydroperoxide and a ferric ion source, paired with a dihydropyridine-based activator in the second part. The blocking scope is that particular redox-cure combination and activator chemistry, not acrylic adhesives in general. A formulation using a different cure trigger — UV, moisture, or a different redox pair — would sit outside this specific claim, though it may run into other composition claims held by the field's leading filers.
The thinnest IPC classes relative to the rest of the field are semiconductor devices (H01L, 3.9% of the 1,983 records in scope) and fenestration applications (E06B, 5.5%), both well below the 38.4% share held by core adhesive chemistry (C09J). That gap indicates application-specific claims tied to electronics-grade bonding or window/door assemblies are less crowded than the base chemistry, giving newer entrants more room to file a defensible, narrowly scoped claim rather than competing directly on formulation.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.