Advanced Bump and Microbump Patents: Who Leads, Where Filings Peaked 2026
Advanced bump and microbump technology patents: who holds the ground and where filings have cooled
66.7% concentration. The top five assignees alone account for 188 of the 282 records in scope — a field where claim space at the top is already dense. Annual filings climbed from 12 in 2017 to a peak of 18 in 2020, then declined — 2021 filings of 9 fell to 5 by 2024, a 44% drop over that three-year span. That pullback lines up with the field's core process problems (intermetallic growth, nonwet-open, flux residue) having accumulated a decade of prior art by then, which raises the bar for a novel claim rather than removing the need for one.
- 1TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD101
- 2INTERNATIONAL BUSINESS MACHINE CORPORATION50
- 3INTEL CORP13
- 4TEXAS INSTRUMENTS INC13
- 5PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC11
See the full advanced bump and microbump technology analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who are the leading patent holders in microbump technology?
The ranking covers 40 companies returned for this search, and it is heavily concentrated: one assignee alone holds 101 of the 282 records in scope, and the top five together hold 188 records, or 66.7% of the field. By the tenth-ranked company the count has fallen to 6 records, so the remaining 30 ranked assignees split a much smaller share of the corpus. This pattern is typical of foundry- and device-maker-driven fields where a handful of large players set the technical baseline early and smaller filers work around specific process variants.
Is patent filing activity in bump and microbump technology increasing or decreasing?
Filing activity peaked at 18 records in 2020 and has declined since, with 2021’s 9 filings falling to 5 by 2024 — a 44% drop over that three-year window. Because publication typically lags actual filing by around 18 months, 2025 and 2026 figures are still incomplete and should not be read as continuing or reversing that trend yet. Treat 2024 as the most recent year with a reasonably complete count.
What technical sub-areas are most heavily claimed in this field?
88.7% of the 282 records carry an H01L semiconductor-device classification, which is expected given the corpus centres on bump structures within semiconductor packaging. Beyond that core, 27.7% carry an H10W classification and 23.8% carry H10P, with smaller but real shares in B23K soldering/brazing (11.7%) and H05K printed-circuit assembly (11.3%). Because a single record can carry several IPC classes, these shares add up to more than 100% and should each be read against the full 282-record base, not against each other.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Advanced Bump and Microbump Technology covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.