Chiplet Die-to-Die Interconnect Patents: Who Leads, Trends 2026
Chiplet die-to-die interconnect patents: mapping the packaging and heterogeneous integration field
Concentrated at the top. The five leading assignees hold 47.8% of all 689 records in scope, and the top ten hold 60.5% — a small group has occupied most of the claim space. Filings rose from 19 in 2017 to a peak of 163 in 2025, with 2021-2024 essentially flat (65 to 65, 0% change). 2026 shows only 13 so far, but that reflects the roughly 18-month publication lag rather than a real drop in filing activity — the most recent one to two years always understate true volume.
- 1SILVEBROOK KIA100
- 2INTEL CORP95
- 3MONOLITHIC 3D INC74
- 4APPLE INC35
- 5SAMSUNG ELECTRONICS CO LTD25
See the full advanced packaging & heterogeneous integration — chiplet die-to-die interconnect patent landscape analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on this landscape
Who holds the most chiplet die-to-die interconnect patents?
One assignee leads clearly with 100 records in this 689-record dataset, well ahead of the fifth-ranked company at 25 and the tenth at 11. That gap indicates one or two firms treat die-to-die interconnect as a core patent programme rather than an incidental filing area. The ranking covers the 100 companies the data endpoint returns, so it should be read as relative standing within that set, not as a share of every filer worldwide.
Is chiplet die-to-die interconnect patent filing growing or slowing?
Filings were essentially flat from 2021 to 2024, holding at 65 in both years for 0% change. The 2025 peak of 163 and the lower 2026 count both need context: publication lags actual filing by roughly 18 months, so the most recent one to two years in any patent trend understate real activity. Treat the 2021-2024 window as the most reliable read on recent momentum.
Which patent classes matter most for chiplet die-to-die interconnect?
H01L (semiconductor devices) appears in 67.3% of the 689 records and H10W in 36.9%, making these the two dominant classes by a wide margin. G06F, H10B, H10P, H10D, G11C and H05K each cover smaller but non-trivial shares, from 16.1% down to 4.4%. Because a single record can carry multiple IPC codes, these percentages add up to well over 100% and should not be summed into a single total.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Advanced Packaging & Heterogeneous Integration — Chiplet Die-to-Die Interconnect Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.