Advanced Packaging Patents: Who Leads, Where the Gaps Are 2026
Advanced Packaging and Heterogeneous Integration Patents: Filing Trends and Leading Filers
36.8% concentration at the top. The five largest filers account for 1,136 of 3,086 records in scope, but the ranked field runs 100 companies deep with a long tail below tenth place. Filings climbed from 69 in 2017 to a peak of 455 in 2025, with the 2021-to-2024 span alone showing a 186% rise from 135 to 386 complete-year filings. The 2026 figure of 51 is a partial year and should not be read as a slowdown.
- 1TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD14.3%
- 2INTEL CORP10.1%
- 3QUALCOMM INC5.2%
- 4ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC4.0%
- 5SILVEBROOK KIA3.2%
See the full advanced packaging & heterogeneous integration patent landscape analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who are the leading patent filers in advanced packaging and heterogeneous integration?
The ranked assignee list covers 100 companies, led by a major semiconductor foundry with 440 records, well ahead of the fifth-placed filer at 100 and the tenth-placed filer at 38. The top five combined hold 36.8% of all 3,086 records in scope, and the top ten hold 45.6%, so the field is concentrated at the top but still has a substantial long tail of companies with only a handful of filings each. This mix of a dense top and a long tail is typical of a technology area that is still actively being claimed rather than settled by a small set of incumbents.
Is advanced packaging patent activity growing or slowing down?
Complete-year filings rose from 135 in 2021 to 386 in 2024, a 186% increase, and the field peaked so far at 455 filings in 2025. Because patent publication lags actual filing by roughly 18 months, the 2025 and 2026 figures are still incomplete and should not be read as a plateau or decline — they will keep revising upward as more records publish. On the evidence available, 2021 through 2024 shows sustained, fast growth rather than any slowdown.
Which patent classes matter most for chiplet and heterogeneous integration filings?
H01L, the general semiconductor devices class, covers 69.2% of the 3,086 records in scope, making it the dominant classification by a wide margin. H10W follows at 31.6%, with H05K (printed circuits and assemblies), H10P, G06F, H10B, H10D and G01R each covering a smaller but still meaningful share. Because a single record can carry multiple IPC codes, these percentages overlap rather than sum to 100%, and the secondary classes are often where less-crowded claim language can still be found.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Advanced Packaging & Heterogeneous Integration Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.