Antenna-in-Package Patents: Who Leads, Where the Gaps Are 2026
- Filing activity has cooled since its 2019 peak. Annual filings hit 24 in 2019 and have not returned to that level, with the 2022 midpoint sitting at 22 — a flat-to-declining trend rather than a growing one.
- Ownership is fragmented, but momentum has stalled everywhere. Every assignee tracked for recent-year momentum shows zero filings in the latest year, including established names like Huawei, Philips and Texas Instruments — a sign the field's active edge has moved into forms not yet reflected in published records.
- The United States and China dominate filing venues. US and Chinese receiving offices account for 73 and 63 records respectively, well ahead of EPO (29), WIPO (15), India (14) and Germany (3), marking where enforcement risk actually concentrates.
Filing growth compares 2021 (21 records) with 2024 (12) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 212 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This review tracks 212 patent families filed between 2015 and mid-2026 that claim antenna-in-package designs, miniaturized antenna geometries, or integrated antenna modules, narrowed to filings that also address bandwidth, efficiency, substrate material, feed structure or detuning-by-hand within the H01Q, H10W and H01L classification space. The core classification, H01Q (Antennas), touches 209 of the 212 records, meaning almost every filing in the set is fundamentally an antenna claim rather than a packaging or semiconductor claim that happens to mention an antenna.
Because publication lags filing by roughly 18 months, the 2025 and 2026 counts in the trend chart are undercounts by construction — recent activity will be revised upward as those applications publish. The patent family, not the raw document, is the unit used throughout this page, so continuation practice and multi-jurisdiction refiling do not inflate any single assignee's apparent output.
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Filing trend and technology composition
Two views of the same 212-family dataset: the year-by-year filing curve, and the IPC subclasses that carry the claim volume.
A peak in 2019, no return since
Filings rose from 6 in 2017 to a peak of 24 in 2019, held near that level through the 2022 midpoint of 22, and have not sustained growth beyond it. Combined with the recent-year momentum data — where every tracked assignee shows zero filings in the latest year — this points to a field where claim space filled quickly and has not reopened.
Antenna claims dominate; semiconductor and RF integration are secondary
H01Q (Antennas) appears in 209 of 212 records, confirming this is an antenna-first dataset. H10W and H04B (transmission, general) show meaningful secondary presence, while H01L (semiconductor devices), H01P (waveguides), H02J (power supply), G01R (measurement) and H05K (printed circuits) each appear in single digits to low double digits — these are the adjacent classes where integration claims sit, and where filing density is thin enough to leave room for new claims.
Shares are the percentage of the 212 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Antenna-in-Package and Miniaturized Antennas with Eureka
This page is one run against one query. Ask Eureka your own question about antenna-in-package and miniaturized antennas and every answer comes back with the patent numbers behind it.
Try EurekaThe most-cited prior art in this space
EP3846286B1 — broadband antenna in a package (Huawei Technologies)
Filed by Huawei Technologies and granted with a publication date of 2025-12-10, this record is representative of the current filing wave: broadband performance claimed within a packaged antenna structure, addressing the bandwidth and substrate constraints that define this dataset's search criteria.Abstract and claim language are rendered from the original filing; this summary is descriptive only.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6680700B2 | Miniaturized microwave antenna | 192 |
| 2 | US8330259B2 | Antenna in package with reduced electromagnetic interaction with on chip elements | 148 |
| 3 | US20080305750A1 | Miniature sub-resonant multi-band VHF-UHF antenna | 127 |
| 4 | US5646634A | Miniaturized antenna for converting an alternating voltage into a microwave and vice versa, notably for horol… | 65 |
| 5 | US20020122009A1 | Slot spiral miniaturized antenna | 51 |
| 6 | US20100315303A1 | Folded slotted monopole antenna | 48 |
| 7 | US20200244104A1 | Systems and methods for miniaturized antenna for wireless power transmissions | 43 |
| 8 | US20070159400A1 | Radio Frequency Certificates of Authenticity and Related Scanners | 42 |
| 9 | US3838429A | Miniaturized transmission line top loaded monopole antenna | 37 |
| 10 | US20050266875A1 | Integrated SDARS headphone system | 34 |
Citation counts reflect influence within this searched corpus and skew toward older filings; treat them as a signal of foundational status, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for a filing decision
Three patterns stand out once the trend, classification and citation data are read together.
The growth window has already closed
Filings peaked in 2019 and the 2022 midpoint of 22 shows no clear acceleration since. Combined with zero latest-year momentum across every tracked assignee, new entrants should assume the core claim space — geometry and package integration — is already dense, not that the field is still opening up.
Antenna geometry, not packaging, is the crowded claim
Almost every record sits in H01Q. Secondary classes like H01L (17 records) and H01P (8 records) — the semiconductor and waveguide integration layers — carry far less filing density, suggesting the physical antenna structure is more contested ground than the electrical interface to it.
Enforcement risk concentrates in two jurisdictions
The United States and China together account for the large majority of receiving-office activity, ahead of EPO, WIPO, India and Germany combined. A freedom-to-operate check that skips either jurisdiction is checking the wrong map.
The most influential prior art predates the current wave
The highest-cited record in the corpus is a miniaturized microwave antenna patent, well ahead of more recent antenna-in-package filings on citation count. High citation counts here mark foundational geometry claims, not evidence that today's designs still route around them.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to antenna-in-package and miniaturized antennas, with the prior art for and against each one.
Who holds the claim space
Ownership includes established telecom and semiconductor names alongside smaller specialist filers, but the recent-year momentum data shows the entire tracked group — regardless of size — filed nothing in the latest year.
Large filers have gone quiet in the most recent year
Huawei, Philips, Texas Instruments, Intel and other tracked assignees all show zero filings in the latest year, with Texas Instruments recording a -100% year-on-year change. This is consistent with publication lag, but it also means the visible ranking understates whoever is filing right now.
Joint filings are rare and mostly intra-group
The strongest co-assignee pair links two related Shenzhen Kuang-Chi entities on four filings; the next strongest pairs — Philips with its IP subsidiary, and an aviation-industry filer paired with an individual inventor — appear twice each. Cross-company collaboration filings are the exception here, not the norm.
US and Chinese filers dominate volume
The receiving-office split shows US and China well ahead of Europe, WIPO, India and Germany, meaning most of the assignees active in this space are filing through those two systems first — a useful signal for where competitive filings will surface earliest.
| Assignee | Recent year | YoY |
|---|---|---|
| Huawei Technologies Co., Ltd. | 0 | — |
| Koninklijke Philips N.V. (Royal Philips) | 0 | — |
| Texas Instruments Incorporated | 0 | -100% |
| Energous Corporation | 0 | — |
| Aviation Industry Corporation of China (AVIC) | 0 | — |
| Intel Corporation | 0 | — |
| Rosenberger Asia Pacific Electronic Co., Ltd. | 0 | — |
| Shenzhen Kuang-Chi Institute of Advanced Technology | 0 | — |
Where to take this analysis
The dataset points to a mature core and a thin adjacent layer. Two directions follow from that.
Map the H01L and H01P overlap in detail
Semiconductor integration and waveguide claims sit at single-digit-to-low-double-digit density inside this corpus. A closer read of exactly which sub-claims those records hold would show whether the integration layer is genuinely open or simply under-searched.
Explore the classification breakdownWatch for the 2025–2026 publication catch-up
Because publication lags filing by around 18 months, filings made in the last two years are still arriving. Re-running this landscape in twelve months will show whether the 2019 peak was a one-time cycle or whether recent activity has quietly resumed.
Revisit the filing trendCommon questions on antenna-in-package patents
An antenna-in-package patent claims an antenna structure that is integrated directly into a semiconductor or module package, rather than mounted as a separate external component. This dataset shows that the great majority of these filings — 209 of 212 records — are still classified primarily under H01Q (Antennas), meaning the antenna geometry itself is usually the core inventive claim, with the packaging integration described as the application context. Practically, this means prior art searches for AiP work should not skip general antenna geometry classes just because the claim mentions package integration.
Not based on the filing trend in this corpus. Annual filings peaked at 24 in 2019, and the 2022 midpoint of 22 shows no sustained acceleration beyond that peak. Recent-year momentum data reinforces this: every tracked assignee, including large filers, shows zero filings in the most recent year. Some of that recent-year drop is a publication-lag artefact, since filings take roughly 18 months to appear in the public record, but the multi-year plateau since 2019 is a real pattern, not a lag artefact.
Ownership in this corpus includes established telecom, semiconductor and RF component firms alongside smaller specialist filers, with no single company dominating outright. Co-filing is uncommon — only seven co-assignee pairs appear in the whole dataset, and the strongest pair links two related entities from the same corporate group rather than two independent competitors. Anyone assessing competitive risk should look at the full assignee ranking rather than assuming a single leader controls the space.
The IPC composition points to several under-claimed adjacent branches: package-level power delivery (which overlaps H02J), microwave measurement and calibration methods (H01P and G01R), and printed-circuit-level antenna assembly (H05K). These classes appear at single-digit to low-double-digit record counts compared to the 209 records in the core H01Q antenna class, suggesting the geometry claims are dense but the surrounding integration and measurement claims are comparatively open.
The United States and China are the two dominant receiving offices in this dataset, with 73 and 63 records respectively, well ahead of the EPO (29), WIPO/PCT (15), India (14) and Germany (3). A freedom-to-operate review that only checks one of the US or China risks missing the majority of active claims. Filers targeting global markets should treat WIPO/PCT filings as a leading indicator of where US and China filings will eventually land, given the typical filing sequence.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.