Antenna-in-package (AiP) integrates the antenna structure into the semiconductor package substrate, alongside the die, rather than on a separate board. An on-chip antenna goes a step further and fabricates the radiating element directly on the silicon die itself. Both approaches aim to shrink module footprint and shorten the feed path from chip to antenna, but AiP is generally favoured for higher-performance mmWave designs because on-chip antennas suffer more from substrate loss and silicon’s relatively poor radiation efficiency at these frequencies.

The ranked assignee table in this dataset covers 79 companies drawn from 420 records, with the leading assignee holding 85 records and the top five combined accounting for 51.2% of all records in scope. That leaves a substantial gap down to fifth place at 21 records, and a second tier from fifth to tenth place that is more tightly clustered. Filers span device makers, semiconductor packaging specialists, and automated test equipment companies, reflecting how much of this field’s activity is about verifying performance as well as designing the antenna structure itself.

Filings peaked at 83 in 2022 and fell to 31 by 2024, a -48% change over that span, but this should not be read as a technology cooling off. Patent publication typically lags the actual filing date by around 18 months, so 2025 and 2026 figures in any dataset are still incomplete and will rise as more applications publish. The safest complete-year comparison available here is 2021 to 2024, and even that shows a real decline worth watching rather than dismissing.