Antenna in Package Patents: Who Leads, Where the Gaps Are 2026
- 51.2% of all 420 records sit with just five assignees — filing here means either joining a crowded top tier or working the long tail of 79 ranked companies.
- Filings peaked in 2022 at 83 then declined to 31 by 2024, a -48% swing over that three-year span — publication lag means 2025-26 figures will still fill in.
- H01Q dominates at 63.3% of records but G01R (measurement, 27.4%) and H01P (waveguides, 5.0%) show where testing and RF-integration claims are comparatively thin.
Filing growth compares 2021 (60 records) with 2024 (31) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 420 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
Antenna-in-package (AiP) and on-chip antenna designs solve a packaging problem as much as an RF one: how to keep radiation efficiency high once the antenna is folded into a substrate whose material permittivity, feed transition and loss characteristics were not chosen with radio performance in mind. The 420 records in scope span design patents for the antenna structures themselves, package and substrate engineering intended to reduce substrate loss, and over-the-air test methodology for verifying radiating performance once the module is sealed. That last group matters more than its size suggests: as AiP modules move into mainstream mmWave and 5G/6G front ends, proving radiation efficiency without physical probe access becomes its own filing category.
The dataset covers publications from 2015 through the 2026-07-31 cut-off, drawing on IPC classifications, assignee records and citation data across US, European, Chinese, Taiwanese, PCT and German filings.
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Filing trends and technology composition
Two views of the same 420 records: how filing activity has moved year over year, and how those records distribute across IPC subclasses. Because a single record can carry multiple classifications, the class shares below sum to well over 100% of the record total.
A decade of uneven growth, now cooling from a 2022 peak
Annual filings rose from 10 in 2017 to a peak of 83 in 2022, before falling to 31 by 2024 — a -48% change over that three-year window. Treat 2025 and 2026 figures as provisional: publication typically lags filing by around 18 months, so the most recent years will keep filling in as more records publish.
H01Q anchors the field; measurement and integration classes trail
H01Q (antennas) appears on 63.3% of the 420 records, confirming that most filings are still about the radiating structure itself. G01R (electric and magnetic measurement, 27.4%) and H04B (transmission, 22.4%) form a secondary tier tied to testing and system integration, while H01L (semiconductor devices, 8.3%), H05K (printed circuits, 6.0%) and H01P (waveguides, 5.0%) mark smaller, more specialised claim territory.
Shares are the percentage of the 420 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Antenna in Package and On Chip Antennas with Eureka
This page is one run against one query. Ask Eureka your own question about antenna in package and on chip antennas and every answer comes back with the patent numbers behind it.
Try EurekaMost-cited records and a representative recent filing
Over-the-air testing of antenna-in-package devices in radiating near field
The filing describes automated test equipment with a first antenna establishing a near-field wireless coupling to a device under test and a second antenna coupling to a characterizing ("golden") device, both arranged on a loadboard. The arrangement lets a handler component verify AiP radiation performance without a hardwired RF connection to the device under test.Abstract condensed from the original filing text.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20130157729A1 | Energy harvesting computer device in association with a communication device configured with apparatus for bo… | 501 |
| 2 | US20140145884A1 | Package structures to improve on-chip antenna performance | 234 |
| 3 | US20190058242A1 | Energy harvesting substrate network and communication apparatus | 220 |
| 4 | US8917210B2 | Package structures to improve on-chip antenna performance | 189 |
| 5 | US7372408B2 | Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromag… | 182 |
| 6 | US20120032876A1 | Mega communication and media apparatus configured to provide faster data transmission speed and to generate e… | 166 |
| 7 | US9130651B2 | Mega communication and media apparatus configured to provide faster data transmission speed and to generate e… | 162 |
| 8 | US20230130259A1 | Radio frequency device packages | 138 |
| 9 | US20120176237A1 | Homeland intelligence systems technology "h-list" and battlefield apparatus | 138 |
| 10 | US9743357B2 | Energy harvesting computer device in association with a communication device configured with apparatus for bo… | 120 |
Citation counts reflect influence within the searched corpus and skew toward older records — they are not a measure of current commercial importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the data means for filing strategy
Three patterns stand out once the numbers are read together: concentration at the top of the assignee table, a class distribution that is heavily weighted to one subclass, and a filing curve whose most recent years are not yet fully visible.
Five companies hold roughly half the field
The leader alone accounts for 85 records, and the top five combined reach 215 of the 420 records in scope — 51.2% of the total. The top ten extend that to 288 records, or 68.6%. New entrants are filing into a field where over two-thirds of prior art already sits with ten organisations.
Antenna structure claims dwarf waveguide and microwave-element claims
H01Q appears on 266 of 420 records (63.3%), while H01P — waveguides and microwave elements, directly relevant to feed transition design — appears on only 21 records (5.0%). That gap suggests feed-transition and microwave-coupling claims are comparatively under-filed relative to the core antenna structures they connect to.
Growth has cooled from its 2022 peak
Annual filings rose from 60 in 2021 to a peak of 83 in 2022, then dropped to 31 by 2024 — a -48% change across that span. Recent-year momentum by individual assignees shows several established filers recording no publications in the latest tracked year, though publication lag means this understates true 2025-26 activity.
Verification methodology is a distinct, sizeable claim category
G01R (electric and magnetic measurement) touches 115 of 420 records, more than one in four. Over-the-air test methods for sealed AiP modules — where physical probe access is not possible — form a recognisable sub-category within this class rather than an incidental overlap.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to antenna in package and on chip antennas, with the prior art for and against each one.
Who is filing, and where the activity gaps sit
The ranked assignee table lists 79 companies drawn from the 420 records in scope. Filing activity concentrates heavily at the top, but the recent-year momentum data shows even established leaders posting zero publications in the latest tracked year — a pattern consistent with publication lag rather than a genuine pullback.
A single assignee holds the largest share by a wide margin
The top-ranked assignee accounts for 85 of the 420 records, roughly 20% of the total on its own — well ahead of fifth place at 21 records. That gap between first and fifth place is itself informative: this is not a field with five roughly equal leaders, it is one dominant filer plus a closely packed group behind it.
A tight cluster forms the second tier
Fifth place holds 21 records and tenth place holds 11, a much shallower drop-off than the gap between first and fifth. This cluster — including test-equipment specialists and semiconductor packaging houses alongside device makers — is where competitive filing activity is most active today.
Co-assignment activity is limited but concentrated
Only ten co-assignee pairs appear across the dataset, and the strongest of them link related corporate entities or an assignee with a named inventor rather than distinct competing firms. Cross-company joint filing is not yet a defining feature of this field.
| Assignee | Recent year | YoY |
|---|---|---|
| LG Electronics Inc | 0 | -100% |
| Advantest Corporation | 0 | -100% |
| Siliconware Precision Industries Co., Ltd. | 0 | — |
| Samsung Electronics Co., Ltd. | 0 | -100% |
| Telefonaktiebolaget LM Ericsson | 0 | — |
| ASE Test (Taiwan) | 0 | — |
| Huawei Technologies Co., Ltd. | 0 | -100% |
| Space Exploration Technologies Corp. (SpaceX) | 0 | — |
Where to take this analysis
The figures above establish the shape of the field. Turning that into a filing or freedom-to-operate decision means drilling into specific claims, specific assignees, and specific sub-classes that this page can only summarise.
Check freedom to operate before drafting
The under-claimed branches flagged here — feed transition matching, permittivity compensation, near-field OTA fixtures — are starting points, not conclusions. A claim-level search against the most-cited records is the next step before committing to a filing direction.
Explore in Patsnap EurekaTrack the leaders' recent filings directly
Momentum data shows several top assignees at zero publications in the latest tracked year, which publication lag can explain — or which can signal a genuine shift in R&D focus. Either way, it is worth watching directly rather than inferring from a static table.
Explore in Patsnap EurekaCommon questions about this landscape
Antenna-in-package (AiP) integrates the antenna structure into the semiconductor package substrate, alongside the die, rather than on a separate board. An on-chip antenna goes a step further and fabricates the radiating element directly on the silicon die itself. Both approaches aim to shrink module footprint and shorten the feed path from chip to antenna, but AiP is generally favoured for higher-performance mmWave designs because on-chip antennas suffer more from substrate loss and silicon's relatively poor radiation efficiency at these frequencies.
The ranked assignee table in this dataset covers 79 companies drawn from 420 records, with the leading assignee holding 85 records and the top five combined accounting for 51.2% of all records in scope. That leaves a substantial gap down to fifth place at 21 records, and a second tier from fifth to tenth place that is more tightly clustered. Filers span device makers, semiconductor packaging specialists, and automated test equipment companies, reflecting how much of this field's activity is about verifying performance as well as designing the antenna structure itself.
Filings peaked at 83 in 2022 and fell to 31 by 2024, a -48% change over that span, but this should not be read as a technology cooling off. Patent publication typically lags the actual filing date by around 18 months, so 2025 and 2026 figures in any dataset are still incomplete and will rise as more applications publish. The safest complete-year comparison available here is 2021 to 2024, and even that shows a real decline worth watching rather than dismissing.
The clearest signal comes from comparing IPC class shares against the dominant H01Q (antenna structure) class, which covers 63.3% of all 420 records. Classes tied to feed transition and microwave coupling, such as H01P at 5.0%, and packaging-focused classes like H05K at 6.0%, are comparatively thin relative to how central those problems are to AiP performance. Near-field over-the-air test methodology, sitting inside the broader G01R measurement class at 27.4%, is another area where claim density looks lower than the practical engineering challenge would suggest.
Package material permittivity directly affects radiation efficiency, feed transition design, and substrate loss, so claims addressing material compensation techniques recur throughout this dataset's core H01Q and H01L (semiconductor devices, 8.3% of records) classes. Because permittivity and loss tangent vary by substrate supplier and process, many claims are drafted around specific material-and-geometry combinations rather than the general compensation principle. That makes this an area where a freedom-to-operate search needs to check the specific substrate stack being used, not just the general technique.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.