https://www.patsnap.com/resources/blog/rd-blog/area-selective-deposition-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Thin-Film Deposition
Area Selective Deposition Patents: Filing Concentration and Open Claim Space
  • 54.6% of all 357 records in scope sit with the top five assignees — filing here is heavily concentrated rather than fragmented across many small players.
  • Filing peaked in 2023 at 45 records and the 2021→2024 span shows a -26% change, though 2025-2026 counts are still filling in under normal publication lag.
  • H01L covers 84.3% of records while adjacent classes like H10K (9.0%) and G01N (8.7%) carry far fewer filings — a gap worth checking before assuming the core claim space is closed.
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357
Published Records
55%
Top-5 Share of All Records
-26%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (23 records) with 2024 (17) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 357 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··8 min readSourced from Patsnap Eureka
Overview

What the area selective deposition filing record shows

Area selective deposition (ASD) covers methods that grow or inhibit film growth on specific regions of a substrate without a full mask-and-etch cycle — using self-assembled monolayers, selective inhibitors, or growth-rate differentials between exposed materials. The dataset in scope spans 357 published records from 2015 through the 2026-07-31 cut-off, drawn from a search string that combines core ASD terms with bottom-up fill, edge placement error and selectivity-loss language.

Filing is not evenly spread. A small group of assignees — spanning foundries, deposition-tool makers and a research university — account for the majority of records, while a long tail files once or twice. The technology composition leans hard on semiconductor device classes, which is expected given ASD's primary use in advanced logic and memory patterning, but the secondary classes show where the same inhibitor and monolayer chemistry is being adapted for other film stacks.

Filing activity and technology composition, 2015-2026
  1. 1INTEL CORP64
  2. 2PRESIDENT & FELLOWS OF HARVARD COLLEGE36
  3. 3TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD32
  4. 4TOKYO ELECTRON LTD32
  5. 5SEMICON COMPONENTS IND LLC31
  6. 6APPLIED MATERIALS INC29
  7. 7EASTMAN KODAK CO14
  8. 8GELEST INC10
  9. 9INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW)10
  10. 10LAM RES CORP9
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Area Selective Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

The chart below tracks published records by year against the eight leading IPC subclasses found in the corpus. Both series use the same 357-record base described above.

Filing trend, 2017-2026

Annual filings rose to a peak of 45 records in 2023. The 2021-to-2024 span moved from 23 to 17 records, a -26% change; treat 2025 and 2026 as undercounted rather than declining, since publication typically lags filing by roughly 18 months.

Filing trend, 2017-202601325385062017201820192020202120224520232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

H01L (semiconductor devices) appears in 84.3% of the 357 records, far ahead of H10P (26.9%), C23C coating and surface deposition (21.0%), and H10D (19.6%). Because a single record can carry several IPC codes, these shares sum to well over 100% and should be read as overlap, not as a partition of the field.

IPC subclass compositionH01L · Semiconductor devices30184.3%H10P9626.9%C23C · Coating & surface deposition7521.0%H10D · Semiconductor devices (general)7019.6%H10W4312.0%C30B · Crystal growth3610.1%H10K · Organic semiconductors (OLED e…329.0%G01N · Material analysis & testing318.7%Other19354.1%

Shares are the percentage of the 357 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Area Selective Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Most-cited records and a representative recent filing

Representative Filing
US20230282514A12023-09-07

US20230282514A1 — Area selective deposition for zero via enclosure and extremely small metal line end space

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Provided is a method for manufacturing integrated circuit (IC) devices including the operations of forming a first metal pattern (Mx) on a semiconductor substrate, forming a first via pattern (Vx) on the first metal pattern using an area selective deposition (ASD) that includes first and second vias formed adjacent opposed edges or terminal portions of the first metal pattern, and forming a second metal pattern (Mx+1) on the first via pattern with substantially no pattern overlap to form a zero enclosure and wherein a pair of adjacent vias are separated by a distance corresponding to the smallest end-to-end metal pattern spacing permitted under a set of design rules applied during the design.Filed by Taiwan Semiconductor Manufacturing Company, published 2023-09-07.

US20230282514A1 — patent drawing 1US20230282514A1 — patent drawing 2
View full record →
Highest-citation records in the corpus
#Publication no.Patent titleCitations
1US20050167742A1Power semiconductor devices and methods of manufacture722
2US20020130311A1Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabric…639
3US7345342B2Power semiconductor devices and methods of manufacture421
4WO2002017362A2Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabric…273
5US20060214221A1Power semiconductor devices and methods of manufacture249
6WO2005065385A2Power semiconductor devices and methods of manufacture183
7US20060214222A1Power semiconductor devices and methods of manufacture181
8US7211464B2Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabric…151
9US8143124B2Methods of making power semiconductor devices with thick bottom oxide layer149
10US20200083080A1Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and…132

Citation counts accumulate over time, so older records dominate this table by construction — read it as a map of influential prior art, not a ranking of current technical importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Area Selective Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

Reading the concentration and momentum signals

Three figures matter most for anyone deciding where to file or license in ASD: how concentrated the field already is, how the growth curve is bending, and where citation-heavy prior art actually sits.

Concentration
54.6%
of 357 records held by top 5

Filing sits with a small group

The five leading assignees combined account for 195 of the 357 records in scope, or 54.6% of the field. The top ten extend that to 267 records, 74.8% of the total. That leaves a long tail of single- or double-filing entrants working around a densely claimed core.

Denominator: all 357 records in scope.
Growth
-26%
2021 to 2024 change

Momentum cooled after the 2023 peak, on complete years

Filings rose to a peak of 45 records in 2023, then the comparable 2021-to-2024 window moved from 23 down to 17 records, a -26% change. Treat 2025 and 2026 counts as provisional rather than confirming a further decline, since publication lag understates the most recent one to two years.

2024 is the most recent year treated as complete.
Citations
722 citations
on the leading record

Citation weight skews to older power-device art

The most-cited records in this corpus concern power semiconductor devices and doped elongated semiconductor growth, both filed well before the ASD-specific search terms became common claim language. That reflects how citation counts favour age within a searched corpus, not that these are the most relevant filings to current ASD work.

Citation counts favour older records by construction.
Composition
84.3%
of records tagged H01L

Semiconductor device classes dominate, but not exclusively

H01L covers the large majority of records, consistent with ASD's core use in transistor and interconnect patterning. Smaller but non-trivial shares in C30B crystal growth (10.1%) and H10K organic semiconductors (9.0%) mark where the same inhibitor chemistry is being extended beyond logic manufacturing.

Shares sum above 100% because records carry multiple IPC codes.
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to area selective deposition, with the prior art for and against each one.

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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Area Selective Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the field is gated

The assignee ranking returned by the data endpoint covers 100 companies counted in records — this is the full ranking available, not a curated top-50 or top-100 list. A handful of names dominate the count while most of the ranking files only once or twice.

Leader
64 records
single leading assignee

One filer sits well ahead of the field

The leading assignee holds 64 records, more than double the fifth-place count of 31. That gap suggests a foundry-scale filer treating ASD as core process IP rather than an exploratory line.

Counted in records, per the assignee ranking.
Mid-field
31 to 9
fifth to tenth place

The drop-off from fifth to tenth is steep

Fifth place holds 31 records and tenth place holds 9 — a sharper decline than the top-five-to-top-ten aggregate suggests on its own. Firms entering around rank six to ten are filing at a fraction of the leader's rate.

Ranked by record count, not family-weighted.
Co-filing
10 pairs
co-assignee pairings identified

Co-assignment clusters around a small inventor group

Ten co-assignee pairs appear in the data, with the strongest links tied to the same three-person inventor cluster repeating across pairings at a count of 12 each. That pattern points to a specific internal team rather than broad industry co-development.

Strongest pairs share a count of 12.
🔍
Under-claimed sub-areas worth checking before filing
These branches show thinner filing density relative to the core H01L claim space and may still have room for a defensible first claim.
Inhibitor chemistry for OLED stacksSelective growth on crystal-growth substrates (C30B)Etch-back correction for edge placement errorBottom-up fill in high-aspect-ratio viasSAM-based inhibitors for organic semiconductorsSelectivity-loss detection and in-line metrology
Rank all filers by momentum →
Recent-year momentum among leading assignees
AssigneeRecent yearYoY
Intel Corporation0-100%
President and Fellows of Harvard College0—
Tokyo Electron Limited0—
Taiwan Semiconductor Manufacturing Company, Ltd.0-100%
Applied Materials, Inc.0-100%
Fairchild Semiconductor0—
NELSON SHELBY F0—
LEVY DAVID H0—
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Area Selective Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this next

The figures above describe where filing has already happened. Deciding where to file next, or how to design around a blocking claim, needs a closer read of specific families.

Check freedom-to-operate against the leader's claim set

With one assignee holding 64 of 357 records, a freedom-to-operate check against that portfolio should come before committing engineering resources to a similar inhibitor or monolayer approach.

Explore the leader's portfolio in Eureka →

Map the under-claimed branches against your own process

OLED-adjacent inhibitor chemistry and crystal-growth applications show thinner filing density than the H01L core. Confirm whether your process falls inside or outside that thinner-claimed space.

Run a white-space search in Eureka →

Watch for the 2025-2026 filing correction

Because publication lags filing by roughly 18 months, the apparent slowdown after 2023 will firm up over the next reporting cycles. Re-check the trend once 2025 filings finish publishing.

Set a filing alert in Eureka →
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Area Selective Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about area selective deposition patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Area Selective Deposition covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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