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ASHP Simulation & Modeling Patent Snapshot 2026

ASHP Simulation & Modeling Patent Snapshot 2026
Evidence Snapshot
ASHP Simulation & Modeling Patent Snapshot in 2026

The air-source heat pump (ASHP) simulation and modeling patent space is in an early growth stage, with 18 patent families on record and annual filings rising sharply over the past three years. Activity is heavily concentrated in China and fragmented across individual researchers, universities, and a single corporate leader — VENAERA INC — leaving significant room for new entrants with differentiated modeling approaches.

18
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
China
Leading jurisdiction
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Published byPatSnap Insights Team··6 min readVerified by PatSnap Eureka data
Overview

VENAERA INC leads a fragmented, researcher-dominated field

VENAERA INC holds the top position with 3 patent records, ahead of a cluster of institutions and individual inventors each holding 2 records, including Hebei Tsinghua Development Research Institute, Shandong Jianzhu University, and several named researchers.

The top five filers account for 34% of the ranked applicants visible in this query’ combined total, a moderate concentration level for a corpus of this size. The field has no visible incumbent with a decisive lead; instead, a broad second tier of co-equal filers creates an open visible assignee structure.

Leading applicants
#ApplicantPatent recordsShare
1VENAERA INC3
2Hebei Tsinghua Development Research Institute2
3Shandong Jianzhu University2
4Zhang Qiang2
5Cao Yaqi2
6Shi Wenxing2
7Luo Jinghui2
8Beijing Zhongchi Lvyuan New Energy Technology Co., Ltd.2
9Li Xianting2
10Nantong University1
#ApplicantPatent recordsShare
11Hebei Agricultural University1
12China Electric Power Research Institute Co., Ltd.1
13Sichuan Ai’erneng Technology Co., Ltd.1
14Beijing University of Technology1
15Xi’an University of Architecture and Technology1
16Jiangsu Anfang Electric Power Technology1
17Mitsubishi Heavy Industries Haier (Qingdao) Air Conditioners Co., Ltd.1
18CSCEC Southwest Institute (Sichuan) Technology Co., Ltd.1
19State Grid Jiangsu Electric Power Co. Xuzhou Power Supply Company1
20Tianjin Huade Smart Technology Group Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

The absence of a single heavily entrenched corporate assignee implies that technical leadership has not yet been locked in, and that a focused filing program in any of the core IPC branches could establish a defensible position relatively quickly.

The most recent 18–24 months of filings are subject to publication lag and are likely understated; the 20252026 figures should be treated as partial counts. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly.Explore deeper in Eureka →
Trends & Structure

Filings accelerating; heat-pump physics and digital simulation share equal weight

The annual filing trend and IPC composition together show a field that is ramping quickly from a near-zero base, with technical work split evenly between core refrigeration engineering and computational modeling methods.

Annual filing trend

Zero activity was recorded through 2019; filings began in 2020 and have accelerated through 2024, consistent with the 167% recent-window growth figure. The 2025 and 2026 bars are understated due to publication lag and should not be read as a plateau.

Annual filing trendAnnual values from 2017 to 2026, peaking at 6 in 2025.02017020180201922020120211202232023420246202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

F25B (refrigeration and heat pumps) and G06F (electric digital data processing) each account for 10 patent records, making them co-visible branches. G06N (AI-based computing) adds 6 records, signaling meaningful early-stage integration of machine-learning methods into ASHP modeling workflows. F24D, F24F, and G05B each hold smaller shares.

Technology compositionF25B · Refrigeration & heat pumps leads with 10; G06F · Electric digital data processing 10.F25B · Refrigeration & h…10G06F · Electric digital …10G06N · Computing based o…6F24D · Domestic heating …2F24F · Air conditioning …2G05B · Control & regulat…1↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20240318852A1Published 2024-09-26

Modular, Extensible, Smart, Sustainable Air Source…

Venaera INC.

The present teachings provide a modular air source heat pump system (ASHP system) with a plurality of connectors, a plurality of system components, a plurality of sensors, and a control system. The plurality of connectors are quick connectors. a plurality of system components that are individually connected together by one or more of the plurality of… (excerpt from the patent abstract)

Modular, Extensible, Smart, Sustainable Air Source… — patent drawingModular, Extensible, Smart, Sustainable Air Source… — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1一种预测空气源热泵最佳除霜控制点的模型及其建立方法7
2地源-空气源热泵复合系统机组最佳容量确定方法及系统5
3基于二阶ETP模型空气源热泵类负荷蒙特卡洛建模方法5
4面向空调系统的多控制对象建模方法2
5一种空气源热泵控制系统2
6一种空气源热泵与燃气锅炉耦合供暖的仿真可视系统2
7基于清洁供能系统的密闭蛋鸡育雏舍小气候模型搭建方法2
8一种热水型空气源热泵水箱配比及使用模式优化设计方法1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · VENAERA INC

VENAERA INC

VENAERA INC holds 3 patent records, the highest count among all assignees, and is classified as a new entrant — all filings are recent. Its technical focus spans F25B 49 (refrigeration and heat pumps), F24F 11, and F24F 13 (air conditioning and ventilation), indicating a systems-level modeling approach that bridges refrigeration cycle physics and HVAC integration. Its US and PCT filings give it the broadest geographic footprint in the corpus.

families: 3
Challenger · Shandong Jianzhu University

Shandong Jianzhu University

Shandong Jianzhu University holds 2 patent records and is also classified as a new entrant with all activity recent. Its technical focus is concentrated in F25B 30 (refrigeration and heat pumps) and G06F 30 and G06F 111 (digital data processing and simulation), reflecting a computational simulation approach to heat pump performance. It operates within the broader academic ecosystem active in this field.

families: 2
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Hebei Tsinghua Development Research InstituteChina Electric Power Research Institute+ more
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Source: PatSnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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