ASHP Simulation & Modeling Patent Snapshot 2026
The air-source heat pump (ASHP) simulation and modeling patent space is in an early growth stage, with 18 patent families on record and annual filings rising sharply over the past three years. Activity is heavily concentrated in China and fragmented across individual researchers, universities, and a single corporate leader — VENAERA INC — leaving significant room for new entrants with differentiated modeling approaches.
VENAERA INC leads a fragmented, researcher-dominated field
VENAERA INC holds the top position with 3 patent records, ahead of a cluster of institutions and individual inventors each holding 2 records, including Hebei Tsinghua Development Research Institute, Shandong Jianzhu University, and several named researchers.
The top five filers account for 34% of the ranked applicants visible in this query’ combined total, a moderate concentration level for a corpus of this size. The field has no visible incumbent with a decisive lead; instead, a broad second tier of co-equal filers creates an open visible assignee structure.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | VENAERA INC | 3 | |
| 2 | Hebei Tsinghua Development Research Institute | 2 | |
| 3 | Shandong Jianzhu University | 2 | |
| 4 | Zhang Qiang | 2 | |
| 5 | Cao Yaqi | 2 | |
| 6 | Shi Wenxing | 2 | |
| 7 | Luo Jinghui | 2 | |
| 8 | Beijing Zhongchi Lvyuan New Energy Technology Co., Ltd. | 2 | |
| 9 | Li Xianting | 2 | |
| 10 | Nantong University | 1 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 11 | Hebei Agricultural University | 1 | |
| 12 | China Electric Power Research Institute Co., Ltd. | 1 | |
| 13 | Sichuan Ai’erneng Technology Co., Ltd. | 1 | |
| 14 | Beijing University of Technology | 1 | |
| 15 | Xi’an University of Architecture and Technology | 1 | |
| 16 | Jiangsu Anfang Electric Power Technology | 1 | |
| 17 | Mitsubishi Heavy Industries Haier (Qingdao) Air Conditioners Co., Ltd. | 1 | |
| 18 | CSCEC Southwest Institute (Sichuan) Technology Co., Ltd. | 1 | |
| 19 | State Grid Jiangsu Electric Power Co. Xuzhou Power Supply Company | 1 | |
| 20 | Tianjin Huade Smart Technology Group Co., Ltd. | 1 |
The absence of a single heavily entrenched corporate assignee implies that technical leadership has not yet been locked in, and that a focused filing program in any of the core IPC branches could establish a defensible position relatively quickly.
The most recent 18–24 months of filings are subject to publication lag and are likely understated; the 2025–2026 figures should be treated as partial counts. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Filings accelerating; heat-pump physics and digital simulation share equal weight
The annual filing trend and IPC composition together show a field that is ramping quickly from a near-zero base, with technical work split evenly between core refrigeration engineering and computational modeling methods.
Annual filing trend
Zero activity was recorded through 2019; filings began in 2020 and have accelerated through 2024, consistent with the 167% recent-window growth figure. The 2025 and 2026 bars are understated due to publication lag and should not be read as a plateau.
↗ Hover for values · click a bar to ask EurekaTechnology composition
F25B (refrigeration and heat pumps) and G06F (electric digital data processing) each account for 10 patent records, making them co-visible branches. G06N (AI-based computing) adds 6 records, signaling meaningful early-stage integration of machine-learning methods into ASHP modeling workflows. F24D, F24F, and G05B each hold smaller shares.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Modular, Extensible, Smart, Sustainable Air Source…
The present teachings provide a modular air source heat pump system (ASHP system) with a plurality of connectors, a plurality of system components, a plurality of sensors, and a control system. The plurality of connectors are quick connectors. a plurality of system components that are individually connected together by one or more of the plurality of… (excerpt from the patent abstract)


| # | Patent | Citations |
|---|---|---|
| 1 | 一种预测空气源热泵最佳除霜控制点的模型及其建立方法 | 7 |
| 2 | 地源-空气源热泵复合系统机组最佳容量确定方法及系统 | 5 |
| 3 | 基于二阶ETP模型空气源热泵类负荷蒙特卡洛建模方法 | 5 |
| 4 | 面向空调系统的多控制对象建模方法 | 2 |
| 5 | 一种空气源热泵控制系统 | 2 |
| 6 | 一种空气源热泵与燃气锅炉耦合供暖的仿真可视系统 | 2 |
| 7 | 基于清洁供能系统的密闭蛋鸡育雏舍小气候模型搭建方法 | 2 |
| 8 | 一种热水型空气源热泵水箱配比及使用模式优化设计方法 | 1 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
VENAERA INC
VENAERA INC holds 3 patent records, the highest count among all assignees, and is classified as a new entrant — all filings are recent. Its technical focus spans F25B 49 (refrigeration and heat pumps), F24F 11, and F24F 13 (air conditioning and ventilation), indicating a systems-level modeling approach that bridges refrigeration cycle physics and HVAC integration. Its US and PCT filings give it the broadest geographic footprint in the corpus.
families: 3Shandong Jianzhu University
Shandong Jianzhu University holds 2 patent records and is also classified as a new entrant with all activity recent. Its technical focus is concentrated in F25B 30 (refrigeration and heat pumps) and G06F 30 and G06F 111 (digital data processing and simulation), reflecting a computational simulation approach to heat pump performance. It operates within the broader academic ecosystem active in this field.
families: 2Frequently asked questions
The evidence set contains 18 patent families in scope. This is a nascent corpus; the field produced no filings before 2020 and has grown rapidly since.
VENAERA INC leads with 3 patent records, ahead of a cluster of institutions and individual inventors each holding 2 records, including Hebei Tsinghua Development Research Institute, Shandong Jianzhu University, and several named researchers.
China is by far the most active jurisdiction with 15 patent records. The United States has 2 records and WIPO PCT has 1, making non-Chinese coverage very thin relative to the overall corpus.
The two visible IPC branches are F25B (refrigeration and heat pumps) and G06F (electric digital data processing), each with 10 patent records. G06N (AI-based computing) adds 6 records, reflecting early integration of machine-learning methods. F24D, F24F, and G05B each hold smaller shares.
The field is in a Growth stage. Annual filings are still rising from a near-zero base, with recent-window growth of 167%. The most recent filing years are understated due to publication lag, so the apparent slowdown in 2025–2026 data should not be interpreted as a real deceleration.
The sparsest adjacent branches are G05B (control and regulating systems, 1 patent record) and F24F (air conditioning and ventilation, 2 patent records). Both are technically adjacent to the visible modeling core and carry plausible value for ASHP system integration work, yet remain largely unclaimed.
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