This corpus of 114 families covers exactly that intersection, split mainly between semiconductor-device claims (H01L, 51 records) on the die-attach and package side and lighting-component claims (F21V, F21S) on the fixture side. The heaviest claim density is on the die-to-substrate bond itself, meaning new filings there face the most crowded prior art. Housing, lens and mounting-hardware claims are comparatively less contested. A practitioner should search H01L first when checking freedom to operate on a new bonding method.

The dataset shows filings rising to 34 in 2021 before falling to 21 by the 2022 midpoint, with no recovery since. That pattern typically means the foundational architectures — die-attach methods, substrate mounting, basic thermal-interface layouts — were claimed in a concentrated wave, after which later filers had less new ground to stake out. It does not necessarily mean interest in the technology itself declined, since publication lag of roughly 18 months means the most recent years are always undercounted at the time of any given snapshot.

The United States received 54 of the 114 records and the European Patent Office 31, together accounting for the large majority of filings; WIPO, Singapore, Germany and India each hold single digits. A freedom-to-operate search focused on USPTO and EPO prosecution history will therefore cover most of the practical risk in this space, with the smaller offices worth a secondary check rather than a primary one.

That record claims a replaceable water-cooling module where the cooling head sits outside the housing and the LED substrate is mounted from inside over the same opening, with the substrate's bottom surface in direct contact with the cooling head's base through the opening — using detachable fasteners on both sides. It is the direct-contact, dual-detachable-mount structure that is claimed, not water-cooling of LED headlamps generally. A design that uses an intermediate thermal pad, a sealed non-detachable joint, or routes coolant differently would sit outside its literal claim scope, though a design-around should still be checked against the citing family it has accumulated.

Based on the IPC distribution, the vehicle-integration adjacencies — hybrid-drivetrain-linked lighting control under B60W and driver-monitoring integration under H04N — carry noticeably fewer records than the core H01L and F21V subclasses, at 12 and 12 respectively versus 51 and 26. Non-metallic thermal interface compounds and detachable substrate-to-heatsink fastening geometries also appear less densely claimed relative to direct die-to-coolant contact structures. These are reasonable areas to scope a new filing, though a full novelty search against the specific sub-claims is still necessary before committing.