Backside Thermal Management Patents: Leaders & Filing Trends 2026
- Concentration is moderate, not dominant. the top 5 assignees hold 38.6% of all 70 records in scope, and it takes ten firms to reach 58.6% — a leader exists but the field is not locked up.
- Temperature measurement outweighs the semiconductor structure itself. G01K appears on 35.7% of records, ahead of H01L semiconductor devices at 21.4%, suggesting sensing and calibration claims are as contested as the heat-extraction structures.
- Filing activity peaked in 2019 at 6 records and has not returned there. 2021 to 2024 shows a -100% swing on the evidence, though 2025-2026 figures are still filling in given typical 18-month publication lag.
Filing growth compares 2021 (3 records) with 2024 (0) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 70 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
Backside thermal management addresses how heat is pulled out of a stacked die from the substrate side rather than the front metal stack — relevant wherever junction temperature, thermal resistance and self heating intersect with substrate removal or buried thermal rails. The dataset in scope combines claims on physical heat-extraction structures with claims on the sensing and modelling layer that measures and predicts hot spots, which is why temperature-measurement classes sit alongside semiconductor-device classes in the composition.
70 published records sit in scope, spanning 2015 through the 2026-07-31 cut-off, with the assignee ranking covering 41 companies counted by record. The mix of receiving offices — led by the United States, then China, Europe, India, Japan and WIPO filings — points to a field prosecuted mainly through US filings with a secondary but real international footprint.
Filing trend and technology composition
Two views of the same 70 records: when they were filed, and which IPC subclasses they carry. Because a record can sit in more than one subclass, the composition shares add up to more than 100% of the record total.
Filing trend, 2017-2026
Activity opened slowly, reached a peak of 6 records in 2019, and has since been uneven; the -100% change from 2021 (3 records) to 2024 (0 records) is the clearest complete-year signal, and the 2025-2026 tail is still understated pending publication lag.
Technology composition by IPC subclass
G01K temperature measurement leads at 35.7% of the 70 records, followed by H01L semiconductor devices at 21.4% and G06F digital data processing at 20.0%, with G01R electric measurement, H05B heating circuits, H10D semiconductor devices general, H01M batteries and H05K printed circuits each appearing on a smaller but non-trivial share.
Shares are the percentage of the 70 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Backside Thermal Management in Stacked Devices with Eureka
This page is one run against one query. Ask Eureka your own question about backside thermal management in stacked devices and every answer comes back with the patent numbers behind it.
Try EurekaMost-cited records in the corpus
Accurate battery temperature measurement by compensating self heating
A method for accurately measuring a battery temperature using a temperature sensor embodied in a battery monitoring integrated circuit: the method calibrates a thermal resistance between the monitoring circuit and a battery terminal, measures temperature and terminal or supply-pin voltage during charge or discharge, calculates power from voltage and current, and applies a self-heating temperature adjustment derived from that power and the thermal resistance.US20200274207A1 · Datang NXP Semiconductors Co., Ltd. · filed 2020-08-27
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20070168151A1 | Model predictive thermal management | 75 |
| 2 | US5233161A | Method for self regulating CMOS digital microcircuit burn-in without ovens | 64 |
| 3 | US7574321B2 | Model predictive thermal management | 59 |
| 4 | US20100285571A1 | Systems and methods for auto-calibration of resistive temperature sensors | 47 |
| 5 | US5898246A | Control of reluctance dynamoelectric machine cooling fluid | 39 |
| 6 | US6158885A | Thermocouple-to-extension wire ambient temperature error correction device | 27 |
| 7 | CN105510793A | 一种变流器IGBT功率模块结温测量的自标定方法 | 25 |
| 8 | US20090016408A1 | System for extending the operating temperature range of high power devices | 22 |
| 9 | CN103822731A | 一种VDMOS器件结温的测试方法 | 20 |
| 10 | US20130229231A1 | Differential circuit compensating gain enhancement due to self heating of transistors | 20 |
Citation counts inside a searched corpus favour older filings that have had more time to accumulate references — read this as a signal of influence on the field's early framing, not of current commercial weight.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
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Three signals worth separating before drawing conclusions about where to file or watch.
A leader, not a lock
The leading assignee holds 6 records and the top 5 combine for 38.6% of the 70 records in scope; reaching 58.6% takes ten firms. That is enough concentration to name a leader, but the drop to fifth place (5 records) and tenth place (2 records) shows a genuine long tail rather than a two-firm duopoly.
Activity has not sustained its 2019 peak
Filings rose to 6 in 2019 and the 2021-to-2024 window shows a -100% change on the complete-year figures (3 records down to 0). Because publication lags filing by roughly 18 months, 2025 and 2026 figures will fill in further and should not yet be read as a continued decline.
Sensing claims outweigh structural claims
G01K temperature measurement appears on more records (35.7%) than H01L semiconductor devices (21.4%), and G06F digital data processing sits close behind at 20.0%. Anyone assessing freedom to operate here needs to clear the sensing and control-software claims, not just the physical heat-extraction structure.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to backside thermal management in stacked devices, with the prior art for and against each one.
Who is filing, and where the openings sit
The ranked leaders span large semiconductor manufacturers, IDMs and a scatter of single- or few-filing entrants — a pattern consistent with a technology still being claimed from several directions at once.
A single leader, moderate lead
The top-ranked assignee holds 6 records against 5 for fifth place — a real but not commanding lead. No single firm's momentum in the evidence shows continued filing into the latest year, which is consistent with a corpus still working through publication lag rather than a field that has gone quiet.
Ten firms, not two, hold the majority
It takes ten assignees combined to pass the halfway mark of the corpus at 58.6% of the 70 records. That spread across IDMs, foundries and a handful of research and single-filing entrants suggests the field rewards a specific claim angle more than sheer filing volume.
Collaboration is limited and concentrated
Only 7 co-assignee pairs appear in the corpus, with the strongest pairing appearing 4 times. Most records are filed by a single assignee, so joint-development signals here are the exception rather than the rule.
| Assignee | Recent year | YoY |
|---|---|---|
| International Business Machines Corporation (IBM) | 0 | — |
| Koninklijke Philips N.V. | 0 | — |
| Fielstorm Ltd. | 0 | — |
| Jiangsu Tongxin Semiconductor Co., Ltd. | 0 | — |
| Canon U.S. Life Sciences, Inc. | 0 | — |
| KERNAHAN KENT | 0 | — |
| NEC IC Microcomputer Systems, Ltd. | 0 | — |
| Beijing University of Technology | 0 | — |
Where to take this
The landscape numbers point to specific next questions rather than a single conclusion.
Check freedom to operate on the sensing layer first
Because G01K temperature-measurement claims outnumber H01L structural claims in this corpus, a freedom-to-operate review that starts and ends with heat-extraction hardware will miss the denser claim territory.
Run a claim-level search in Eureka →Track the 2025-2026 publication tail
The apparent post-2021 falloff is partly a publication-lag artefact; revisit the trend once 2025 filings finish publishing before concluding the field has cooled.
Set a monitoring alert in Eureka →Map the under-claimed branches against your own roadmap
Battery self-heating compensation and electrothermal co-simulation both show thinner filing density than the core structural claims, which may be room to file rather than a sign of low value.
Explore white space in Eureka →Common questions about this landscape
The corpus of 70 records shows a moderately concentrated field: the top-ranked assignee holds 6 records, and the top 5 assignees combined account for 38.6% of all records in scope. It takes ten assignees together to reach 58.6% of the corpus, so while a leader exists, more than half the field is spread across a long tail of firms filing fewer records each. The ranking itself covers 41 companies, so treat any single name as a leader within that group rather than a dominant monopolist.
Filing peaked at 6 records in 2019 and the most recent complete-year comparison, 2021 to 2024, shows a -100% change (3 records down to 0). That looks like a decline, but publication typically lags filing by around 18 months, so 2025 and 2026 figures in this dataset are still incomplete and should not yet be read as confirmation of a continued drop. A fair read is that activity has been uneven since the 2019 peak rather than in a settled trend either way.
Temperature measurement (IPC class G01K) appears on 35.7% of the 70 records, more than any other class, ahead of semiconductor devices (H01L) at 21.4% and digital data processing (G06F) at 20.0%. Because a single record can carry multiple IPC classes, these shares add up to more than 100% of the record total — they describe overlap, not a strict breakdown. The pattern indicates that sensing, calibration and control-software claims are at least as contested as the physical heat-extraction structures themselves.
Relative to the density of core sensing and structural claims, branches such as buried thermal rail routing specifics, electrothermal co-simulation methods for 3D stacks, and battery-cell self-heating compensation circuitry show thinner filing coverage in this corpus. These are not guaranteed to be free of prior art, but they carry less claim density than the crowded temperature-measurement and semiconductor-structure classes. A targeted prior-art search on the specific sub-claim language is the next step before filing in any of these areas.
The United States leads receiving offices with 36 filings in this dataset, followed by China at 8, Europe (EPO) and India each at 6, Japan at 4, and WIPO (PCT) filings at 3. This distribution suggests prosecution strategy in the field centres on the US market first, with China and Europe as clear secondary jurisdictions and PCT used selectively rather than as the default route.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.