Binder Jetting Patent Landscape 2026
Binder jetting IP is highly concentrated, with Desktop Metal Inc holding a commanding lead and the top five filers collectively controlling 42% of the hundred largest filers’ combined output. The field remains in a multi-year growth phase, with recent three-year filings running 67% above the prior three-year window, even as annual volume has eased from its 2022 peak.
Desktop Metal leads a concentrated field with a deepening gap to challengers
Desktop Metal Inc sits atop the applicant ranking with 54 patent families, more than double the nearest rival, Evonik Operations GmbH at 22 patent families. General Electric Co, Hoeganaes Corp, and Topgolf Callaway Brands Corp follow at 11, 9, and 9 patent families respectively.
The top five filers account for 42% of the hundred largest filers’ combined total, a level of concentration that signals a winner-take-most dynamic. The gap between the first and second tiers is wide enough that challengers would need sustained multi-year campaigns to close it.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Desktop Metal Inc | 54 | |
| 2 | Evonik Operations GmbH | 22 | |
| 3 | General Electric Co | 11 | |
| 4 | Hoeganaes Corp | 9 | |
| 5 | Topgolf Callaway Brands Corp | 9 | |
| 6 | KOREA INST OF CERAMIC ENG & TECH | 9 | |
| 7 | Sandvik Intellectual Property AB | 6 | |
| 8 | Qdot Tech Ltd | 6 | |
| 9 | A&S BUSINESS GRP PTY LTD | 5 | |
| 10 | Sandvik Machining Solutions AB | 5 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | Stackpole International Powder Metal ULC | 5 | |
| 12 | Keracel Inc | 4 | |
| 13 | Infinite Composites Inc | 4 | |
| 14 | Ceramic Additive Manufacturing Ltd | 3 | |
| 15 | Suleyman Demirel University | 3 | |
| 16 | Goodrich Corp | 3 | |
| 17 | The Nano Co Inc | 3 | |
| 18 | Hitachi Ltd | 3 | |
| 19 | Evove Ltd | 3 | |
| 20 | The Boeing Co | 3 |
Desktop Metal’s lead reflects an integrated strategy spanning printing hardware, powder metallurgy, and process control — making it simultaneously a platform owner and a materials-science player. This dual positioning creates high barriers for new entrants who must compete on two fronts at once.
Filing counts for 2024 and 2025 are understated due to the standard 12–18 month patent publication lag; apparent softness in those years should not be interpreted as a real decline. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Multi-year growth persists across a broad technology mix anchored in AM and powder metallurgy
The annual filing trend and technology composition together reveal a field that has expanded substantially from its 2017 baseline while diversifying beyond its core 3D-printing classification into materials and process chemistry.
Annual filing trend
Annual filings rose from 34 families in 2017, dipped through 2019–2021, then surged to a peak of 44 in 2022 and held near that level at 42 in 2023. The 2024 and 2025 figures are understated by publication lag and should not be read as a sustained downturn. On a three-year rolling basis the recent window sits 67% above the prior window, confirming genuine multi-year expansion.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B33Y (Additive manufacturing) dominates with 243 records, closely tracked by B22F (Powder metallurgy) at 185 — reflecting that binder jetting IP is as much about metal-powder science as print process. B29C (Shaping of plastics) at 122 records shows significant polymer binder activity. Smaller but notable branches include B28B (clay and cement shaping), C22C (alloys), C09D (coatings and inks), and C04B (ceramics), pointing to active diversification into construction, refractory, and specialty-material substrates.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Chemical grafting agent for binder jetting of stro…
A method of binder jetting strong green parts using a chemical grafting agent is disclosed. The method includes preparing a binder and a powder for binder jetting. The binder may comprise a first sorbent and the powder may comprise a second sorbent. The chemical grafting agent is introduced to enable covalent bonding between the binder and the powder. The… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | System for fabricating an interface layer to separ… | 87 |
| 2 | Reversible binders for use in binder jetting addit… | 63 |
| 3 | Thermoplastic binders for use in binder jetting ad… | 38 |
| 4 | Method for fabricating an interface layer to separ… | 38 |
| 5 | Infiltrated Segregated Ferrous Materials | 36 |
| 6 | Method of making cermet or cemented carbide powder | 36 |
| 7 | Powder dispensing in binder jetting for additive m… | 24 |
| 8 | Automated depowdering of 3D printed objects | 23 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the competitive structure means for R&D investment decisions
Three structural signals — life-cycle stage, applicant concentration, geographic footprint, and collaboration patterns — together define the risk-reward landscape for teams considering entry or expansion in binder jetting.
Growth stage, past its 2022 volume peak
The field is classified in the Growth stage: the recent three-year filing window is 67% above the prior three-year window, confirming that cumulative activity is still expanding. However, annual volume peaked in 2022 and has moderated since, with 2024–2025 figures further compressed by publication lag. Teams entering now face an established but not yet saturated IP landscape.
Life-cycle: GrowthOne dominant incumbent, a thin second tier
Desktop Metal Inc’s 54-family portfolio is more than twice Evonik Operations GmbH’s 22 families, and the top five filers together represent 42% of the hundred largest filers’ combined total. This tier gap makes organic catch-up difficult; licensing, acquisition, or narrow white-space strategies are more realistic entry paths for second-tier players.
High concentrationNo co-applicant activity detected in this corpus
The evidence shows no co-applicant filing relationships within the binder jetting corpus, suggesting that innovation has so far been pursued through proprietary rather than consortium or joint-development models. This absence of collaboration may itself be an opportunity: cross-sector partnerships — for example, between powder suppliers and equipment makers — remain unexplored from an IP standpoint.
Collaboration: none on recordUS-centric with modest PCT and European reach
The United States leads jurisdictional filing with 99 records, followed by WIPO PCT at 41 and Europe (EPO) at 32. South Korea appears at 18 records, driven in part by the Korea Institute of Ceramic Engineering and Technology. China holds only 9 records, a notably low figure for a manufacturing-intensive technology, suggesting either deliberate IP strategy or underdeveloped local R&D that a new entrant could exploit.
US-dominantGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
Co-filing pairs, ranked by the number of jointly-filed patent families.
Desktop Metal leads on breadth; Evonik anchors the polymer-binder route
Two distinct strategic profiles emerge at the top of the ranking: a vertically integrated platform player and a specialty-chemistry incumbent whose binder expertise extends across multiple AM modalities.
Desktop Metal Inc
With 54 patent families, Desktop Metal Inc holds roughly 2.5 times the portfolio of its nearest rival. Its technology focus spans B33Y 10 (AM process), B33Y 30 (AM apparatus), and B22F 1 (powder metallurgy feedstocks), reflecting a deliberate strategy to own the full hardware-materials-process stack. Recent three-year momentum is up 67% versus the prior window, indicating that the portfolio is still actively growing rather than coasting.
54 patent familiesEvonik Operations GmbH
Evonik Operations GmbH holds 22 patent families, concentrated in B29C 64 (plastics shaping), B33Y 10, and B33Y 70 (AM materials), positioning it as the leading polymer-binder and specialty-powder supplier in the corpus. Its focus on materials chemistry rather than equipment means it competes obliquely with Desktop Metal — and could serve as a supplier or partner to hardware-focused entrants. Momentum data for Evonik is not separately listed in the recent-period breakdown, suggesting its filings predate the most recent surge.
22 patent families| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| Desktop Metal Inc | 20 | ▲ +67% |
| General Electric Co | 3 | ▲ new entrant |
| Korea Institute of Ceramic Engineering and Technology | 5 | ▲ new entrant |
| Topgolf Callaway Brands Corp | 8 | ▲ new entrant |
| Digital Metal AB | 8 | ▲ new entrant |
| Hoeganaes Corp | 7 | ▲ new entrant |
| Sandvik Intellectual Property AB | 2 | ▲ new entrant |
| Qdot Tech Ltd | 5 | ▲ new entrant |
Under-served branches in ceramics, alloys, inks, and polymer formulation
Several IPC branches appear at low relative share within the binder jetting corpus despite clear technical adjacency. These are observations of relative sparsity; whether each constitutes a viable entry point depends on the team’s materials capabilities and target application.
C04B · Ceramics, cement & refractories
C04B holds 23 records — just 3% share among the top branches — despite ceramics being a well-established substrate for binder jetting in aerospace and medical applications. The Korea Institute of Ceramic Engineering and Technology is the most active filer in the adjacent B28B branch, but C04B-specific binder chemistry and sintering protocols for technical ceramics remain sparsely covered. Teams with refractory or structural-ceramic expertise and access to fine-powder supply chains have a plausible technical and commercial entry path.
Search this in Eureka →C22C · Alloys
C22C (alloys) carries 27 records at 3% share, suggesting that alloy composition tailored specifically for binder jetting feedstocks — as distinct from general powder metallurgy — is underdeveloped in the IP record. Desktop Metal and Sandvik hold powder-metallurgy positions in B22F, but custom alloy design for printability (particle morphology, binder compatibility, post-sinter shrinkage) appears to be an adjacent branch with limited dedicated coverage. Metallurgy-focused labs or specialty alloy producers could address this gap.
Search this in Eureka →How leading applicants differ across technology routes
Route coverage across the main technology branches in the current evidence set.
| Player | B33Y 10 · Additive manufacturing (3D printing) | B22F 10 · Powder metallurgy | B29C 64 · Shaping of plastics | B33Y 70 · Additive manufacturing (3D printing) | B33Y 30 · Additive manufacturing (3D printing) |
|---|---|---|---|---|---|
| Desktop Metal Inc | Strong · 44 | Strong · 25 | Strong · 29 | Moderate · 12 | Strong · 35 |
| Evonik Operations GmbH | Strong · 16 | Moderate · 8 | Strong · 16 | Strong · 14 | Absent |
| General Electric Co | Strong · 13 | Moderate · 6 | Moderate · 4 | Moderate · 5 | Strong · 9 |
| Rohm GmbH | Strong · 8 | Absent | Strong · 8 | Strong · 8 | Absent |
| Korea Institute of Ceramic Engineering and Technology | Strong · 7 | Absent | Strong · 4 | Strong · 7 | Moderate · 2 |
| Digital Metal AB | Absent | Strong · 8 | Moderate · 4 | Absent | Strong · 8 |
| Hoeganaes Corp | Strong · 5 | Strong · 7 | Absent | Strong · 7 | Absent |
Frequently asked questions
The corpus contains 245 patent families in scope, representing dedicated binder jetting activity distinct from broader additive manufacturing portfolios.
Desktop Metal Inc leads with 54 patent families, more than double the second-ranked filer, Evonik Operations GmbH, which holds 22 patent families.
The field is classified as Growth stage: the most recent three-year filing window is 67% above the prior three-year window. Annual volume did peak in 2022 at 44 families and has moderated since, but the 2024–2025 figures are further compressed by publication lag and should not be read as a structural decline.
The United States leads with 99 records, followed by WIPO PCT at 41 and Europe (EPO) at 32. South Korea holds 18 records. China is notably low at 9 records for a manufacturing-intensive technology.
The most-cited work covers interface-layer fabrication systems (87 citations), reversible binders for binder jetting (63 citations), and thermoplastic binders for binder jetting (38 citations), with additional high-cited work on infiltrated ferrous materials and cermet powder methods.
No co-applicant filing relationships are detected within this corpus. Innovation appears to be pursued through proprietary strategies rather than consortia or joint-development agreements, leaving cross-sector collaboration as an unexplored IP approach.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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