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Binder Jetting Process Patent Landscape 2026

Binder Jetting Process Patent Landscape 2026
Competitive Landscape
Binder Jetting Process Patent Landscape in 2026

Binder jetting IP is moderately concentrated, with Desktop Metal commanding the leading position among a small cohort of active filers spanning metal powder, ceramics, and sports equipment applications. The field is still expanding on a multi-year basis, with recent three-year filings well above the prior window, though annual volume has eased from its 2023 peak.

197
Patent families in scope
42%
Top-5 share of top-100 filers
+77%
3-yr filing growth (lag-adj.)
United States
Leading jurisdiction
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Published byPatSnap Insights Team··6 min readVerified by PatSnap Eureka data
Overview

Desktop Metal leads a moderately concentrated field with a long tail of niche filers

Desktop Metal holds the top-ranked position with 47 patent families, nearly three times the output of the second-ranked applicant, Topgolf Callaway Brands Corp, at 15 patent families — establishing a pronounced tier gap at the very top of the field.

The top five filers account for 42% of the combined total among the hundred largest filers, indicating moderate-to-high concentration at the apex but meaningful activity distributed across a broader set of specialist entrants, including Hoeganaes Corp, General Electric, and Honeywell International.

Leading applicants
#ApplicantPatent familiesShare
1Desktop Metal Inc47
2Topgolf Callaway Brands Corp15
3Hoeganaes Corp9
4General Electric Co7
5Honeywell International Inc7
6General Electric Renovables Espana SL7
7UT-Battelle LLC5
8A&S BUSINESS GRP PTY LTD5
9CONCR3DE BV5
10Sandvik Machining Solutions AB5
#ApplicantPatent familiesShare
11Keracel Inc4
123M Innovative Properties Co4
13South China University of Technology3
14Suleyman Demirel University3
15University of Aveiro3
16Porcelanas da Costa Verde SA3
17Atomik AM Ltd3
18The Nano Co Inc3
19Evove Ltd3
20The Boeing Co3
↗ Hover a row · click a company to ask Eureka

Desktop Metal’s dominant position reflects a deliberate platform strategy covering process equipment, binder chemistry, and post-processing, while mid-tier players tend to cluster around specific material classes or end-use verticals, suggesting the field has not yet converged on a single dominant architecture.

Filing counts for 2024 and 2025 are understated due to publication lag and should not be interpreted as a slowdown; the scope covers global patent families with the. United States as the lead office. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope.Explore deeper in Eureka →
Trends & Structure

Multi-year filing growth with additive manufacturing and powder metallurgy dominating the technology mix

Annual filings rose sharply from 2017 and reached a 2023 peak before easing, a pattern consistent with a maturing but still active growth phase; the recent three-year window sits 77% above the prior three-year window. The technology composition is anchored in two core branches — additive manufacturing (B33Y) and powder metallurgy (B22F) — with plastics shaping (B29C) forming a distinct secondary cluster.

Annual filing trend

Filings climbed from 6 in 2017 to a high of 37 in 2023, then recorded 21 in 2024 and 13 in 2025; the 2024–2025 figures are understated by publication lag and should not be read as a structural decline.

Annual filing trendAnnual values from 2017 to 2026, peaking at 37 in 2023.6201733201813201915202024202134202237202321202413202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

B33Y (additive manufacturing) and B22F (powder metallurgy) dominate, reflecting the process-and-feedstock pairing that defines binder jetting; B29C (plastics shaping) and B28B (clay and cement products) appear as meaningful secondary branches, while C22C (alloys), A63B (sports equipment), and C04B (ceramics) mark specialized application verticals.

Technology compositionB33Y · Additive manufacturing (3D printing) leads with 195; B22F · Powder metallurgy 161.B33Y · Additive manufact…195B22F · Powder metallurgy161B29C · Shaping of plastics91B28B · Shaping clay & ce…25C22C · Alloys24A63B · Sports & gymnasti…16C04B · Ceramics, cement …13B08B · Cleaning (general)8↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20220410274A1Published 2022-12-29

Method of compensating for sintering warpage due t…

Desktop METAL, INC.

A method of compensating for sintering warpage due to powder spreading density variations in binder jetting additive manufacturing, including receiving an initial design file defining an object geometry, representing the object geometry as a part mesh and filling the mesh with a grid of voxels to create a voxel grid, each voxel having at least one shrinkage… (excerpt from the patent abstract)

Method of compensating for sintering warpage due t… — patent drawingMethod of compensating for sintering warpage due t… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1System for fabricating an interface layer to separ…87
2Reversible binders for use in binder jetting addit…63
3Thermoplastic binders for use in binder jetting ad…38
4Method for fabricating an interface layer to separ…38
5Infiltrated Segregated Ferrous Materials36
6Powder dispensing in binder jetting for additive m…24
7Automated depowdering of 3D printed objects23
8Method of making a pre-sintered preform20

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the competitive structure implies for R&D investment decisions

The combination of a clear leader, a 77% multi-year growth signal, moderate concentration, and sparse adjacent branches points to a field where targeted technical differentiation — particularly in materials and post-processing — can still yield defensible IP positions.

Growth

Growth phase, past its 2023 annual peak but multi-year expansion intact

The field carries a Growth lifecycle designation: recent three-year filings sit 77% above the prior three-year window, confirming multi-year expansion. Annual volume eased from the 2023 peak of 37 filings, but publication lag means 2024–2025 data understate true activity. Entrants still have a realistic window to establish IP before the field matures further.

Growth · past 2023 peak
Concentration

One dominant player, a shallow mid-tier, and an active long tail

Desktop Metal’s 47 patent families are nearly triple the second-ranked applicant’s 15, creating a significant moat at the top. The top five filers hold 42% of the hundred largest filers’ combined total, while ranked applicants 6–20 each hold single-digit family counts. New entrants are more likely to differentiate through material or application specificity than to challenge the leader on process breadth.

Moderate-high concentration
Collaboration

Minimal co-filing activity; UT-Battelle and University of Tennessee Research Foundation are the only identified co-filers

The evidence shows two co-filing pairs, both involving UT-Battelle (the operating arm of Oak Ridge National Laboratory) together with ExOne and with the University of Tennessee Research Foundation respectively, each with a single shared family. Co-development activity is sparse relative to the total corpus, suggesting that most IP is generated within single-entity R&D programmes rather than through consortium or academic partnerships.

Low collaboration density
Geography

US-centric protection with selective EPO and PCT coverage; Asia under-filed

The United States leads with 103 patent records, followed by EPO and WIPO PCT filings at 34 each, indicating that leading applicants are pursuing transatlantic protection as a baseline. China holds only 9 records and South Korea 7, a low share given both markets’ manufacturing scale — representing either a strategic gap or deliberate prioritisation of Western markets by current filers.

US-led · Asia sparse
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Top collaboration links
ApplicantCollaboratorCo-filings
UT-Battelle LLCExOne LLC1
UT-Battelle LLCUniversity of Tennessee Research Foundation1

Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: PatSnap Eureka. Insights derived from applicant ranking, lifecycle, collaboration, and jurisdiction evidence.Explore insights →
Leaders

Desktop Metal anchors process IP; Topgolf Callaway Brands leads a sports-equipment application vertical

The two largest filers illustrate the breadth of binder jetting IP: Desktop Metal is a platform-level process owner across metals and polymer-mixed feedstocks, while Topgolf Callaway Brands represents a compelling case of a product-focused company building deep process IP for a single end-use vertical.

Leader · Desktop Metal

Desktop Metal Inc

Desktop Metal holds 47 patent families — the largest portfolio in the corpus — concentrated in additive manufacturing process steps (B33Y10, B33Y30) and powder metallurgy feedstock engineering (B22F1). Its applicant momentum is flagged as a new entrant in the most recent measurement window with 14 recent families, reflecting a concentrated burst of filing activity rather than a long legacy position. The portfolio breadth across process, equipment, and materials makes it the single most comprehensive IP holder in the field.

families: 47
Challenger · Topgolf Callaway Brands

Topgolf Callaway Brands Corp

Topgolf Callaway Brands holds 15 patent families and is the clearest example of vertical-application IP strategy in the corpus, with its top technology focus in sports and gymnastics equipment (A63B53) alongside powder metallurgy (B22F10) and additive manufacturing process steps (B33Y10). With 11 recent families, its momentum is also flagged as a new entrant, suggesting a rapid ramp-up in binder jetting IP specifically for precision sports equipment manufacturing.

families: 15
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Hoeganaes CorpHoneywell International Inc+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
Desktop Metal Inc14▲ new entrant
General Electric Co3▲ new entrant
Topgolf Callaway Brands Corp11▲ new entrant
Digital Metal AB8▲ new entrant
Hoeganaes Corp7▲ new entrant
Sandvik Machining Solutions AB1▲ new entrant
UT-Battelle LLC4▲ new entrant
CONCR3DE BV5▲ new entrant
Source: PatSnap Eureka. Player profiles draw on applicant ranking, technology focus, and momentum data.Explore players →
Adjacent Branches

Ceramics, alloy composition, and cleaning/depowdering are under-served relative to core process classes

Several IPC branches with plausible technical relevance to binder jetting carry low patent counts, pointing to areas where IP density is sparse relative to the dominant process and powder metallurgy classes. These are observations of relative sparsity; only branches with a plausible technical rationale and realistic entry path are highlighted as worth watching.

C04B · Ceramics, cement & refractories

With only 13 patent records against 195 in the dominant B33Y class, ceramic binder jetting is materially under-filed relative to its technical importance: ceramic components for aerospace, medical implants, and energy applications are a known growth target for binder jetting. The adjacent B28B branch (clay and cement, 25 records) is larger but still sparse. An entrant with expertise in ceramic powder characterisation, binder-ceramic compatibility, or sintering process control could build a differentiated position here with relatively low existing IP density to navigate.

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B08B · Cleaning (general) — depowdering and post-process removal

B08B holds only 8 patent records, yet depowdering and cleaning of binder-jetted parts is a well-documented process bottleneck that limits throughput and surface quality. The most-cited patent in the corpus (‘Automated depowdering of 3D printed objects’) confirms that this sub-problem is technically recognised but has attracted limited dedicated IP. An organisation developing automated depowdering hardware, ultrasonic or fluidic cleaning methods, or integrated cleaning modules could enter a sparse branch with direct commercial relevance to production-scale binder jetting operations.

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Unlock the full white-space map
See patent density, filing velocity, and entry-path analysis for all adjacent IPC branches in binder jetting.
C22C · Alloys — binder-jetted alloy composition IPG06F · Digital process control and simulation for binder jetting+ more
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Source: PatSnap Eureka. Branch counts reflect patent records; sparsity is relative to the dominant B33Y and B22F classes.Explore emerging →
Route Matrix

How leaders diverge across process, material, and application technology routes

Route coverage across the main technology branches in the current evidence set.

PlayerB33Y 10 · Additive manufacturing (3D printing)B22F 10 · Powder metallurgyB29C 64 · Shaping of plasticsB33Y 30 · Additive manufacturing (3D printing)B22F 3 · Powder metallurgy
Desktop Metal IncStrong · 39Strong · 25Strong · 22Strong · 29Strong · 21
General Electric CoStrong · 18Moderate · 7Strong · 10Strong · 10Moderate · 9
Topgolf Callaway Brands CorpStrong · 13Strong · 13Moderate · 4AbsentModerate · 4
CONCR3DE BVStrong · 5Strong · 5Strong · 5Strong · 5Absent
Digital Metal ABAbsentStrong · 8Moderate · 4Strong · 8Absent
Honeywell International IncStrong · 7AbsentAbsentAbsentStrong · 7
Hoeganaes CorpStrong · 5Strong · 7AbsentAbsentModerate · 2
Source: PatSnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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