BAW Resonator Patents: Top Companies & Filing Trends 2026
- Top-heavy field. the five largest filers hold 33.5% of all 2,010 records in scope, and the ranked leaders' top ten hold 48.1% — most of the remaining 100 ranked companies file in single digits.
- Filing has cooled from its 2021 peak. activity hit 238 records in 2021 and fell to 103 by 2024, a 57% drop over that span, though 2025-2026 figures are still filling in due to publication lag.
- One IPC subclass dominates the claim space. H03H (impedance networks & filters) appears on 89.9% of all records, while adjacent classes like G01P and H04R sit at 1.0% each — a sign of where claim space is thin.
Filing growth compares 2021 (238 records) with 2024 (103) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 2,010 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This dataset tracks 2,010 published records matching bulk acoustic wave resonator, film bulk acoustic resonator and BAW resonator terminology, filtered to documents that also address acoustic reflectors, electromechanical coupling, spurious modes, quality factor, piezoelectric thin film composition, or resonance frequency trimming. The window runs from 2015 through the 2026-07-31 cut-off, capturing the period in which BAW resonators moved from RF filter niche components into mainstream 5G front-end modules.
Filing concentrates in a small set of assignees and in one dominant IPC subclass, but the receiving-office spread and the long tail of single-filing entrants both point to a technology still being contested at the margins rather than settled at the core.
Let an AI agent run this analysis on your own technology
Pick a task. Every answer cites the patents behind it.
Filing trend and technology composition
Two views of the same 2,010-record set: how filing volume has moved year over year, and which IPC subclasses carry the claim density.
Filing activity, 2017-2026
Annual filings rose to a peak of 238 records in 2021, then declined to 103 by 2024 — a 57% fall over that three-year span. Records from 2025 onward are undercounted because publication typically lags filing by around 18 months; the visible drop after 2024 should not be read as a slowdown yet.
IPC subclass distribution
H03H (impedance networks & filters) covers 89.9% of the 2,010 records, confirming that most filings are framed as filter or resonator-network structures rather than standalone material or device claims. H10N and H01L, at 20.0% and 16.7%, reflect the solid-state device and semiconductor-fabrication side of the same filings. Because a single record can carry several IPC classes, these percentages are each measured against the full 2,010-record total and do not sum to 100%.
Shares are the percentage of the 2,010 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Bulk Acoustic Wave Resonator Structures with Eureka
This page is one run against one query. Ask Eureka your own question about bulk acoustic wave resonator structures and every answer comes back with the patent numbers behind it.
Try EurekaMost-cited records in this landscape
Thin film bulk acoustic resonator and method of producing the same (US20020190814A1)
A pit is formed in a silicon substrate carrying a silicon oxide layer, over which a sandwich structure of piezoelectric material between lower and upper electrodes is suspended. The lower electrode's upper surface and the piezoelectric layer's adjoining surface are treated so RMS height variation stays at or below 25 nm, with the lower electrode thickness capped at 150 nm — a surface-flatness and electrode-thickness combination aimed at improving resonator performance.Filed by MEMS Solution Co., Ltd. and published 2002-12-19, this record predates the dataset's main filing window but is included as a foundational structural reference for suspended-membrane BAW fabrication.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20170214387A1 | Bulk acoustic wave resonator with piezoelectric layer comprising lithium niobate or lithium tantalate | 328 |
| 2 | US7280007B2 | Thin film bulk acoustic resonator with a mass loaded perimeter | 295 |
| 3 | US10601392B2 | Solidly-mounted transversely-excited film bulk acoustic resonator | 275 |
| 4 | US7466213B2 | Resonator structure and method of producing it | 270 |
| 5 | US5873154A | Method for fabricating a resonator having an acoustic mirror | 263 |
| 6 | US20180191322A1 | Method for fabricating bulk acoustic wave resonator with mass adjustment structure | 254 |
| 7 | US10790802B2 | Transversely excited film bulk acoustic resonator using rotated Y-X cut lithium niobate | 251 |
| 8 | US10797675B2 | Transversely excited film bulk acoustic resonator using rotated z-cut lithium niobate | 248 |
| 9 | US6842088B2 | Thin film acoustic resonator and method of producing the same | 229 |
| 10 | US5185589A | Microwave film bulk acoustic resonator and manifolded filter bank | 219 |
Ranked by citation count within this searched corpus. Older filings accumulate more citations simply by being available longer, so treat this as a signal of influence on subsequent filings, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
Put your own technology through the same analysis
Eureka on the web
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →MCP server & REST API
When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →What the numbers say about the field
Three patterns worth acting on before drafting or budgeting a filing strategy in this space.
Filing sits with a small group of large players
The top five assignees combined account for 33.5% of the 2,010 records in scope, and the top ten hold 48.1%. Below that, the ranked leaders' totals fall off quickly — fifth place holds 77 records, tenth place 50 — leaving a long tail of the remaining ranked companies filing far less.
Peak filing has passed, for now
2021 was the peak year at 238 records; by 2024, the last year treatable as complete, filings had fallen to 103, a 57% decline. Recent-year momentum data for individual large assignees shows year-on-year drops as well, though 2025-2026 counts are still incomplete due to publication lag.
Claims cluster around filter architecture
Nearly nine in ten records carry an H03H impedance-network-and-filter classification, while material-analysis (G01N, 4.9%) and audio-transducer (H04R, 1.0%) classes are comparatively rare. That imbalance suggests structural filter-integration claims are the most contested ground, not the underlying piezoelectric material science.
US filings dominate, China is the clear second office
The United States receiving office accounts for 1,138 of the tracked records, more than three times China's 298. Europe (EPO), WIPO/PCT, Japan and the United Kingdom trail further behind, indicating that BAW resonator protection is still primarily sought and litigated in the US market first.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to bulk acoustic wave resonator structures, with the prior art for and against each one.
Who is filing, and where the gaps sit
The ranking covers 100 companies. A handful sit well ahead of the pack, but the concentration figures leave room for newer or narrower filers to stake out specific structural claims.
A single assignee leads by a wide margin
The top-ranked assignee holds 234 records, well ahead of fifth place at 77 and tenth place at 50. That gap suggests the leader has built a broad portfolio across multiple resonator structures rather than concentrating on one narrow claim.
One university-industry pair files jointly at scale
Among the ten identified co-assignee pairs, one industry-university pairing shares 21 records — far more than the next strongest pairs, which sit at 1-2 shared records each. That points to a sustained joint R&D program rather than incidental co-filing.
Several established filers show zero recent-year activity
Multiple assignees in the recent-momentum data show 0 records in the latest year, with some marked at -100% year-on-year. Given publication lag, this likely reflects incomplete recent data rather than an actual halt in R&D, but it is worth confirming directly before drawing conclusions about any single company's activity.
| Assignee | Recent year | YoY |
|---|---|---|
| Murata Manufacturing Co., Ltd. | 1 | -80% |
| Resonant Inc. | 0 | — |
| Qorvo US, Inc. | 0 | -100% |
| Samsung Electronics Co., Ltd. | 0 | — |
| Avago Technologies General IP (Singapore) Pte. Ltd. | 0 | — |
| Skyworks Global Pte. Ltd. | 0 | -100% |
| Skyworks Solutions, Inc. | 0 | -100% |
| ROFS Microsystem (Tianjin) Co., Ltd. | 0 | — |
Where to take this analysis
The dataset points to a field with clear leaders and clear gaps. The next step is turning that into a filing or freedom-to-operate decision specific to your structure.
Check freedom-to-operate against the leader's portfolio
With one assignee holding 234 records and the top five holding a third of the field, any new structural filing should be checked against the leader's claim scope before drafting.
Run a freedom-to-operate check in EurekaMap the under-claimed branches in detail
Classes like G01P and H04R sit at 1.0% of records each — worth a closer look if your structure touches sensing or audio integration rather than pure RF filtering.
Explore white space in EurekaTrack momentum on named assignees directly
Recent-year figures for several large filers show sharp drops that may reflect publication lag rather than a real pullback — worth verifying against live filing data.
Monitor assignee activity in EurekaCommon questions about BAW resonator patents
One assignee leads the ranked field with 234 records, noticeably ahead of the rest of the top ten, where the tenth-place holder has 50. The top five combined account for 33.5% of all 2,010 records in scope, and the top ten for 48.1%, meaning a small number of companies control roughly half of all documented filing activity. Beyond that group, the remaining ranked companies file in much smaller numbers, forming a long tail rather than a second tier of comparable size.
Filings peaked in 2021 at 238 records and had fallen to 103 by 2024, a 57% decline over that three-year window. However, because patent publication typically lags filing by around 18 months, the 2025 and 2026 figures in this dataset are still incomplete and should not be read as evidence of an ongoing slowdown. A fairer read is that the field expanded rapidly through the late 2010s and early 2020s and has since settled to a lower but not yet fully visible baseline.
Both terms describe resonators that use a piezoelectric thin film to generate acoustic waves through the bulk of the material rather than along its surface, and in this dataset they are searched together as closely related structural variants. FBAR specifically refers to designs using a suspended membrane or air cavity beneath the piezoelectric stack, while broader BAW terminology also covers solidly-mounted resonator (SMR) variants that use an acoustic reflector stack instead of a cavity. Patent claims in this space frequently address the reflector or membrane structure, the electrode-to-piezoelectric interface, and methods for suppressing spurious modes, all of which show up as classification tags on the underlying records.
The United States receiving office accounts for 1,138 of the tracked records, by far the largest share, followed by China at 298 and Europe (EPO) at 184. WIPO/PCT filings total 169, with Japan at 49 and the United Kingdom at 39. This distribution suggests that companies working on BAW resonator technology still prioritise US filing first, likely reflecting the concentration of RF front-end module customers and litigation exposure in that market.
The IPC composition shows H03H (impedance networks and filters) present on 89.9% of the 2,010 records, meaning the bulk of the field is framed around filter integration. In contrast, classes tied to velocity/acceleration sensing (G01P) and audio transducers (H04R) each sit at only 1.0% of records, and material analysis and testing (G01N) at 4.9%, all of which indicate comparatively thin claim coverage. A structure that combines core BAW resonator elements with one of these adjacent applications, rather than another filter variant, is more likely to find open claim space.
Research Bulk Acoustic Wave Resonator Structures in depth with Eureka
Go past this page: query the whole bulk acoustic wave resonator structures corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.
Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.