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BAW Resonator Patents: Top Companies & Filing Trends 2026

BAW Resonator Patents: Top Companies & Filing Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/bulk-acoustic-wave-resonator-structures-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Wireless Communications
Bulk Acoustic Wave Resonator Patents: Who Leads and Where Filing Concentrates
  • Top-heavy field. the five largest filers hold 33.5% of all 2,010 records in scope, and the ranked leaders' top ten hold 48.1% — most of the remaining 100 ranked companies file in single digits.
  • Filing has cooled from its 2021 peak. activity hit 238 records in 2021 and fell to 103 by 2024, a 57% drop over that span, though 2025-2026 figures are still filling in due to publication lag.
  • One IPC subclass dominates the claim space. H03H (impedance networks & filters) appears on 89.9% of all records, while adjacent classes like G01P and H04R sit at 1.0% each — a sign of where claim space is thin.
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2,010
Published Records
33%
Top-5 Share of All Records
-57%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (238 records) with 2024 (103) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 2,010 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks 2,010 published records matching bulk acoustic wave resonator, film bulk acoustic resonator and BAW resonator terminology, filtered to documents that also address acoustic reflectors, electromechanical coupling, spurious modes, quality factor, piezoelectric thin film composition, or resonance frequency trimming. The window runs from 2015 through the 2026-07-31 cut-off, capturing the period in which BAW resonators moved from RF filter niche components into mainstream 5G front-end modules.

Filing concentrates in a small set of assignees and in one dominant IPC subclass, but the receiving-office spread and the long tail of single-filing entrants both point to a technology still being contested at the margins rather than settled at the core.

Records by year and by receiving office
  1. 1MURATA MFG CO LTD234
  2. 2AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD143
  3. 3QORVO US INC116
  4. 4SAMSUNG ELECTRONICS CO LTD103
  5. 5SKYWORKS GLOBAL PTE LTD77
  6. 6ROFS MICROSYST TIANJIN CO LTD64
  7. 7SAMSUNG ELECTRO MECHANICS CO LTD64
  8. 8SKYWORKS SOLUTIONS INC62
  9. 9WUHAN MEMSONICS TECH CO LTD53
  10. 10QXONIX INC50
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Bulk Acoustic Wave Resonator Structures covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 2,010-record set: how filing volume has moved year over year, and which IPC subclasses carry the claim density.

Filing activity, 2017-2026

Annual filings rose to a peak of 238 records in 2021, then declined to 103 by 2024 — a 57% fall over that three-year span. Records from 2025 onward are undercounted because publication typically lags filing by around 18 months; the visible drop after 2024 should not be read as a slowdown yet.

Filing activity, 2017-202606312518825011120172018201920202382021202220232024202542026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass distribution

H03H (impedance networks & filters) covers 89.9% of the 2,010 records, confirming that most filings are framed as filter or resonator-network structures rather than standalone material or device claims. H10N and H01L, at 20.0% and 16.7%, reflect the solid-state device and semiconductor-fabrication side of the same filings. Because a single record can carry several IPC classes, these percentages are each measured against the full 2,010-record total and do not sum to 100%.

IPC subclass distributionH03H · Impedance networks & filters1,80689.9%H10N · Other electric solid-state dev…40120.0%H01L · Semiconductor devices33516.7%G01N · Material analysis & testing984.9%H04B · Transmission (general)522.6%H03B · Oscillation generation482.4%G01P · Velocity & acceleration211.0%H04R · Loudspeakers & audio transduce…211.0%Other32416.1%

Shares are the percentage of the 2,010 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Bulk Acoustic Wave Resonator Structures covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Most-cited records in this landscape

Representative Record
US20020190814A12002-12-19

Thin film bulk acoustic resonator and method of producing the same (US20020190814A1)

MEMS SOLUTION CO., LTD.

A pit is formed in a silicon substrate carrying a silicon oxide layer, over which a sandwich structure of piezoelectric material between lower and upper electrodes is suspended. The lower electrode's upper surface and the piezoelectric layer's adjoining surface are treated so RMS height variation stays at or below 25 nm, with the lower electrode thickness capped at 150 nm — a surface-flatness and electrode-thickness combination aimed at improving resonator performance.Filed by MEMS Solution Co., Ltd. and published 2002-12-19, this record predates the dataset's main filing window but is included as a foundational structural reference for suspended-membrane BAW fabrication.

US20020190814A1 — patent drawing 1US20020190814A1 — patent drawing 2
View full record
Highest-citation records
#Publication no.Patent titleCitations
1US20170214387A1Bulk acoustic wave resonator with piezoelectric layer comprising lithium niobate or lithium tantalate328
2US7280007B2Thin film bulk acoustic resonator with a mass loaded perimeter295
3US10601392B2Solidly-mounted transversely-excited film bulk acoustic resonator275
4US7466213B2Resonator structure and method of producing it270
5US5873154AMethod for fabricating a resonator having an acoustic mirror263
6US20180191322A1Method for fabricating bulk acoustic wave resonator with mass adjustment structure254
7US10790802B2Transversely excited film bulk acoustic resonator using rotated Y-X cut lithium niobate251
8US10797675B2Transversely excited film bulk acoustic resonator using rotated z-cut lithium niobate248
9US6842088B2Thin film acoustic resonator and method of producing the same229
10US5185589AMicrowave film bulk acoustic resonator and manifolded filter bank219

Ranked by citation count within this searched corpus. Older filings accumulate more citations simply by being available longer, so treat this as a signal of influence on subsequent filings, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Bulk Acoustic Wave Resonator Structures covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers say about the field

Three patterns worth acting on before drafting or budgeting a filing strategy in this space.

Concentration
33.5%
of all records held by the top 5

Filing sits with a small group of large players

The top five assignees combined account for 33.5% of the 2,010 records in scope, and the top ten hold 48.1%. Below that, the ranked leaders' totals fall off quickly — fifth place holds 77 records, tenth place 50 — leaving a long tail of the remaining ranked companies filing far less.

Basis: full assignee ranking, 2,010 records
Momentum
238 → 103
records, 2021 to 2024

Peak filing has passed, for now

2021 was the peak year at 238 records; by 2024, the last year treatable as complete, filings had fallen to 103, a 57% decline. Recent-year momentum data for individual large assignees shows year-on-year drops as well, though 2025-2026 counts are still incomplete due to publication lag.

Basis: annual filing counts, 2017-2026
Technology mix
89.9%
of records tagged H03H

Claims cluster around filter architecture

Nearly nine in ten records carry an H03H impedance-network-and-filter classification, while material-analysis (G01N, 4.9%) and audio-transducer (H04R, 1.0%) classes are comparatively rare. That imbalance suggests structural filter-integration claims are the most contested ground, not the underlying piezoelectric material science.

Basis: IPC subclass tagging, 2,010 records
Geography
1,138
records via United States receiving office

US filings dominate, China is the clear second office

The United States receiving office accounts for 1,138 of the tracked records, more than three times China's 298. Europe (EPO), WIPO/PCT, Japan and the United Kingdom trail further behind, indicating that BAW resonator protection is still primarily sought and litigated in the US market first.

Basis: receiving office field, 2,010 records
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to bulk acoustic wave resonator structures, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Bulk Acoustic Wave Resonator Structures covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the gaps sit

The ranking covers 100 companies. A handful sit well ahead of the pack, but the concentration figures leave room for newer or narrower filers to stake out specific structural claims.

Leader
234
records

A single assignee leads by a wide margin

The top-ranked assignee holds 234 records, well ahead of fifth place at 77 and tenth place at 50. That gap suggests the leader has built a broad portfolio across multiple resonator structures rather than concentrating on one narrow claim.

Basis: assignee ranking, 2,010 records
Co-filing
21
shared records, strongest pair

One university-industry pair files jointly at scale

Among the ten identified co-assignee pairs, one industry-university pairing shares 21 records — far more than the next strongest pairs, which sit at 1-2 shared records each. That points to a sustained joint R&D program rather than incidental co-filing.

Basis: co-assignee pair analysis, 10 pairs
Momentum
-100% YoY
for several large assignees

Several established filers show zero recent-year activity

Multiple assignees in the recent-momentum data show 0 records in the latest year, with some marked at -100% year-on-year. Given publication lag, this likely reflects incomplete recent data rather than an actual halt in R&D, but it is worth confirming directly before drawing conclusions about any single company's activity.

Basis: recent-year momentum by assignee
🔍
Under-claimed structural branches
Sub-areas with thin IPC coverage relative to the core filter classification — worth checking before assuming the space is closed.
Spurious-mode suppression in stacked resonatorsResonance frequency trimming post-fabricationAcoustic reflector layer stack optimisationAudio-transducer-integrated BAW designsMEMS velocity/acceleration co-sensing structures
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Murata Manufacturing Co., Ltd.1-80%
Resonant Inc.0
Qorvo US, Inc.0-100%
Samsung Electronics Co., Ltd.0
Avago Technologies General IP (Singapore) Pte. Ltd.0
Skyworks Global Pte. Ltd.0-100%
Skyworks Solutions, Inc.0-100%
ROFS Microsystem (Tianjin) Co., Ltd.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Bulk Acoustic Wave Resonator Structures covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to a field with clear leaders and clear gaps. The next step is turning that into a filing or freedom-to-operate decision specific to your structure.

Check freedom-to-operate against the leader's portfolio

With one assignee holding 234 records and the top five holding a third of the field, any new structural filing should be checked against the leader's claim scope before drafting.

Run a freedom-to-operate check in Eureka

Map the under-claimed branches in detail

Classes like G01P and H04R sit at 1.0% of records each — worth a closer look if your structure touches sensing or audio integration rather than pure RF filtering.

Explore white space in Eureka

Track momentum on named assignees directly

Recent-year figures for several large filers show sharp drops that may reflect publication lag rather than a real pullback — worth verifying against live filing data.

Monitor assignee activity in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Bulk Acoustic Wave Resonator Structures covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about BAW resonator patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Bulk Acoustic Wave Resonator Structures covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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