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Carbon Fiber Reinforced Polymer Curing Process Patent Landscape

Carbon Fiber Reinforced Polymer Curing Process Patent Landscape
Competitive Landscape

Carbon Fiber Reinforced Polymer Curing Process Patent Landscape in 2026

This is a small, highly concentrated field — 10 patent families spread across six applicants, with the University of Tennessee Research Foundation holding the lead position. The field is in a Growth stage on a multi-year basis, though annual volume has eased from its 2018 peak and U.S. institutions dominate both filing activity and jurisdictional coverage.

10
Patent families in scope
90%
Top-5 share of top-100 filers
+200%
3-yr filing growth (lag-adj.)
United States
Leading jurisdiction
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Published byPatSnap Insights Team··6 min readVerified by PatSnap Eureka data
Overview

A tightly held niche led by academic and aerospace institutions

The Boeing Company and the U. S. government (represented by NASA) each with 2 patent families, and three additional filers holding 1 patent family each.

The top five filers account for 90% of the combined total among the hundred largest filers — an exceptionally high concentration for a field of this size, indicating that a small cluster of academic, government, and aerospace players currently defines the competitive frontier.

Leading applicants
#ApplicantPatent familiesShare
1University of Tennessee Research Foundation3
2The Boeing Company2
3United States Government as Represented by the Administrator of NASA2
4Korea Institute of Industrial Technology1
5Yantai Meifeng Machinery Group Co., Ltd.1
6Wuhan Gaotan Technology Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

This concentration implies that new entrants face a landscape where core curing-process methods are already staked out by well-resourced institutions; however, the limited absolute volume also means that targeted, differentiated filings could meaningfully shift relative positioning.

Filings from approximately 2024 onward are likely under-counted due to standard patent publication lag and should not be interpreted as a decline in activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope.Explore deeper in Eureka →
Trends & Structure

Multi-year growth from a small base, with shaping processes dominating the technology mix

Annual filing volume and IPC class distribution together reveal both the pace of activity and the technical priorities of the field’s participants.

Annual filing trend

Filing volume peaked in 2018 at 3 patent families, dipped to zero in 2020–2021, and recovered to 3 in 2022 before tapering off again in visible data. The three-year recent window sits 200% above the prior three-year window, confirming multi-year growth from a small base; years 2024 and beyond are understated by publication lag and should not be read as terminal decline.

Annual filing trendAnnual values from 2017 to 2026, peaking at 3 in 2018.22017320181201902020020213202202023020241202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

B29C (Shaping of plastics) accounts for all 10 patent records and is the dominant branch by a wide margin. C08J (Polymer processing and solutions) appears in 4 records and B29K (Plastics moulding materials, index) in 3, indicating that process chemistry and material specification are secondary but consistent themes. Notably, B64D (Aircraft equipment), H01L (Semiconductor devices), and H10N (Other electric solid-state devices) each appear in 2 records — reflecting Boeing’s and NASA’s application-specific coverage in aerospace and electromechanical contexts.

Technology compositionB29C · Shaping of plastics leads with 10; C08J · Polymer processing & solutions 4.B29C · Shaping of plastics10C08J · Polymer processin…4B29K · Plastics moulding…3B29B · Plastics preparat…2B64D · Aircraft equipment2H01L · Semiconductor dev…2H10N · Other electric so…2B29L · Plastic products …1↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US11673352B2Published 2023-06-13

Automated wave guide system for in-process monitor…

United States Of America As Represented By The Administrator Of Nasa

A method of monitoring a curing process for fiber reinforced composite materials that includes positioning an actuator on uncured composite material at a first location. At least one sensor is positioned at a second location that is spaced apart from the first location. The actuator excites waves in the composite part at the first location. At least one… (excerpt from the patent abstract)

Automated wave guide system for in-process monitor… — patent drawingAutomated wave guide system for in-process monitor… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1Automated Wave Guide System for In-Process Monitor…6
2Process to manufacture carbon fiber intermediate p…3
3Interdigitated Heating Probe2
4Method for preparing a shaped article composed of …1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the competitive structure means for R&D investment decisions

Four structural signals — maturity, concentration, collaboration, and geography — shape where new entrants and incumbents can most effectively allocate effort.

Growth

Growth stage, easing from a 2018 annual peak

The field is classified as Growth: the most recent three-year filing window is 200% above the prior three-year window on a multi-year basis. However, annual volume has eased from its 2018 peak. New entrants such as the University of Tennessee Research Foundation and Wuhan Gaotan Technology have recently entered, signaling that the technical agenda is still being written but that foundational shaping-process claims are already held.

Growth stage
Concentration

Top-heavy field with a tight academic-government-aerospace cluster

The top five filers hold 90% of the combined total among the hundred largest filers, and the absolute corpus stands at just 10 patent families. This extreme concentration means the competitive map can shift materially with even a handful of new filings. A challenger with differentiated curing chemistry or process-monitoring IP could rapidly gain relative standing.

High concentration
Collaboration

No co-applicant activity detected in current evidence

The collaboration data contains no recorded co-filing relationships within this corpus. Each applicant appears to be pursuing independent IP strategies. This absence may reflect the early-stage, exploratory nature of the field or the proprietary sensitivity of process know-how in aerospace and defense contexts. Evidence pending on any informal or cross-licensing arrangements.

Evidence pending
Geography

U.S.-centric filings with limited international coverage

The United States leads with 6 patent records, followed by China with 2, South Korea with 1, and WIPO (PCT) with 1. The limited PCT and non-U.S. coverage suggests that most applicants are not yet pursuing broad international protection, leaving significant jurisdictional white space in Europe, Japan, and other key manufacturing markets for CFRP components.

U.S. dominant
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Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: PatSnap Eureka. Insights derived from applicant ranking, lifecycle classification, collaboration data, and jurisdiction distribution in evidence.Explore insights →
Leaders

University of Tennessee Research Foundation leads; Boeing anchors the aerospace axis

Two players define the current frontier: an academic institution focused on core shaping and polymer-processing methods, and an aerospace OEM whose coverage extends into aircraft-specific applications and electric heating.

Leader · University of Tennessee Research Foundation

University of Tennessee Research Foundation

Holds 3 patent families, the largest share among all filers. Technology emphasis spans B29C 35 (curing/forming), B29C 70 (fibre-reinforced plastics shaping), and C08J 5 (polymer composite processing) — covering both the process and the material chemistry interface. Momentum is flagged as a new entrant in the recent filing window, indicating that this position has been built recently rather than accumulated over a long history.

families: 3
Challenger · The Boeing Company

The Boeing Company

Holds 2 patent families with a distinctly application-oriented profile: B29C 35, B64D 45 (aircraft equipment), and H05B 1 (electric heating circuits). This combination suggests Boeing’s curing-process IP is tied directly to in-service aerospace components and in-situ or resistive-heating cure methods, differentiating it from the more process-generic coverage of the academic leader. No momentum trend data is available in evidence for Boeing beyond its current 2-family position.

families: 2
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Access ranked profiles for all six identified filers, including NASA, Korea Institute of Industrial Technology, and Chinese applicants.
Korea Institute of Industrial TechnologyWuhan Gaotan Technology Co., Ltd.+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
University of Tennessee Research Foundation2▲ new entrant
Wuhan Gaotan Technology Co., Ltd.1▲ new entrant
Source: PatSnap Eureka. Player profiles draw on applicant ranking, technology focus (IPC subclass level), and recent filing momentum from evidence.Explore players →
Adjacent Branches

Under-served branches at the intersection of CFRP curing and aerospace, semiconductor, and additive manufacturing

Several IPC branches appear in the corpus at low counts relative to the dominant B29C class, indicating sparse but technically adjacent coverage. These are observations of relative sparsity; only those with plausible technical value and a realistic entry path are characterized as potential opportunities.

B64D · Aircraft Equipment — in-situ and on-aircraft curing

Only 2 patent records cover B64D (Aircraft equipment) in this corpus, both attributable to Boeing’s filings linking curing process to aircraft structural components. Given the aerospace industry’s demand for out-of-autoclave and field-repair curing methods, this branch is sparse relative to its commercial relevance. Entrants with heating-element or cure-monitoring technology tailored to airframe maintenance contexts could find limited prior art here. Entry path: process patents combining B29C curing steps with B64D structural qualification requirements.

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B33Y · Additive Manufacturing (3D printing) — CFRP curing in printed composites

B33Y (Additive manufacturing / 3D printing) appears in only 1 patent record, making it the sparsest branch in the corpus. As continuous-fibre 3D printing of CFRP structures grows, cure process optimization for printed laminates represents a technically distinct problem from traditional layup curing. The low prior-art density suggests limited incumbency, and the intersection with B29C 64 (noted in Wuhan Gaotan Technology’s profile) hints at early-stage activity. Entry path: process claims addressing cure cycle control for additively manufactured CFRP parts, potentially combining B33Y and C08J subclasses.

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Unlock the full white-space map
See all identified sparse branches including B29L, H01L, H10N, and B32B with entry-path analysis.
H01L · Semiconductor devices (piezoelectric cure sensing)B32B · Layered products and laminates (cure bonding interfaces)+ more
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Source: PatSnap Eureka. Adjacent branches identified from IPC classes present at low counts relative to the dominant B29C class.Explore emerging →
Route Matrix

How leaders differ by technology route across IPC subclasses

Strength of each leader across the main technology routes.

PlayerB29C 35 · Shaping of plasticsB29C 70 · Shaping of plasticsC08J 5 · Polymer processing & solutionsB29K 105 · Plastics moulding materials (index)B29B 15 · Plastics preparation
University of Tennessee Research FoundationStrong · 3Strong · 3Strong · 3AbsentStrong · 2
Yantai Meifeng Machinery Group Co., Ltd.Strong · 1AbsentStrong · 1Strong · 1Absent
NASA (National Aeronautics and Space Administration)Moderate · 1Strong · 2AbsentAbsentAbsent
Korea Institute of Industrial TechnologyStrong · 1Strong · 1AbsentStrong · 1Absent
The Boeing CompanyStrong · 2AbsentAbsentAbsentAbsent
Wuhan Gaotan Technology Co., Ltd.Strong · 1AbsentAbsentStrong · 1Absent
Source: PatSnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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