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The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →Filing growth compares 2021 (103 records) with 2024 (23) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,605 records in scope (CR5), not by the ranked leaders only.
Cavity and dielectric resonator filters sit at the core of RF front-end design, where unloaded quality factor, insertion loss budget and spurious mode suppression trade off against size and power handling. This landscape draws on 1,605 published records filed or published between 2015 and the 2026-07-31 cut-off, searched across filter type terms and the engineering vocabulary — tuning screw, temperature drift compensation, power handling — that distinguishes a working filter claim from a general microwave component claim.
Filing is concentrated in waveguide and microwave-element claims, with the United States, the European Patent Office and China as the leading receiving offices. The picture that emerges is a mature core geometry defended by a handful of large filers, with thinner activity in adjacent semiconductor and printed-circuit integration classes.
Pick a task. Every answer cites the patents behind it.
The dataset spans 1,605 published records from 2015 through the 2026-07-31 cut-off, tracked across filing year, IPC subclass and receiving office.
Filings ran from 71 in 2017 to a peak of 103 in 2021, then fell to 23 by 2024, a complete-year decline of -78% over that span. Because publication lags filing by roughly 18 months, the 2025 and 2026 figures are still filling in and should not be read as a continued drop.
H01P covers 86.4% of the 1,605 records in scope, far ahead of transmission (H04B, 6.0%), antennas (H01Q, 5.2%) and impedance networks (H03H, 3.9%). Records can carry more than one IPC class, so these shares add up past 100%.
Shares are the percentage of the 1,605 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about cavity and dielectric resonator filters and every answer comes back with the patent numbers behind it.
Try EurekaA radio frequency dielectric resonator filter with at least two cavities, each loaded with a dielectric resonator, separated by a common wall carrying two apertures. A centrally located iris and a peripheral aperture couple the electromagnetic field between cavities, with an externally adjustable tuning screw extending through the peripheral aperture to vary its effective coupling area.Filed by Lanteris Space LLC, published 2017-07-11.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6492883B2 | Method of channel frequency allocation for RF and microwave duplexers | 313 |
| 2 | US4567401A | Wide-band distributed rf coupler | 233 |
| 3 | US4792771A | Quadruple mode filter | 225 |
| 4 | GB1468310A | Microwave cavity resonators | 191 |
| 5 | US5859717A | Multiplexing device with precision optical block | 159 |
| 6 | US5608363A | Folded single mode dielectric resonator filter with cross couplings between non-sequential adjacent resonator… | 150 |
| 7 | US4028652A | Dielectric resonator and microwave filter using the same | 147 |
| 8 | US20080272860A1 | Tunable Dielectric Resonator Circuit | 145 |
| 9 | US8836601B2 | Dual receiver/transmitter radio devices with choke | 144 |
| 10 | US5020149A | Integrated down converter and interdigital filter apparatus and method for construction thereof | 142 |
Citation counts favour older filings inside any searched corpus and should be read as a signal of influence, not current enforceability.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three signals stand out once filing volume, technology composition and citation depth are read together.
The leading assignee alone accounts for 168 of the 1,605 records, more than double the fifth-ranked filer's 58. That gap between first and fifth place is wide enough that a new entrant should expect the densest waveguide geometry claims to already be occupied.
Filings peaked at 103 in 2021 and fell to 23 by the last complete year, 2024. Because publication lags filing by roughly 18 months, the 2025-26 counts are still incomplete and should not be read as confirmation that the decline continues.
H01P alone touches 86.4% of the 1,605 records, while classes like H01S and H01L sit under 2%. That imbalance marks core cavity geometry as heavily claimed territory and the semiconductor-integration edge as comparatively open.
The most-cited records in the corpus date back decades, led by a duplexer frequency-allocation patent cited 313 times. That depth of citation shows current filings still build on foundational geometry and allocation claims rather than displacing them.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to cavity and dielectric resonator filters, with the prior art for and against each one.
The ranked assignee table covers 100 companies drawn from all 1,605 records — not a curated top list, but the whole ranking the dataset returns.
The top-ranked assignee holds 168 of the 1,605 records, nearly triple the tenth-place filer's 22. That gap suggests a defensible position built over years rather than a recent surge.
The five leading assignees combine for 493 records, 30.7% of the field. That leaves close to 70% spread across the remaining ranked companies and a long tail beyond them.
Several of the largest historical filers show minimal or zero filings in the latest tracked year, consistent with the broader -78% decline from the 2021 peak to the 2024 complete-year figure.
| Assignee | Recent year | YoY |
|---|---|---|
| Huawei Technologies Co., Ltd. | 1 | — |
| Samsung Electronics Co., Ltd. (Korea) | 1 | -75% |
| Telefonaktiebolaget LM Ericsson (Sweden) | 0 | — |
| KMW Inc. | 0 | — |
| Alcatel Lucent SA | 0 | — |
| Anhui Tatfook Technology Co., Ltd. | 0 | — |
| COM DEV LTD | 0 | — |
| Hongkong Fingu Development Co., Ltd. | 0 | — |
The figures above set the boundaries of the field. Turning them into a filing or licensing decision means going deeper on specific claims and specific competitors.
Concentration at the top of the ranking means the highest-risk claims are also the most identifiable. Screen new designs against the leading assignees' active families before committing to a geometry.
Search assignee portfolios in EurekaSemiconductor and printed-circuit integration classes are filed far less densely than core waveguide claims. Early filings there face less prior art but also less certainty about what will hold up.
Track emerging filings in EurekaPublication lag means the most recent two years are undercounted. Re-check the filing trend in six to twelve months before drawing firm conclusions about a continued slowdown.
Set an alert in EurekaFiling is concentrated at the top of the ranking: the five leading assignees together account for 30.7% of the 1,605 records in scope, and the top ten account for 44.2%. The single leader holds 168 records, well ahead of the fifth-ranked assignee at 58 and the tenth at 22. Beyond that point the ranking thins into a long tail of smaller filers, so due diligence should weight the leading names heavily but not assume the field is a two-company race.
In this dataset both fall under the same search scope because they solve the same problem — selective frequency filtering with controlled insertion loss and quality factor — using different physical resonating structures. Cavity filters rely on metal cavity geometry, while dielectric resonator filters load that cavity with a ceramic puck to raise unloaded quality factor and shrink size. Claim language in the corpus frequently addresses both together, particularly around tuning screws, spurious mode suppression and temperature drift compensation, which is why the search string spans all three filter types.
Filings rose from 71 in 2017 to a peak of 103 in 2021, then declined to 23 by 2024 — a complete-year drop of -78% over that three-year span. That is the most recent period that can be read reliably; 2025 and 2026 figures are still incomplete because publication typically lags filing by about 18 months. Treat the recent years as provisional rather than evidence of a further slowdown.
Semiconductor integration (H01L, 1.6% of the 1,605 records) and laser or stimulated-emission crossover (H01S, 1.4%) are the thinnest classes in the dataset, far below the 86.4% concentrated in core waveguide and microwave-element claims (H01P). Printed-circuit integration (H05K, 2.4%) is similarly under-filed. These branches represent the more open filing space relative to the dense core geometry claims.
US9705171B2, assigned to Lanteris Space LLC and filed 2017-07-11, covers a dielectric resonator filter where two cavities share a common wall carrying both a centrally located coupling iris and a second, larger peripheral aperture whose effective coupling area is adjusted by an externally accessible tuning screw. It blocks designs matching that specific dual-aperture, externally-adjustable-screw geometry, but does not extend to single-aperture couplings or to filters using other tuning mechanisms. Anyone designing around it should compare their coupling and adjustment mechanism against that claim language directly rather than assume broad coverage.
Go past this page: query the whole cavity and dielectric resonator filters corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.
Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.
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