CFRP Simulation & Modeling Patent Landscape 2026
The CFRP simulation and modeling space is in a growth stage, with Chinese academic institutions dominating filing activity and Dalian University of Technology holding the leading position. The field is fragmented at the top — no single applicant commands a decisive share — while the dominant technology route centers on digital data processing and computational methods.
Chinese universities lead a fragmented, growing field
Dalian University of Technology leads the applicant ranking with 7 patent families, followed closely by Teijin Ltd with 6. The top tier is narrow: the five largest filers together account for 16% of the combined output of the hundred largest filers, signaling that no single organization has locked up the space.
The ranking is broadly fragmented. After the top two, a cluster of applicants — including the U. S. Government, Florida State University Research Foundation, Northwestern Polytechnical University, China FAW, Beihang University, and Harbin Institute of Technology at Weihai — each hold 4 patent families, with no steep cliff separating them from the leader.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Dalian University of Technology | 7 | |
| 2 | Teijin Ltd. | 6 | |
| 3 | The Government of the United States of America | 4 | |
| 4 | Florida State University Research Foundation | 4 | |
| 5 | Northwestern Polytechnical University | 4 | |
| 6 | China FAW Co., Ltd. | 4 | |
| 7 | Beihang University | 4 | |
| 8 | Harbin Institute of Technology at Weihai | 4 | |
| 9 | Jilin University | 3 | |
| 10 | NANJING UNIV OF AERONAUTICS & ASTRONAUTICS | 3 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | Toray Industries, Inc. | 3 | |
| 12 | NANJING UNIV OF SCI & TECH | 3 | |
| 13 | SHENZHEN DINGXINDE NEW MATERIAL TECHNOLOGY & INNOV… | 3 | |
| 14 | AEROSPACE RES INST OF MATERIAL & PROCESSING TECH | 3 | |
| 15 | Nanchang Hangkong University | 3 | |
| 16 | Hunan Automotive Engineering Vocational College | 2 | |
| 17 | Nantong Institute of Technology | 2 | |
| 18 | Dow Global Technologies LLC | 2 | |
| 19 | Jiangsu University of Technology | 2 | |
| 20 | Harbin Institute of Technology | 2 |
The leadership of academic and research institutions (rather than commercial manufacturers) implies that foundational simulation methods remain largely open terrain, with industrialization of these methods still maturing. Teijin Ltd and Toray Industries are the only major material producers in the top tier, suggesting commercial players are beginning to stake positions but have not yet consolidated an advantage.
The most recent 18–24 months of filing data are subject to publication lag and will appear under-counted until pending applications publish; the actual pace of recent activity is likely higher than the raw figures suggest.
Filing volume is rising and digital simulation dominates the technology mix
The annual trend and IPC composition together reveal a field accelerating into digital methods, with manufacturing-process and material-characterization branches playing secondary but growing roles.
Annual filing trend
Annual filings were modest through 2018, then stepped up from 2019 onward with evident volatility year-to-year. The multi-year window shows a 38% growth rate, consistent with a Growth-stage field. The spike visible in the most recent data point reflects both genuine acceleration and publication lag — late-period figures are structurally under-counted and will revise upward as applications publish.
↗ Hover for values · click a bar to ask EurekaTechnology composition
Electric digital data processing (G06F) is by far the dominant IPC class, reflecting the centrality of FEA, CAE, and related computational methods in CFRP simulation work. Computational chemistry (G16C) and plastics shaping (B29C) occupy the second tier, while AI-based computing (G06N) and material analysis and testing (G01N) are present but relatively sparse — marking them as adjacent branches with room for expansion.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Method for quickly selecting three-dimensional (3D…
A method for selecting a mass scaling factor for three-dimensional (3D) micro-scale cutting simulation of carbon fiber reinforced polymer (CFRP) in the present invention relates to the field of composite material cutting simulation. In particular, the present invention relates to a method for selecting a mass scaling factor for 3D micro-scale cutting… (excerpt from the patent abstract)
Open this patent in Eureka →| # | Patent | Citations |
|---|---|---|
| 1 | 一种基于多尺度的碳纤维复合材料抗冲击力学性能仿真方法 | 42 |
| 2 | 一种竞争失效下的CFRP-金属混合螺栓连接结构疲劳寿命预测方法 | 32 |
| 3 | 基于偏轴拉伸的碳纤维复合材料动态剪切强度测试方法 | 29 |
| 4 | Hybrid multifunctional composite material and meth… | 26 |
| 5 | High-strength material product comprising a layer … | 24 |
| 6 | 低速冲击下的碳纤维复合材料层合板损伤状态的预测方法 | 20 |
| 7 | 一种气瓶受外物撞击后的爆破强度评估方法 | 16 |
| 8 | 一种碳纤维复合材料空间光学镜面高精度复制方法 | 15 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the competitive structure means for R&D investment
Four structural observations — maturity, concentration, collaboration, and geography — define the strategic context for anyone entering or expanding in CFRP simulation and modeling.
Growth stage with rising annual volume
The field is classified as Growth, with annual filings still rising and a 38% increase recorded over the recent window. Publication lag means the most recent data understates actual activity. The window from 2019 onward marks the transition from an early niche into a more active competitive space, and the lack of a dominant incumbent suggests the foundational IP landscape is still being written.
Growth stageFragmented top tier — no dominant incumbent
The top five filers hold only 16% of the combined output of the hundred largest filers, and the gap between the leader (7 patent families) and the second-place cluster (4 patent families) is narrow. This low concentration level means the space is still open to new entrants who can stake a position in a specific method or application domain before consolidation occurs.
Low concentrationIndustry–academia and lab–government pairings drive co-filing
The most active co-filing pairs are Florida State University Research Foundation with both the U.S. Naval Research Laboratory and the U.S. Government (2 joint families each), and the Aerospace Research Institute of Material and Processing Technology with China Academy of Launch Vehicle Technology (2 joint families). Harbin Institute of Technology at Weihai has co-filed with both Weihai Guangtai Airport Equipment and Weihai Guang Wei Composite Materials. These pairings reflect defense and aerospace programs driving applied simulation research through institutional partnerships.
Academic–industry tiesChina overwhelmingly dominates; U.S. and international presence is thin
China accounts for the largest share of filing activity among all jurisdictions, followed by the United States, WIPO (PCT), Europe (EPO), India, and Japan. The skew toward a single national office suggests that much of the IP base has limited international coverage today, creating both a risk (Chinese filings may not block entry in other markets) and an opportunity (filing internationally on novel simulation methods could establish defensible positions in the U.S., Europe, and Japan with limited prior-art density).
China-dominantGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| Florida State University Research Foundation | U.S. Naval Research Laboratory | 2 |
| Florida State University Research Foundation | The Government of the United States of America (as represented by the Secretary of Health and Human Services) | 2 |
| Aerospace Research Institute of Material and Processing Technology | China Academy of Launch Vehicle Technology | 2 |
| Harbin Institute of Technology at Weihai | Weihai Guangtai Airport Equipment Co., Ltd. | 1 |
| Harbin Institute of Technology at Weihai | Weihai Guang Wei Composite Materials Co., Ltd. | 1 |
| Beihang University | Southwest Technical Engineering Research Institute of China Ordnance Equipment Group | 1 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
Dalian University of Technology leads on digital simulation; Teijin bridges simulation and physical testing
The two leading applicants represent distinct strategic postures: one anchored in computational design methods, the other linking simulation to physical material characterization and shaping processes.
Dalian University of Technology
The top-ranked applicant with 7 patent families, Dalian University of Technology concentrates its work in electric digital data processing (G06F 30), consistent with a structural simulation and CAE focus. Its momentum is classified as a new entrant in the recent filing window, indicating that its current lead was largely built in the recent period rather than over a long prior history — making its position newer and potentially less entrenched than the family count alone implies.
families: 7Teijin Ltd
Teijin Ltd holds 6 patent families and stands as the leading commercial-sector applicant and the only major CFRP material producer in the top two. Its technology emphasis spans plastics shaping (B29C 70) and material analysis and testing (G01N 21, G01N 23), reflecting a strategy that links simulation and modeling directly to physical process characterization — a differentiating position versus the purely computational focus of most academic filers. Momentum data is not separately reported for Teijin in the recent-window analysis.
families: 6| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| Dalian University of Technology | 1 | ▲ new entrant |
| Northwestern Polytechnical University | 3 | ▲ new entrant |
| Harbin Institute of Technology at Weihai | 1 | ▲ new entrant |
| Beihang University | 1 | ▲ new entrant |
| China FAW Co., Ltd. | 2 | ▲ new entrant |
| Shenzhen Dingxinde New Material Technology & Innovation Co., Ltd. | 1 | ▲ new entrant |
| Jilin University | 1 | ▲ new entrant |
AI-based modeling and material testing are under-served relative to core simulation
Several IPC branches adjacent to the dominant G06F core are sparsely populated relative to their technical relevance, representing areas where early movers could differentiate without immediately confronting dense prior art.
G06N · Computing based on AI models
With only 19 patent records and a 6% share among the top branches, AI-based computing (G06N) is notably sparse relative to the established G06F simulation corpus. Machine-learning approaches to CFRP failure prediction, surrogate modeling, and process optimization are technically mature in adjacent fields and have a plausible entry path through transfer learning from broader composites or structural mechanics AI work. An applicant filing physics-informed neural network or generative model methods applied to CFRP micro- and macro-mechanics would face limited prior-art density here.
Search this in Eureka →G01N · Material analysis & testing
Material analysis and testing (G01N) appears in only 16 patent records, a 5% share, despite being the direct experimental validation layer for any simulation model. The sparse coverage suggests that IP linking simulation outputs to in-situ or non-destructive testing (NDT) methods — such as ultrasonic, X-ray CT, or acoustic emission approaches calibrated with simulation data — remains largely unprotected. The entry path is realistic for organizations that already operate characterization labs and could integrate simulation-driven test design.
Search this in Eureka →How leading applicants differ by technology route
Route coverage across the main technology branches in the current evidence set.
| Player | G06F 30 · Electric digital data processing | G06F 119 · Electric digital data processing | G06F 113 · Electric digital data processing | G16C 60 · Computational chemistry | B29C 70 · Shaping of plastics |
|---|---|---|---|---|---|
| Harbin Institute of Technology at Weihai | Strong · 4 | Strong · 3 | Strong · 4 | Strong · 3 | Absent |
| Northwestern Polytechnical University | Strong · 4 | Strong · 3 | Strong · 3 | Strong · 3 | Absent |
| Beihang University | Strong · 4 | Strong · 3 | Strong · 3 | Moderate · 2 | Absent |
| China FAW Co., Ltd. | Strong · 4 | Moderate · 2 | Strong · 4 | Moderate · 1 | Absent |
| Nanchang Hangkong University | Strong · 3 | Strong · 3 | Strong · 3 | Absent | Absent |
| Nanjing University of Aeronautics and Astronautics | Strong · 3 | Strong · 2 | Strong · 2 | Absent | Absent |
| Dalian University of Technology | Strong · 6 | Absent | Absent | Absent | Absent |
Frequently asked questions
The corpus contains 143 patent families in scope. The field recorded 38% growth over the recent multi-year window, consistent with a Growth lifecycle stage.
Dalian University of Technology leads with 7 patent families, followed by Teijin Ltd with 6. The top five filers together account for 16% of the combined output of the hundred largest filers, indicating a fragmented competitive landscape.
Electric digital data processing (G06F) is by far the most common IPC class, reflecting FEA, CAE, and structural simulation methods. Computational chemistry (G16C) and plastics shaping (B29C) form the second tier, while AI-based computing (G06N) and material analysis and testing (G01N) are present but relatively sparse.
China is the dominant jurisdiction, followed by the United States, WIPO (PCT), Europe (EPO), India, and Japan. The heavy concentration in China means that many existing filings have limited coverage in other major markets.
Academic and government research institutions dominate the top of the ranking. Teijin Ltd and Toray Industries are the most prominent commercial-sector filers, suggesting that foundational simulation IP is still largely generated in academic settings rather than by manufacturers.
AI-based computing (G06N) with 19 patent records and material analysis and testing (G01N) with 16 patent records are the most sparsely covered technically relevant branches relative to the dominant G06F core. Layered products and laminates (B32B) with 11 patent records and image data processing (G06T) with 8 patent records are also sparse.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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