CFRP Structural Adhesive Bonding Patent Snapshot 2026
The CFRP structural adhesive bonding patent space is compact but sharply concentrated, with Taisei Plas holding a commanding lead over all other filers. The field expanded on a multi-year basis through 2022 before annual volume eased, and activity has since plateaued at a mature level with selective new entrants now joining.
Taisei Plas dominates a tightly held, maturing field
CFRP structural adhesive bonding is a compact, highly concentrated space. Taisei Plas Co Ltd sits at the top of the applicant ranking with 26 patent records — more than three times the count of the next-placed filers — establishing a clear first-tier position that no other single entity approaches.
The top five filers together account for 63% of the ranked applicants visible in this query’ combined total, signaling a field where a small group of specialists and materials companies owns the bulk of the documented intellectual property. A second tier, including Carlisle Intangible LLC, ANDOH Corp LLP Co, Dow Global Technologies LLC, and Toray Industries Inc, clusters well behind the leader, with each holding a fraction of Taisei Plas’s position.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Taisei Plas Co Ltd | 26 | |
| 2 | Carlisle Intangible LLC | 8 | |
| 3 | ANDOH Corp LLP Co | 8 | |
| 4 | Dow Global Technologies LLC | 6 | |
| 5 | Toray Industries Inc | 4 | |
| 6 | Indian Institute of Technology Kharagpur | 2 | |
| 7 | Yantai Huagao Cleaning Technology Co Ltd | 2 | |
| 8 | Hunan Gutebang Civil Technology Development Co Ltd | 2 | |
| 9 | University of Cincinnati | 2 | |
| 10 | Guizhou Zhidang Technology Co Ltd | 2 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 11 | Kansas State University Research Foundation | 2 | |
| 12 | GM Global Technology Operations LLC | 2 | |
| 13 | Jiangsu Sobute New Materials Co Ltd | 2 | |
| 14 | Bote Building Materials (Tianjin) Co Ltd | 2 | |
| 15 | AKSA KARBON & ILERI KOMPOZIT MALZEMELER SANAYI LTD… | 1 | |
| 16 | Shanxi Provincial Transportation Technology R&D Co Ltd | 1 | |
| 17 | Shencai Tech Shenzhen Co Ltd | 1 | |
| 18 | Kangda New Materials (Group) Co Ltd | 1 | |
| 19 | Hunan University of Technology | 1 | |
| 20 | Mitsui Chemicals Inc | 1 |
The leader’s concentration in adhesive chemistry (C09J) and layered-product structures (B32B) reflects deep, systematic coverage of the core bonding interface rather than diversified downstream applications — a filing strategy that raises the cost of designing around for any new entrant targeting metal-CFRP hybrid assemblies.
Patent applications typically publish 18–24 months after filing, so counts for 2024 and 2025 should be treated as preliminary; the true extent of recent activity will not be visible until those cohorts mature. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
A 2022 filing surge followed by a plateau; adhesive chemistry and laminates dominate the technology mix
Two charts together frame the field’s development pace and the technology branches where work is concentrated — and where it is sparse.
Annual filing trend
Filing activity built gradually from 2018, reached a pronounced peak in 2022 with nine records, then pulled back sharply in 2023. The 2024 and 2025 cohorts show modest recorded values, but both remain subject to publication lag and should not be read as the final tally for those years. The multi-year growth figure of 20% reflects the overall upward trajectory since the base period, consistent with a maturing rather than declining field.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B32B (Layered products and laminates) and C09J (Adhesives) together account for the visible share of IPC classifications, confirming that the core technical debate is about bonding chemistry and interface architecture. B29C (Shaping of plastics) forms a meaningful third branch, reflecting process-side claims. Lower-count branches — including C23F (Corrosion and metal removal), C08G (Condensation polymers), and civil-engineering classes E04B and E04D — mark areas where activity is present but thin.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Epoxy adhesive, manufacture and use thereof
The invention relates to epoxy adhesives. An epoxy adhesive is provided that simultaneously has low E-modulus and high glass temperature. Such adhesives are useful in the manufacture of large machinery (e.g., automobiles), and are useful for bonding different materials, such as metal and carbon fiber composite. The cured epoxy adhesive can be formulated to… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Shape memory alloy/fiber reinforced polymeric comp… | 63 |
| 2 | Magnesium alloy compound material, and its manufac… | 61 |
| 3 | Titanium alloy compound material, and its jointing… | 44 |
| 4 | Bonded composite containing metal, and method for … | 26 |
| 5 | エポキシ系接着剤並びにその製造および用途 | 25 |
| 6 | Integrally assembled product of CFRP pipe and meta… | 23 |
| 7 | Epoxy adhesive, manufacture and use thereof | 23 |
| 8 | 一种环氧胶粘剂及其制备方法 | 20 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the patent structure means for R&D investment decisions
The combination of high concentration, a defined peak year, and sparse adjacent branches shapes both the risk profile and the entry points available to new participants.
Field has plateaued near its 2022 peak
The lifecycle stage is Maturity: annual filings have plateaued near their 2022 peak rather than continuing to climb. The multi-year growth figure of 20% confirms that cumulative activity has expanded over the review window, but the annual cadence has eased. R&D teams entering now face an established prior-art landscape and should prioritize freedom-to-operate analysis before committing to adhesive chemistry routes already well covered by Taisei Plas.
Lifecycle: MaturityOne visible filer; second tier fragmented
The top five filers hold 63% of the ranked applicants visible in this query’ combined patent records, and Taisei Plas alone accounts for 26 patent records — roughly equal to the next four filers combined. This extreme top-heaviness means the field’s coverage is shaped by one company’s strategic choices. Challengers Carlisle Intangible LLC and ANDOH Corp LLP Co each hold 8 patent records and represent the only realistic near-term benchmarks for a challenger positioning.
High concentrationUniversity co-filing identified; limited ecosystem co-development
The University of Cincinnati and Kansas State University Research Foundation are the sole recorded co-filing pair, with 2 joint patent records. This single collaboration signals that academic-industrial co-development in this space is nascent rather than systematic. For an industrial entrant, partnering with a materials science or composites research group represents an underexploited path to building positions in adjacent branches without competing head-on with Taisei Plas.
Limited co-filingUS leads; China and Europe are secondary but active
The United States is the primary filing jurisdiction with 26 patent records, followed by China with 15 and Europe (EPO) with 13. Japan, a natural home market for Taisei Plas and Toray, shows 10 records. PCT filings (5 records) suggest selective global protection strategies rather than broad cross-border coverage. The China and India presence, supported by domestic filers such as Jiangsu Sobute New Materials and the Indian Institute of Technology Kharagpur, points to emerging regional activity in construction and infrastructure applications.
US-led, China/EU secondaryGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| University of Cincinnati | Kansas State University Research Foundation | 2 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Taisei Plas Co Ltd
Taisei Plas holds 26 patent records, built on deep coverage of epoxy adhesive chemistry (C09J 163) and metal-CFRP layered structures (B32B 15, B32B 9). The breadth of its laminate and adhesive claims creates a dense prior-art thicket at the core bonding interface. Momentum data shows its most recent cohort is classified as a new entrant in the recent window, suggesting the bulk of its portfolio predates the current measurement period — making its established base the primary competitive constraint rather than accelerating new filings.
patent records: 26ANDOH Corp LLP Co
ANDOH Corp LLP Co holds 8 patent records and is classified as a new entrant with 5 records in the recent window — the strongest recent momentum among all ranked filers. Its technology focus spans laminate interfaces (B32B 7, B32B 15) and plastics shaping processes (B29C 65), indicating a process-integration angle complementary to Taisei Plas’s chemistry-first approach. This process orientation, combined with rapid recent activity, positions ANDOH as the most active challenger to watch in the near term.
patent records: 8Frequently asked questions
The analysis covers 31 patent families in scope globally. The ranking data, which identifies up to 100 applicants, is expressed in patent records, which can exceed the family count because a single family may be counted across multiple jurisdictions or applicants.
Taisei Plas Co Ltd leads with 26 patent records, concentrated in epoxy adhesive chemistry (C09J 163) and metal-CFRP layered structures (B32B 15). No other single entity comes close; the next-ranked filers — Carlisle Intangible LLC and ANDOH Corp LLP Co — each hold 8 patent records.
The field is classified as Maturity. Annual filings peaked in 2022 and have plateaued since. The overall multi-year growth of 20% reflects cumulative expansion over the review window, but the year-on-year cadence has eased from its peak, which is consistent with a consolidating, mature technology area.
The United States leads with 26 patent records, followed by China with 15, Europe (EPO) with 13, and Japan with 10. PCT filings account for 5 records, indicating selective rather than broad international protection strategies among most filers.
One collaboration is recorded: the University of Cincinnati and Kansas State University Research Foundation co-filed 2 patent records together. No other co-filing pairs are identified in the evidence, suggesting that academic-industrial collaboration in this specific space remains limited.
The sparsest adjacent branches relative to core activity are C23F (Corrosion and metal removal, 14 patent records, 7% share) and C08G (Condensation polymers, 8 patent records, 4% share). Surface pre-treatment protocols and novel resin backbone chemistries are areas where IP density is low enough that a focused filing program could establish a differentiated position, subject to freedom-to-operate review around existing Dow and Taisei Plas claims.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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