https://www.patsnap.com/resources/blog/rd-blog/chemical-vapor-deposition-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Surface Engineering, Coatings & Adhesives
Chemical Vapor Deposition Patents: Who Leads and Where Filing Is Heading
  • 16.0% concentration at the top. The five leading assignees combined account for 31,157 of the 195,076 records in scope — a concentrated core sitting above a long tail of single- and few-filing entrants.
  • Filing has cooled from its 2021 peak. Filings ran from 650 in 2021 to 328 in 2024, a -50% pullback over that span; 2025 and later years are still filling in as publications catch up to filing dates.
  • Semiconductor-adjacent classes dominate the claim space. H01L and C23C each sit near 5% of all records, while crystal growth (C30B) and organo-metallic precursor chemistry (C07F) remain comparatively lightly claimed.
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195.1K
Published Records
16%
Top-5 Share of All Records
-50%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (650 records) with 2024 (328) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 195,076 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What the CVD patent record actually shows

Chemical vapor deposition spans everything from semiconductor front-end processing to protective coatings on cutting tools, and the patent record reflects that breadth. Filing activity in this dataset is anchored by process and equipment claims tied to substrate surfaces, deposition rate control and reaction-medium chemistry rather than by any single end-use industry. The IPC composition confirms this: semiconductor device classes (H01L, H10P) sit alongside coating-specific classes (C23C, B05D) and precursor chemistry (C07F) at meaningfully lower shares, indicating that equipment and process engineering claims outnumber material-composition claims in this corpus.

Filing volume peaked in 2021 and has since declined through the last complete year, 2024 — a pattern consistent with a maturing process technology where core deposition mechanics are already well claimed and new filings increasingly target incremental process control rather than foundational apparatus.

Filing volume by year, 2017–2026
  1. 1APPLIED MATERIALS INC14,795
  2. 2TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD5,030
  3. 3MICRON TECHNOLOGY INC4,402
  4. 4INTERNATIONAL BUSINESS MACHINE CORPORATION3,555
  5. 5LAM RES CORP3,375
  6. 6SEMICON ENERGY LAB CO LTD3,218
  7. 7INTEL CORP2,320
  8. 8CANON KK2,318
  9. 9TOKYO ELECTRON LTD2,316
  10. 10KK TOSHIBA1,974
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Chemical Vapor Deposition Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trend and technology composition

Two views of the same 195,076-record dataset: how filing volume has moved year over year, and how records distribute across IPC subclasses.

Filing trend, 2017–2026

Filings rose from 477 in 2017 to a peak of 650 in 2021, then fell to 328 by 2024 — a -50% change over that three-year window. 2025 and 2026 figures are partial because publication trails filing by roughly 18 months; they should not be read as a continued decline until later data confirms it.

Filing trend, 2017–20260200400600800477201720182019202065020212022202320242025122026Most recent year is partial — publication lag means later filings are not yet visible.

Technology composition by IPC subclass

H01L (semiconductor devices) and C23C (coating & surface deposition) each account for roughly 5% of all records, with H10P close behind at 3.2%. Crystal growth (C30B), electron tube fabrication (H01J), general semiconductor devices (H10D), coating processes (B05D) and organo-metallic precursor chemistry (C07F) each sit at 0.5-0.8% of records — smaller footprints that mark less-crowded claim territory. Records can carry multiple IPC classes, so these shares sum to more than 100%.

Technology composition by IPC subclassH01L · Semiconductor devices10,2515.3%C23C · Coating & surface deposition10,2325.2%H10P6,1563.2%C30B · Crystal growth1,4870.8%H01J · Electron & discharge tubes1,0210.5%H10D · Semiconductor devices (general)9500.5%B05D · Coating processes9370.5%C07F · Organo-metallic & non-carbon c…9370.5%Other14,3497.4%

Shares are the percentage of the 195,076 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Chemical Vapor Deposition Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative and most-cited filings

Representative filing
US7132219B22006-11-07

Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition (US7132219B2)

BREWER SCIENCE INC.

Filed by Brewer Science, this patent covers plasma-enhanced CVD of polymeric antireflective coatings onto substrate surfaces, using fluorinated styrene-family monomers subjected to electric current and pressure to sublime, plasmify and then polymerize onto the substrate.Abstract text drawn directly from the filing.

US7132219B2 — patent drawing 1US7132219B2 — patent drawing 2
View full record →
Most-cited records in this dataset
#Publication no.Patent titleCitations
1US20060110867A1Field effect transistor manufacturing method4,449
2US7431968B1Process and apparatus for organic vapor jet deposition2,575
3US5278100AChemical vapor deposition technique for depositing titanium silicide on semiconductor wafers1,335
4US5070032AMethod of making dense flash EEprom semiconductor memory structures1,297
5US20080170982A1Fabrication and Application of Nanofiber Ribbons and Sheets and Twisted and Non-Twisted Nanofiber Yarns1,266
6US6511539B1Apparatus and method for growth of a thin film1,241
7US5661053AMethod of making dense flash EEPROM cell array and peripheral supporting circuits formed in deposited field o…1,222
8US5000113AThermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-…1,155
9US6013553AZirconium and/or hafnium oxynitride gate dielectric1,093
10US20030089899A1Nanoscale wires and related devices1,061

Citation counts reflect influence within the searched corpus and skew toward older filings; they are not a measure of current commercial importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Chemical Vapor Deposition Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing strategy

Reading concentration, trend and citation data together points to where claim space is occupied and where it isn't.

Concentration
16.0% of 195,076 records
Top 5 assignees combined

A concentrated core, not a monopoly

The five leading assignees together hold 16.0% of all records in scope, rising to 22.2% across the top ten. That leaves the large majority of filing activity distributed across a long tail of the ranked leaders and beyond — this is a field with room for differentiated process claims, not one locked up by a handful of players.

Based on the assignee ranking of 100 companies.
Momentum
650 → 328
2021 peak to 2024

Filing has pulled back from its 2021 high

Volume fell -50% from the 2021 peak of 650 to 328 in 2024, the last year with complete publication coverage. Recent-year momentum figures for individual leading assignees show sharp year-over-year declines, though these figures reflect the same 18-month publication lag and should be read cautiously.

2025-2026 figures are partial and will revise upward.
Composition
5.3% vs 0.5%
H01L vs C07F share of records

Process claims outweigh precursor chemistry

Semiconductor device classes and coating-process classes carry far more records than precursor-chemistry classes like C07F or crystal-growth class C30B. That gap suggests process and apparatus claims are more heavily contested than the underlying chemical precursor space.

Shares are of all 195,076 records; a record can carry multiple classes.
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to chemical vapor deposition patent landscape, with the prior art for and against each one.

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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Chemical Vapor Deposition Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where activity is thinning

The ranked leaders sit atop a much larger population of occasional filers. Momentum among the largest names has slowed sharply in the most recent year, a pattern likely amplified by publication lag rather than a genuine stop in R&D.

Leader
14,795 records
Top-ranked assignee

A clear top filer, then a steep drop-off

The leading assignee's record count is more than four times that of the fifth-place assignee (3,375), and nearly eight times the tenth-place assignee (1,974) — a steep gradient rather than a plateau.

Counts are of published records, not litigated claims.
Collaboration
10 pairs
Co-assignee relationships

Co-filing is limited but concentrated

Only ten co-assignee pairs appear in the dataset, with the strongest links running between large semiconductor equipment and device makers — a sign that most CVD patenting happens inside a single organisation rather than through joint filings.

Strongest pair count: 29 shared filings.
Momentum
-92% to -100% YoY
Leading assignees, latest year

Sharp recent-year pullback among the largest filers

Several of the largest assignees show year-over-year declines in the 90-100% range for the latest year on record. Given the roughly 18-month lag between filing and publication, this looks more like an incomplete data window than an actual halt in filing.

Latest-year figures are provisional and will rise as more filings publish.
🔍
Under-claimed sub-areas worth watching
Branches with comparatively low record counts relative to the core semiconductor and coating classes
Crystal growth process control (C30B)Organo-metallic precursor design (C07F)Electron/discharge tube fabrication (H01J)General semiconductor device structures (H10D)Coating process parameter control (B05D)
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Applied Materials, Inc.1-97%
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)1-92%
Lam Research Corporation1-93%
Micron Technology, Inc.0
International Business Machines Corporation (IBM)0-100%
Air Products and Chemicals, Inc.0
Tokyo Electron Limited0-100%
Advanced Technology Materials, Inc.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Chemical Vapor Deposition Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to a field with a concentrated core, a cooling filing trend and unevenly claimed adjacent branches. The next step is turning that into a filing or freedom-to-operate decision.

Map white space before drafting new claims

Under-claimed classes like C30B and C07F warrant a closer look before committing to a filing strategy in adjacent process chemistry.

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Track momentum, not just totals

Recent-year declines among the largest filers may reflect publication lag rather than a real slowdown — worth monitoring as later data fills in.

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Check freedom-to-operate against the most-cited records

The most-cited filings in this corpus anchor prior art searches for anyone drafting new deposition-rate or substrate-surface claims.

Run a citation check in Patsnap Eureka →
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Chemical Vapor Deposition Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about the CVD patent landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Chemical Vapor Deposition Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.