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CMOS Image Sensor Integration Patents: Who Leads, Where the Gaps Are 2026

CMOS Image Sensor Integration Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/cmos-image-sensor-system-integration-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Sensors & MEMS
CMOS Image Sensor System Integration Patents
  • Filing activity is flat, not growing. The trend runs from 2 filings in 2017 to a 2023 peak of just 4, with the most recent year showing zero — a small, mature corpus rather than an expanding one.
  • One family cluster dominates citations. The five most-cited records, led by US9188765B2 at 135 citations, all trace to the same lens-array and depth-map lineage, concentrating influence rather than spreading it.
  • Momentum has stopped across every tracked assignee. Every assignee in the recent-momentum data shows zero filings in the latest year, including a -100% YoY drop for Adeia Imaging — the leading names have gone quiet at once.
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22
Published Records
US
Leading Jurisdiction
2023
Peak Filing Year
G02B
Lead IPC Subclass
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks patent families at the intersection of CMOS image sensors and system-level integration — camera-module assembly, sensor-to-ISP interfacing, wafer-level optics, and optics integration — filed against H04N23, H01L27/146 and H04N25 classifications. It is a narrow, well-defined slice: 22 published records, all routed through the United States receiving office, spanning 2015 through the 2026 data cut-off.

The technology composition sits almost entirely across three IPC subclasses — G02B optical elements, H04N pictorial communication, and G06T image data processing — appearing in 22, 22 and 21 of the 22 records respectively. That overlap signals a corpus where optics, transmission and downstream image processing are claimed together rather than in isolation, which is consistent with the module-integration framing of the search itself.

Filing activity, 2017-2026
  1. 1Pelican Imaging (Cayman) Limited7
  2. 2ADEIA IMAGING LLC7
  3. 3Pelican Imaging Corporation6
  4. 4FotoNation Cayman Limited2
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on CMOS Image Sensor System Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trend and technology composition

Two views of the same 22-family corpus: how filing activity has moved year over year, and which IPC subclasses carry the claim weight.

A flat-to-declining filing curve

Filings opened at 2 in 2017, held near the midpoint at 1 in 2022, and peaked at 4 in 2023 before falling off. Remember that the most recent year is always undercounted — publication typically lags filing by around 18 months — but even allowing for that lag, this is not a growth curve.

A flat-to-declining filing curve012342201720182019202020212022420232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Three subclasses, near-total overlap

G02B (optics) and H04N (pictorial communication) each appear in all 22 records; G06T (image data processing) appears in 21. Filers here are not claiming a sensor or an optic alone — they are claiming the assembled path from lens to processed image, which is the defining feature of an integration-focused corpus.

Three subclasses, near-total overlapG02B · Optical elements & systems22100.0%H04N · Pictorial communication (video…22100.0%G06T · Image data processing & genera…2195.5%

Shares are the percentage of the 22 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on CMOS Image Sensor System Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on CMOS Image Sensor System Integration with Eureka

This page is one run against one query. Ask Eureka your own question about cmos image sensor system integration and every answer comes back with the patent numbers behind it.

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Key patents

The most-cited records

Representative filing
US9235898B22016-01-12

Systems and methods for generating depth maps using light focused on an image sensor by a lens element array (US9235898B2)

FOTONATION LIMITED

A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.Filed by Fotonation Limited, published 2016-01-12. One of five records in this corpus each cited over 100 times, all sharing the same lens-array/depth-map lineage.

US9235898B2 — patent drawing 1US9235898B2 — patent drawing 2
View full record
Top-cited families in this corpus
#Publication no.Patent titleCitations
1US9188765B2Capturing and processing of images including occlusions focused on an image sensor by a lens stack array135
2US9235898B2Systems and methods for generating depth maps using light focused on an image sensor by a lens element array132
3US20160267665A1Systems and Methods for Generating Depth Maps Using Light Focused on an Image Sensor by a Lens Element Array118
4US20160269650A1Capturing and Processing of Images Including Occlusions Focused on an Image Sensor by a Lens Stack Array108
5US20180048830A1Capturing and Processing of Images Including Occlusions Focused on an Image Sensor by a Lens Stack Array78
6US10142560B2Capturing and processing of images including occlusions focused on an image sensor by a lens stack array72
7US20190109998A1Capturing and Processing of Images Including Occlusions Focused on an Image Sensor by a Lens Stack Array57
8US10375319B2Capturing and processing of images including occlusions focused on an image sensor by a lens stack array52
9US20190356863A1Capturing and Processing of Images Including Occlusions Focused on an Image Sensor by a Lens Stack Array50
10US20200389604A1Capturing and Processing of Images Including Occlusions Focused on an Image Sensor by a Lens Stack Array43

Citation counts reflect influence within the searched corpus and skew toward older filings; treat them as a signal of foundational status, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on CMOS Image Sensor System Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three readings of the same corpus, aimed at where an IP or R&D team would actually need to act.

Filing pace
2 → 0
2017 to latest year

The corpus has stopped growing

Filing volume never exceeded 4 in a single year and the latest tracked year shows zero. Combined with an 18-month publication lag, this points to a technology area that reached its claim density early and has not been re-energised by a second wave of filers.

Peak year: 2023 at 4 filings
Citation concentration
135 citations
top-cited record

Influence sits with one lineage

The five most-cited records in this dataset are all variations on the same lens-array and depth-map architecture. A newcomer's freedom-to-operate analysis should start there, since that lineage anchors the prior art baseline for the whole space.

Top five records each cited 78 or more times
Assignee momentum
0 in latest year
across tracked assignees

The leading filers have gone quiet together

Every assignee with recent-momentum data recorded zero filings in the latest year, including a -100% year-over-year decline for Adeia Imaging. That is unusual for a still-cited corpus and suggests consolidation of rights rather than active new claiming.

Adeia Imaging LLC: -100% YoY
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to cmos image sensor system integration, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on CMOS Image Sensor System Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claims

A small assignee set, all showing the same pattern: prior activity concentrated in a shared corporate lineage, followed by a stop in the most recent filing year.

Assignee
0
filings, latest year

Adeia Imaging LLC

Shows a -100% year-over-year drop in the most recent tracked year, the only assignee in this set with a measured YoY figure — a sharp stop rather than a gradual wind-down.

Recent-year filings: 0
Assignee
0
filings, latest year

Pelican Imaging (assignee lineage)

Associated with the foundational lens-array and depth-map families that carry the corpus's highest citation counts, but shows no filings in the latest tracked year.

Part of the same corporate lineage as Adeia Imaging
Assignee
0
filings, latest year

Fotonation-linked entities

The representative record in this dataset, US9235898B2, was filed under this lineage. Filing activity across the related entity names has also gone to zero in the latest year.

Representative filing: US9235898B2, 2016-01-12
🔍
Under-claimed sub-areas worth checking
Branches within this IPC set that show thinner claim density relative to the core lens-array/depth-map lineage.
Sensor-to-ISP data interface protocolsWafer-level optics alignment tolerancingMulti-imager substrate co-packagingOn-chip depth-map post-processingCamera-module thermal/mechanical integration
Rank all filers by momentum →
Recent-year filing momentum
AssigneeRecent yearYoY
Pelican Imaging (Cayman) Limited0
ADEIA IMAGING LLC0-100%
Pelican Imaging Corporation0
FotoNation Cayman Limited0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on CMOS Image Sensor System Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Working with this landscape

The corpus is small and its filing curve has flattened, which changes what a next step should look like.

Check freedom-to-operate against the lens-array lineage first

The top five cited records share one architectural lineage. Any new camera-module or depth-sensing filing should be checked against that lineage before broader searching, since it anchors most of the corpus's prior art.

Explore this in Eureka

Treat the zero-filing latest year with caution

Publication lag of roughly 18 months means the most recent year understates real activity. Re-check filing counts for this space again once later-year publications catch up.

Track this space in Eureka

Look at the under-claimed branches before the core

Sensor-to-ISP interface protocols and wafer-level alignment tolerancing show thinner density than the core lens-array claims, which may leave more room to file a defensible first claim.

Map white space in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on CMOS Image Sensor System Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Questions practitioners ask

Answers are grounded in the same dataset. Derived from a Patsnap search on CMOS Image Sensor System Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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