Co-Packaged Optics Patents: Top Companies & Filing Trends 2026
Co-Packaged and Near-Package Optics Patents: Who Leads and Where Filings Are Heading
43.8% concentration. The top five assignees alone account for 785 of the 1,792 records in scope — filing here is already concentrated at the top. Annual filings climbed from 52 in 2017 to a peak of 302 in 2023, with 2021-to-2024 growth of +52% (180 to 273) marking the field's fastest complete-year stretch. 2025 and 2026 figures are still filling in as publications catch up to filing dates, so the apparent tail-off should not be read as a slowdown.
- 1INTEL CORP18.8%
- 2TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD12.2%
- 3CABLE TELEVISION LAB INC4.5%
- 4CIENA CORP4.4%
- 5INFINERA CORP3.9%
See the full co packaged and near package optics analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about co-packaged optics patents
Who holds the most patents in co-packaged optics?
The assignee ranking in this dataset is led by a single company holding 337 of the 1,792 records in scope, well ahead of the fifth-ranked assignee at 70 and the tenth-ranked at 30. The top five assignees combined account for 785 records, or 43.8% of all records, meaning filing activity is concentrated rather than evenly spread. Anyone evaluating freedom to operate in this space should start with the leader’s portfolio before looking at the long tail of single- or few-filing entrants.
Is co-packaged optics patent filing still growing?
Yes, through the last complete filing year in the dataset. Filings rose from 180 records in 2021 to 273 in 2024, a 52% increase over three years, with an overall peak of 302 records in 2023. Filing counts in 2025 and 2026 appear lower, but that reflects the roughly 18-month lag between filing and publication rather than an actual drop in inventive activity — those years will keep filling in as more applications publish.
What technical areas get the most patent claims in this field?
Optical elements and systems, covered by IPC class G02B, appear in 67.7% of the 1,792 records, making it by far the most heavily claimed area. Semiconductor devices (H01L) and general transmission (H04B) follow at 27.5% and 16.6% respectively. Printed-circuit and assembly claims under H05K, which cover much of the physical packaging and substrate work, appear in only 4.3% of records, indicating that the substrate-integration side of co-packaged optics is comparatively under-claimed relative to the optical path.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Co Packaged and Near Package Optics covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.