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Run your analysis now →https://www.patsnap.com/resources/blog/rd-blog/co-packaged-and-near-package-optics-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Datacenter Optical InterconnectCo-Packaged and Near-Package Optics Patents: Who Leads and Where Filings Are Heading
- 43.8% concentration. The top five assignees alone account for 785 of the 1,792 records in scope — filing here is already concentrated at the top.
- +52% growth 2021–2024. Filings rose from 180 in 2021 to 273 in 2024, the last year with a complete publication picture.
- Optics dominates, packaging lags. G02B optical elements appear in 67.7% of records, while H05K printed-circuit assembly claims sit at just 4.3% — a wide gap between optical and packaging-side claiming.
1,792
Published Records
44%
Top-5 Share of All Records
+52%
Filing Growth 2021→2024
US
Leading Jurisdiction
Filing growth compares 2021 (180 records) with 2024 (273) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,792 records in scope (CR5), not by the ranked leaders only.
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview
What this landscape covers
Co-packaged optics moves the optical engine off a pluggable module and onto or near the same substrate as the switch ASIC, cutting electrical channel loss between silicon and fiber. This landscape tracks 1,792 records filed between 2015 and mid-2026 that combine core CPO concepts — co-packaged optics, optical engines, photonic integrated circuits — with the engineering constraints that make the approach hard: electrical channel loss, thermal crosstalk, fiber attachment, external laser sourcing, and package substrate design.
The dataset spans semiconductor majors, optical component specialists and networking equipment vendors, with receiving offices concentrated in the United States and supplemented by PCT, European, German, Canadian and Chinese filings. Because publication lags filing by roughly 18 months, the most recent one to two years in any trend understate real filing activity.
Filing activity and technology composition, 2015–2026
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Co Packaged and Near Package Optics covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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The Numbers
Filing trends and technology composition
Two views of the same 1,792-record corpus: how filing volume has moved year over year, and which IPC subclasses carry the claims.
Filing trend: steady build to a 2023 peak
Annual filings climbed from 52 in 2017 to a peak of 302 in 2023, with 2021-to-2024 growth of +52% (180 to 273) marking the field's fastest complete-year stretch. 2025 and 2026 figures are still filling in as publications catch up to filing dates, so the apparent tail-off should not be read as a slowdown.
IPC composition: optics-heavy, packaging thin
G02B (optical elements and systems) touches 67.7% of the 1,792 records, far ahead of H01L semiconductor devices at 27.5% and H04B transmission at 16.6%. H05K, the printed-circuit and assembly class most relevant to substrate-level packaging work, sits at only 4.3% — since a record can carry multiple IPC classes, these shares add up to more than 100% and should be read against the full record count, not against each other.
Shares are the percentage of the 1,792 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Co Packaged and Near Package Optics covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.
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Representative and most-cited filings
Representative Recent Filing
US20260013252A1 — Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO., LTD.
Samsung's filing describes a semiconductor package built on a package substrate and intermediate substrate, carrying an optical engine unit alongside a logic device and memory device. The optical engine unit itself stacks a PIC chip and an EIC chip on a redistribution substrate, surrounded by a multi-insulating layer and capped with a transparent support layer.Filed 2026-01-08 — illustrates the current push toward integrating PIC and EIC dies directly into a multi-die package alongside logic and memory, rather than housing optics in a separate module.
Most-cited records in the corpus
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20030095737A1 | Transmitter photonic integrated circuits (TxPIC) and optical transport networks employing TxPICs | 294 |
| 2 | US8546955B1 | Multi-die stack package | 282 |
| 3 | US20030044118A1 | Integrated planar composite coupling structures for bi-directional light beam transformation between a small … | 159 |
| 4 | US20050100345A1 | Monolithic transmitter/receiver photonic integrated circuit (Tx/RxPIC) transceiver chip | 151 |
| 5 | US20040067006A1 | Transmitter photonic integrated circuit ( TxPIC) chips | 143 |
| 6 | US20130308898A1 | Co-packaging photonic integrated circuits and application specific integrated circuits | 139 |
| 7 | US20080044128A1 | TRANSMITTER PHOTONIC INTEGRATED CIRCUITS (TxPICs) AND OPTICAL TRANSPORT NETWORK SYSTEM EMPLOYING TxPICs | 139 |
| 8 | US20080138088A1 | Monolithic transmitter photonic integrated circuit (TXPIC) having tunable modulated sources with feedback sys… | 122 |
| 9 | US20140064659A1 | Electronic and optical co-packaging of coherent transceiver | 121 |
| 10 | US20220159860A1 | Data processing systems including optical communication modules | 113 |
Citation counts favor older filings simply because they have had longer to accumulate citations inside this corpus — treat them as a signal of influence on the field, not of current technical relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Co Packaged and Near Package Optics covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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What the data means for filing strategy
Three patterns stand out once volume, growth and IPC composition are read together.
Concentration
43.8%
of 1,792 records held by top 5
The field is already top-heavy
With 785 of 1,792 records held by the five leading assignees, and the leader alone holding 337, new entrants are filing into a space where the largest players have already staked broad optical-engine and PIC claims. The top ten extend that to 57.2% of all records.
Concentration figures from the assignee ranking
Momentum
+52%
growth, 2021 to 2024
Growth is real but recent momentum is uneven
Filing volume grew from 180 records in 2021 to 273 in 2024, the fastest sustained rise in the dataset's history and evidence that CPO moved from research curiosity to commercial priority in that window. Several leading assignees show sharp year-on-year declines in the latest partial year, which is expected given publication lag rather than a genuine pullback.
Growth figure fixed to the 2021–2024 window per the filing trend data
Claim density
67.7% vs 4.3%
G02B share vs H05K share of 1,792 records
Optics is crowded, substrate packaging is not
G02B optical-element claims cover two-thirds of the corpus while H05K printed-circuit and assembly claims cover only 4.3%, a gap that suggests substrate-level integration — how the PIC, EIC, and package substrate physically combine — is comparatively open relative to the optical path itself.
IPC subclass shares of the 1,792-record corpus
Eureka AI Agent
Looking for what nobody has claimed yet?
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to co packaged and near package optics, with the prior art for and against each one.
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Co Packaged and Near Package Optics covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players
Who is filing, and where the gate sits
The assignee ranking covers 100 companies counted by records; it is the full ranking the dataset returns, not a top-50 or top-100 cut. A handful of firms account for most of the volume, and the co-assignee pairs recorded for the field are thin, suggesting most invention here happens inside single-company teams rather than joint filings.
Leader
337
records
A single leader well ahead of the field
The top-ranked assignee holds 337 records, more than four times the fifth-place total of 70 and over eleven times the tenth-place total of 30 — a steep drop-off rather than a gradual one.
Leader vs fifth and tenth place, assignee ranking
Mid-field
70 → 30
fifth to tenth place records
A tight cluster behind the leader
Records fall from 70 at fifth place to 30 at tenth, meaning the next tier of active filers is bunched together rather than spread evenly — worth watching for which of these firms accelerates next.
Fifth and tenth place counts, assignee ranking
Collaboration
10
co-assignee pairs recorded
Filing here is mostly solo
Only 10 co-assignee pairs appear across the corpus, with the strongest repeated pairings tied to named inventors rather than joint corporate ventures — this is a field of internal R&D programs, not consortiums.
Co-assignee pair count from the collaboration data
Recent-year filing momentum by assignee
| Assignee | Recent year | YoY |
|---|---|---|
| Intel Corporation | 2 | -75% |
| Aurora Operations, Inc. | 1 | -88% |
| Applied Materials, Inc. | 1 | -95% |
| Taiwan Semiconductor Manufacturing Co., Ltd. | 0 | -100% |
| Nubis Communications, Inc. | 0 | -100% |
| Cable Television Laboratories, Inc. | 0 | -100% |
| Infinera Corporation | 0 | — |
| Sky AI, Inc. | 0 | -100% |
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Co Packaged and Near Package Optics covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next
Where to take this analysis
The landscape points to where claim space is dense and where it is thin — the next step is testing a specific filing or design-around against that picture.
Map a specific claim against the leaders' portfolios
Run a freedom-to-operate check against the top-ranked assignees' PIC and optical-engine claims before committing engineering resources to a substrate-integration approach.
Explore in EurekaTrack momentum shifts as 2025–2026 data fills in
The apparent declines in recent-year filings by several leading assignees reflect publication lag, not slowing activity — revisit the trend once 2025 filings finish publishing.
Set up monitoring in EurekaProbe the substrate-packaging white space
H05K's thin 4.3% share alongside heavy G02B and H01L activity suggests substrate-level integration claims are comparatively open — worth a deeper prior-art pull before drafting.
Run a deeper search in EurekaSource: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Co Packaged and Near Package Optics covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ
Common questions about co-packaged optics patents
The assignee ranking in this dataset is led by a single company holding 337 of the 1,792 records in scope, well ahead of the fifth-ranked assignee at 70 and the tenth-ranked at 30. The top five assignees combined account for 785 records, or 43.8% of all records, meaning filing activity is concentrated rather than evenly spread. Anyone evaluating freedom to operate in this space should start with the leader's portfolio before looking at the long tail of single- or few-filing entrants.
Yes, through the last complete filing year in the dataset. Filings rose from 180 records in 2021 to 273 in 2024, a 52% increase over three years, with an overall peak of 302 records in 2023. Filing counts in 2025 and 2026 appear lower, but that reflects the roughly 18-month lag between filing and publication rather than an actual drop in inventive activity — those years will keep filling in as more applications publish.
Optical elements and systems, covered by IPC class G02B, appear in 67.7% of the 1,792 records, making it by far the most heavily claimed area. Semiconductor devices (H01L) and general transmission (H04B) follow at 27.5% and 16.6% respectively. Printed-circuit and assembly claims under H05K, which cover much of the physical packaging and substrate work, appear in only 4.3% of records, indicating that the substrate-integration side of co-packaged optics is comparatively under-claimed relative to the optical path.
This Samsung filing, dated 2026-01-08, describes a semiconductor package that integrates an optical engine unit — itself a stack of a photonic integrated circuit (PIC) chip and an electronic integrated circuit (EIC) chip on a redistribution substrate — alongside a logic device and a memory device on a shared intermediate substrate. The claims center on the physical arrangement: a multi-insulating layer surrounding the PIC and EIC chips and a transparent support layer capping the assembly. For engineers working on multi-die optical-electronic packages, this filing is relevant to any design that co-locates PIC, EIC, logic and memory dies on a common substrate with a similar insulating and support-layer structure.
With the top five assignees holding 43.8% of all 1,792 records and the top ten holding 57.2%, this field shows meaningful concentration at the top while still leaving a substantial tail of the ranked field to the remaining 90 companies. The steep drop from the leader's 337 records to 70 at fifth place suggests one or two dominant filers rather than a broad oligopoly. Co-assignee pairs are also sparse — only 10 recorded across the corpus — indicating most invention happens inside single-company R&D programs rather than joint ventures.
Answers are grounded in the same dataset. Derived from a Patsnap search on Co Packaged and Near Package Optics covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.