https://www.patsnap.com/resources/blog/rd-blog/co-packaged-optics-and-optical-io-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Silicon Photonics · Patent Landscape
Co Packaged Optics and Optical IO Patents
  • 78.8% of records sit with five companies. 123 of the 156 records in scope belong to the top five assignees, with a long tail of single- and few-filing entrants behind them.
  • Filing activity peaked in 2023 at 49 records then eased to 21 by 2024, a 28% pull-back from the 2021 level of 29 — though 2025-26 counts are still filling in as publications lag filing.
  • G02B optical elements dominate the claim space at 68.6% of all 156 records, while thermal and packaging-adjacent classes like H05K and H01L remain comparatively thin.
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156
Published Records
79%
Top-5 Share of All Records
-28%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (29 records) with 2024 (21) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 156 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this landscape covers

Co packaged optics moves the optical engine off a pluggable module and onto or near the switch ASIC substrate, trading connector convenience for energy-per-bit and faceplate-density gains. The 156 records in this dataset span filings from 2015 through the mid-2026 cut-off, covering claims on detachable optical connectors, external laser sources, thermal crosstalk mitigation, and reliability qualification methods that sit alongside the core optical-engine architecture claims.

The picture that emerges is one of early concentration: a handful of assignees built out broad architecture claims while the field was still small, and later entrants have had to file around thermal, packaging, and interconnect details rather than core optical-engine designs.

Filing activity by year, 2015-2026
  1. 1CIENA CORP59
  2. 2AVICENATECH CORP19
  3. 3TERAMOUNT LTD19
  4. 4NUBIS COMMUNICATIONS INC14
  5. 5HUAWEI TECH CO LTD12
  6. 6SENKO ADVANCED COMPONENTS INC9
  7. 7SAMTEC INC4
  8. 8HEWLETT PACKARD ENTERPRISE DEV LP3
  9. 9OPTILAB LLC2
  10. 10ASML NETHERLANDS BV2
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Co Packaged Optics and Optical IO covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trends and technology composition

Two views of the same 156 records: how filing activity has moved year over year, and which IPC subclasses carry the claim density.

A filing peak in 2023, then a pull-back

Filings rose through the early 2020s to a peak of 49 records in 2023, then declined to 21 by 2024 -- a 28% drop from the 2021 level of 29. Because publication trails filing by roughly 18 months, the 2025 and 2026 figures are still incomplete and should not be read as a continued decline.

A filing peak in 2023, then a pull-back01325385002017201820192020202120224920232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Optical elements dominate; packaging and thermal classes are thinner

G02B (optical elements & systems) appears in 68.6% of the 156 records, and H04B (transmission) in 39.7%. Packaging-adjacent classes -- H05K at 21.8% and H01L at 10.3% -- carry far fewer records, which is where thermal and mechanical integration claims tend to sit.

Optical elements dominate; packaging and thermal classes are thinnerG02B · Optical elements & systems10768.6%H04B · Transmission (general)6239.7%H05K · Printed circuits & assemblies3421.8%H01L · Semiconductor devices1610.3%H04J · Multiplex communication106.4%G06F · Electric digital data processi…85.1%H04L · Digital information transmissi…85.1%F21V · Lighting device components53.2%Other3824.4%

Shares are the percentage of the 156 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Co Packaged Optics and Optical IO covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key patents

The most-cited records in this field

Representative recent filing
US20250301845A12025-09-25

Vertical optical IO for multi-chip packages

AVICENATECH, CORP.

A multi-chip package may include a system-on-chip (SoC) and an optical IO subassembly on a common substrate, linked by a die-to-die interface. The optical IO subassembly may include an optical IO IC with microLEDs and/or photodetectors bonded away from the substrate, with an optical window layer shielding the optical elements from molding-related damage during assembly.Filed by AVICENATECH, CORP. and published 2025-09-25 as US20250301845A1.

US20250301845A1 — patent drawing 1US20250301845A1 — patent drawing 2
View this record in Patsnap Eureka
Highest-citation records in scope
#Publication no.Patent titleCitations
1US20220159860A1Data processing systems including optical communication modules113
2US20230018654A1Communication systems having pluggable modules57
3US20230043794A1Communication systems having optical power supplies56
4US20220263586A1Communication systems having optical power supplies50
5US20220264759A1Thermal design for rack mount systems including optical communication modules50
6US20220244465A1Data processing systems including optical communication modules50
7US20230077979A1Data processing systems including optical communication modules46
8US20230375793A1Communication systems having pluggable modules41
9US20210320718A1Optically-enhanced multichip packaging40
10US20230084003A1Optical Coupling37

Citation counts favour older, earlier-filed records inside this corpus -- read them as a signal of influence within the dataset, not as a marker of current technical relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Co Packaged Optics and Optical IO covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-outs from the dataset that matter more than the raw counts.

Concentration
78.8%
of 156 records held by top 5

Architecture claims are largely staked out

With 123 of 156 records concentrated in five companies, core optical-engine and co-packaging architecture claims are dense prior art. New entrants are more likely to find open space in implementation detail -- thermal management, connector mechanics, qualification methods -- than in the base architecture.

Based on the assignee ranking of 30 companies, all counted in records.
Momentum
-28%
2021 to 2024 filing change

A pull-back after the 2023 peak, not a collapse

Filings ran from 29 in 2021 to a peak of 49 in 2023, then eased to 21 by 2024. That is a real three-year decline, but with publication lagging filing by around 18 months, the true 2025-26 trajectory is not yet visible in this data.

Peak year so far: 2023 at 49 records.
Technology mix
68.6%
of records tag G02B

Optical elements dominate; thermal and packaging trail

G02B and H04B together anchor most of the field's claim language, while H05K, H01L, H04J and F21V each appear in a minority of records. That gap is where packaging-level and thermal-interface claims have more room to be written narrowly and still stand.

Class shares sum to more than 100% because records carry multiple IPC codes.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to co packaged optics and optical io, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Co Packaged Optics and Optical IO covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the gate sits

The ranking covers 30 companies across all 156 records -- a full field, not a top-50 cut. Five names hold the majority of the volume, with co-inventor clusters suggesting where the deepest technical teams sit.

Leader
59 records
top-ranked assignee

A clear single leader

The top-ranked assignee holds 59 of the 156 records, well ahead of fifth place at 12 -- a gap wide enough that competitive analysis of this field starts with understanding that one portfolio in detail.

Fifth place: 12 records. Tenth place: 2 records.
Co-filing
10 pairs
co-assignee combinations

A tight inventor cluster drives several filings

Three co-inventor pairs each appear on six shared records, all drawn from the same small group of named inventors -- a signal of a concentrated technical team behind a meaningful share of the architecture-level claims.

Strongest pairs share six co-filed records each.
Long tail
20 of 30
assignees below fifth place

Most ranked filers hold small portfolios

Beyond the top five, filing counts drop quickly toward single digits. That tail includes component specialists in connectors and pluggable hardware alongside broader systems companies testing the space with a handful of filings each.

Tenth-ranked assignee holds 2 records.
🔍
Under-claimed branches worth checking before filing
These sit outside the dense G02B/H04B core and carry fewer records in this dataset.
Thermal crosstalk mitigation structuresDetachable optical connector mechanicsReliability qualification test methodsExternal laser source couplingFaceplate density packaging schemes
Rank all filers by momentum →
Recent-year filing momentum
AssigneeRecent yearYoY
Nubis Communications, Inc.0-100%
Teramount Ltd.0-100%
Avicenatech Corp.0-100%
Huawei Technologies Co., Ltd.0—
Senko Advanced Components, Inc.0-100%
TSELIKOV ALEXANDER0-100%
PEZESHKI BARDIA0-100%
KALMAN ROBERT0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Co Packaged Optics and Optical IO covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this next

The landscape points to where claim space is dense and where it is not. The next step is checking a specific claim or a specific competitor's filings in detail.

Check freedom-to-operate on a specific design

Run a targeted search against the top-cited records and the leader's portfolio before committing engineering resources to an optical-engine architecture claim.

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Track the under-claimed branches

Thermal crosstalk and connector mechanics carry fewer records today; monitoring new filings there flags competitive moves earlier than waiting for the next landscape refresh.

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Watch the co-inventor clusters

The tightest co-assignee pairs point to specific technical teams worth tracking individually, since their filings tend to cluster around the same architecture problems.

Explore inventor networks in Patsnap Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Co Packaged Optics and Optical IO covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Co Packaged Optics and Optical IO covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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