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Run your analysis now →Filing growth compares 2021 (29 records) with 2024 (21) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 156 records in scope (CR5), not by the ranked leaders only.
Co packaged optics moves the optical engine off a pluggable module and onto or near the switch ASIC substrate, trading connector convenience for energy-per-bit and faceplate-density gains. The 156 records in this dataset span filings from 2015 through the mid-2026 cut-off, covering claims on detachable optical connectors, external laser sources, thermal crosstalk mitigation, and reliability qualification methods that sit alongside the core optical-engine architecture claims.
The picture that emerges is one of early concentration: a handful of assignees built out broad architecture claims while the field was still small, and later entrants have had to file around thermal, packaging, and interconnect details rather than core optical-engine designs.
Two views of the same 156 records: how filing activity has moved year over year, and which IPC subclasses carry the claim density.
Filings rose through the early 2020s to a peak of 49 records in 2023, then declined to 21 by 2024 -- a 28% drop from the 2021 level of 29. Because publication trails filing by roughly 18 months, the 2025 and 2026 figures are still incomplete and should not be read as a continued decline.
G02B (optical elements & systems) appears in 68.6% of the 156 records, and H04B (transmission) in 39.7%. Packaging-adjacent classes -- H05K at 21.8% and H01L at 10.3% -- carry far fewer records, which is where thermal and mechanical integration claims tend to sit.
Shares are the percentage of the 156 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about co packaged optics and optical io and every answer comes back with the patent numbers behind it.
Try EurekaA multi-chip package may include a system-on-chip (SoC) and an optical IO subassembly on a common substrate, linked by a die-to-die interface. The optical IO subassembly may include an optical IO IC with microLEDs and/or photodetectors bonded away from the substrate, with an optical window layer shielding the optical elements from molding-related damage during assembly.Filed by AVICENATECH, CORP. and published 2025-09-25 as US20250301845A1.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20220159860A1 | Data processing systems including optical communication modules | 113 |
| 2 | US20230018654A1 | Communication systems having pluggable modules | 57 |
| 3 | US20230043794A1 | Communication systems having optical power supplies | 56 |
| 4 | US20220263586A1 | Communication systems having optical power supplies | 50 |
| 5 | US20220264759A1 | Thermal design for rack mount systems including optical communication modules | 50 |
| 6 | US20220244465A1 | Data processing systems including optical communication modules | 50 |
| 7 | US20230077979A1 | Data processing systems including optical communication modules | 46 |
| 8 | US20230375793A1 | Communication systems having pluggable modules | 41 |
| 9 | US20210320718A1 | Optically-enhanced multichip packaging | 40 |
| 10 | US20230084003A1 | Optical Coupling | 37 |
Citation counts favour older, earlier-filed records inside this corpus -- read them as a signal of influence within the dataset, not as a marker of current technical relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three read-outs from the dataset that matter more than the raw counts.
With 123 of 156 records concentrated in five companies, core optical-engine and co-packaging architecture claims are dense prior art. New entrants are more likely to find open space in implementation detail -- thermal management, connector mechanics, qualification methods -- than in the base architecture.
Filings ran from 29 in 2021 to a peak of 49 in 2023, then eased to 21 by 2024. That is a real three-year decline, but with publication lagging filing by around 18 months, the true 2025-26 trajectory is not yet visible in this data.
G02B and H04B together anchor most of the field's claim language, while H05K, H01L, H04J and F21V each appear in a minority of records. That gap is where packaging-level and thermal-interface claims have more room to be written narrowly and still stand.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to co packaged optics and optical io, with the prior art for and against each one.
The ranking covers 30 companies across all 156 records -- a full field, not a top-50 cut. Five names hold the majority of the volume, with co-inventor clusters suggesting where the deepest technical teams sit.
The top-ranked assignee holds 59 of the 156 records, well ahead of fifth place at 12 -- a gap wide enough that competitive analysis of this field starts with understanding that one portfolio in detail.
Three co-inventor pairs each appear on six shared records, all drawn from the same small group of named inventors -- a signal of a concentrated technical team behind a meaningful share of the architecture-level claims.
Beyond the top five, filing counts drop quickly toward single digits. That tail includes component specialists in connectors and pluggable hardware alongside broader systems companies testing the space with a handful of filings each.
| Assignee | Recent year | YoY |
|---|---|---|
| Nubis Communications, Inc. | 0 | -100% |
| Teramount Ltd. | 0 | -100% |
| Avicenatech Corp. | 0 | -100% |
| Huawei Technologies Co., Ltd. | 0 | — |
| Senko Advanced Components, Inc. | 0 | -100% |
| TSELIKOV ALEXANDER | 0 | -100% |
| PEZESHKI BARDIA | 0 | -100% |
| KALMAN ROBERT | 0 | -100% |
The landscape points to where claim space is dense and where it is not. The next step is checking a specific claim or a specific competitor's filings in detail.
Run a targeted search against the top-cited records and the leader's portfolio before committing engineering resources to an optical-engine architecture claim.
Search this field in Patsnap EurekaThermal crosstalk and connector mechanics carry fewer records today; monitoring new filings there flags competitive moves earlier than waiting for the next landscape refresh.
Set up monitoring in Patsnap EurekaThe tightest co-assignee pairs point to specific technical teams worth tracking individually, since their filings tend to cluster around the same architecture problems.
Explore inventor networks in Patsnap EurekaOne assignee leads with 59 of the 156 records in this dataset, well ahead of the fifth-ranked company at 12. That gap means a competitive read of this field should start with a detailed review of the leader's portfolio rather than treating the field as evenly split. The ranking covers 30 companies in total, so filings tail off quickly after the top few names.
Filings rose to a peak of 49 records in 2023, then fell to 21 by 2024 -- a 28% decline from the 2021 level of 29. That is a genuine pull-back over that three-year span, but publication typically lags actual filing by around 18 months, so the 2025 and 2026 counts in this dataset are still incomplete and cannot yet be read as a continued slowdown.
G02B, covering optical elements and systems, appears in 68.6% of the 156 records, making it the single most common classification by a wide margin. H04B, general transmission, appears in 39.7%. Packaging and thermal-adjacent classes such as H05K and H01L are present in far fewer records, which is consistent with most claim activity still centring on the optical-engine architecture itself rather than its physical integration.
The classes with the fewest records relative to the core optical-elements category -- covering thermal crosstalk mitigation, detachable connector mechanics, reliability qualification methods, and external laser source coupling -- carry noticeably fewer filings than the dominant G02B and H04B classes. That does not guarantee an area is unclaimed, but it does mean the claim density is lower and narrower claims are more likely to clear existing prior art there.
Highly concentrated at the top: five assignees hold 78.8% of all 156 records in scope, and the top ten hold 91.7%. Below that, the ranking runs to 30 companies with counts dropping quickly toward single digits, so the field combines a small set of dominant portfolios with a long tail of smaller filers rather than a broad, even spread.
Go past this page: query the whole co packaged optics and optical io corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.
Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.
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