Conductive Fiber Modeling Patent Snapshot 2026
Conductive fiber modeling is a nascent, highly concentrated field dominated by Chinese academic institutions, with Zhejiang University and one industry entrant each holding the largest share of patent records. The field is still expanding on a multi-year basis following a 200% recent-window growth rate, though annual volume has eased from its 2023 peak and the most recent periods are further understated by publication lag.
Chinese universities lead a tightly held, early-stage field
Zhejiang University sits at the top of the applicant ranking, tied with Zhongke Junsheng (Shenzhen) Intelligent Data Technology Development Co., Ltd., each holding 2 patent records. The remaining applicants — including Shanghai Jiao Tong University, Fudan University, Hangzhou Dianzi University, and the sole non-Chinese entrant, Celanese Corp — each hold 1 patent record.
The top five filers account for 54% of the combined total among the ranked applicants visible in this query, indicating meaningful concentration at the top despite the field’s small absolute size. There is effectively no second tier: virtually all participants are at the single-record level, so the gap between the leader and the rest is defined by just one additional record.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Zhejiang University | 2 | |
| 2 | Zhongke Junsheng (Shenzhen) Intelligent Data Technology Development Co., Ltd. | 2 | |
| 3 | Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd. | 1 | |
| 4 | Shanghai Jiao Tong University | 1 | |
| 5 | Information Science Research Institute of CETC | 1 | |
| 6 | Fudan University | 1 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 7 | Integral Technology Inc. | 1 | |
| 8 | CHINA SHIP DEV & DESIGN CENT | 1 | |
| 9 | Hangzhou Dianzi University | 1 | |
| 10 | Shanghai Xinyuan Innovation Center | 1 | |
| 11 | Celanese Corporation | 1 |
The dominance of university and state-linked research organizations suggests that conductive fiber modeling remains primarily a research-driven domain. Commercial entrants such as Celanese Corp and Integral Technology Inc are present but have not yet established a volume position, leaving the assignee snapshot open to industrial players willing to convert research insights into filed IP.
Patent records filed in the most recent 18–24 months are systematically under-represented due to publication lag; apparent gaps in 2024 and 2026 should not be read as reduced activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Filing activity is expanding on a multi-year basis; digital modeling codes dominate the technology mix
The two charts below capture the pace of activity over time and the distribution of technical focus areas. Together they show a field that picked up momentum from 2021 onward and is anchored in computational simulation rather than physical fabrication.
Annual filing trend
Filings were negligible through 2020, then stepped up from 2021 onward, reaching a visible peak in 2023. The field is still expanding on a multi-year basis — recent-window growth is 200% above the prior window — though annual volume has eased from the 2023 peak. The zero counts for 2024 and 2026 reflect publication lag and should not be read as an activity drop.
↗ Hover for values · click a bar to ask EurekaTechnology composition
Electric digital data processing (G06F) is the visible branch, reflecting the computational simulation focus of most filings. Computational chemistry (G16C) and cables, conductors and insulators (H01B) each appear as secondary clusters. Textile-process branches — man-made filament spinning (D01D), chemical filament and fibre features (D01F), and yarn texturing and crimping (D02G) — are each represented by a single patent record, signaling that physical fiber fabrication modeling remains notably sparse relative to the digital-simulation core.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Conductive sheath/core heterofilament
Conductive thermoplastic sheath/core filaments having a reflectivity greater than 8 percent in the undelustered filament and fiber blends containing at least some of said conductive filaments. The sheath/core filament employs as a core a thermoplastic polymer having dispersed therein a material selected from the group consisting of zinc oxide, cuprous… (excerpt from the patent abstract)
Open this patent in Eureka →| # | Patent | Citations |
|---|---|---|
| 1 | Conductive sheath/core heterofilament | 19 |
| 2 | 以石墨烯为电极的阻变存储器紧凑模型的构建及仿真方法 | 5 |
| 3 | 选通器开关的仿真方法及系统 | 2 |
| 4 | 经时击穿SPICE电路模型及其构建、验证方法及应用 | 1 |
| 5 | 导电细丝及其制作工艺、电容毛笔及其制作工艺 | 1 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Zhejiang University
Zhejiang University holds 2 patent records — the highest count in the ranking — with a technology emphasis spanning electric digital data processing (G06F 30) and computational chemistry (G16C 60), indicating a simulation-first modeling approach. Momentum is flagged as a new entrant, meaning the position was built entirely within the recent filing window. Their co-filing relationship with China Ship Development and Design Center suggests applied defense-sector modeling as a near-term use case.
patent records: 2Zhongke Junsheng (Shenzhen)
Zhongke Junsheng (Shenzhen) Intelligent Data Technology Development Co., Ltd. also holds 2 patent records, matching the leader by count. Their technology focus, as reflected in the corpus, sits within the digital data processing and conductors branches, representing an industry-rooted position distinct from the predominantly academic field. Like Zhejiang University, they are a new entrant in the momentum data, indicating rapid recent entry rather than a legacy portfolio.
patent records: 2Frequently asked questions
The corpus covers 6 patent families in scope. The patent-record count across jurisdictions and IPC classes reaches 8 for China alone, with Canada and the United States each contributing 1 additional record.
Zhejiang University and Zhongke Junsheng (Shenzhen) Intelligent Data Technology Development Co., Ltd. are co-leaders, each holding 2 patent records — the highest count in the ranking.
The lifecycle is classified as Growth. Recent three-year filings are 200% above the prior three-year window, so the field is expanding on a multi-year basis. Annual volume has eased from its 2023 peak, and the most recent periods are further understated by publication lag, so apparent low counts in 2024 and beyond should not be read as a real decline.
Electric digital data processing (G06F) is the visible branch, appearing in 8 patent records. Computational chemistry (G16C) and cables, conductors and insulators (H01B) each appear in 3 records. Textile-process branches such as D01D, D01F, and D02G each hold only 1 record.
China is the visible filing jurisdiction with 8 patent records. Canada and the United States each have 1 record. No European or other major jurisdiction filings appear in the current evidence, indicating a significant geographic gap outside China.
Three co-applicant pairs are on record: Zhejiang University with China Ship Development and Design Center, Hangzhou Dianzi University with the Information Science Research Institute of CETC, and Fudan University with Shanghai Integrated Circuit Manufacturing Innovation Center. All are China-domestic university–industry pairings; no cross-border collaboration is in evidence.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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