Conductive Protective Textile Patent Snapshot 2026
The conductive protective textile space is a tightly concentrated, early-stage field dominated by Parker Hannifin Corp, which holds the largest position among a small set of active filers. Activity has grown substantially on a multi-year basis, though annual volume has eased from its 2017 peak and recent years remain understated by publication lag.
Parker Hannifin leads a concentrated but emerging field
Parker Hannifin Corp holds the top-ranked position among filers in this space, followed by Amogreentech Co Ltd and a cluster of mid-tier applicants including Teijin Ltd, American Cyanamid Co, and Parker Intangibles LLC.
The top five filers account for 53% of the ranked applicants visible in this query’ combined total, signaling high concentration at the apex of the ranking with a notable drop-off beyond the top two positions.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Parker Hannifin Corp | 11 | |
| 2 | Amogreentech Co., Ltd. | 7 | |
| 3 | Teijin Limited | 4 | |
| 4 | American Cyanamid Company | 4 | |
| 5 | Parker Intangibles LLC | 4 | |
| 6 | Integral Technology Inc. | 3 | |
| 7 | Nextiles Inc. | 2 | |
| 8 | MILLIKEN & CO | 2 | |
| 9 | Ventex Co., Ltd. | 2 | |
| 10 | Youngchang High Tech Materials | 1 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 11 | Li Guoping | 1 | |
| 12 | Cresin | 1 | |
| 13 | Winnova | 1 | |
| 14 | EI DU PONT DE NEMOURS & CO | 1 | |
| 15 | SWOTO PROTECTION & TECH CO LTD | 1 | |
| 16 | General Electric Company | 1 | |
| 17 | Tomoegawa Corporation | 1 | |
| 18 | Hangzhou Kelida Home Textile Co., Ltd. | 1 | |
| 19 | Intera Co., Ltd. | 1 | |
| 20 | NV Bekaert SA | 1 |
Parker Hannifin’s lead, reinforced by affiliate Parker Intangibles LLC, suggests a deliberate portfolio-building strategy around EMI-shielding and conductive assembly applications — a position that will be difficult for newer entrants to displace through incremental filings alone.
Patent families filed in the most recent 18–24 months are still moving through examination and publication pipelines, so current-year and prior-year counts understate true activity levels. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Multi-year growth with a shifting technology mix
The filing trend and IPC composition together reveal a field that has broadened beyond its EMI-shielding origins into garment-level and structural textile applications. Both charts should be read alongside the publication-lag caveat for recent periods.
Annual filing trend
A clear spike occurred in 2017, followed by a near-dormant period before a steady, if modest, resumption of filings from 2021 onward. The three-year recent window sits 400% above the prior three-year window on a multi-year basis, but annual volume has eased from the 2017 peak. Counts for 2024–2026 are likely understated due to publication lag.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H05K (printed circuits and assemblies) is the visible IPC class, reflecting the field’s origins in EMI shielding. H01B (cables, conductors and insulators) and A41D (outerwear and garments) are the next largest branches, showing that application scope now extends into wearable and garment contexts. Textile-specific classes — D03D, D04H, D01F, and D02G — collectively represent a meaningful secondary cluster.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Method of terminating an EMI shielding gasket
Method of terminating at least one end of an EMI shielding gasket having an indefinite length. A resilient core member of an indefinite length is sheathed within an electrically conductive fiber mesh member. A thermoplastic member is incorporated within the conductive fiber mesh member, and then is heated to effect its melting which, in turn, effects the… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | EMI shielding gasket having a conductive sheating … | 73 |
| 2 | Production of conductive fiber | 31 |
| 3 | Using laser etching to improve surface contact res… | 30 |
| 4 | Low cost electromagnetic energy absorbing, shrinka… | 26 |
| 5 | Prastic product with conductive fiber | 22 |
| 6 | EMI shielding gasket having a consolidated conduct… | 20 |
| 7 | Low cost electromagnetic energy absorbing, shrinka… | 17 |
| 8 | Using laser etching to improve surface contact res… | 16 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Parker Hannifin Corp
Parker Hannifin Corp holds 11 patent records — the largest position in the ranking — concentrated in H05K 9 (EMI shielding assemblies), H01B 1 (conductive cables and insulators), and B23K 26 (laser welding and brazing). Its affiliate Parker Intangibles LLC holds an additional 4 records, reinforcing the group’s visible coverage of shielding gasket and conductor technologies. No momentum data beyond its established lead is indicated for this entity.
records: 11Amogreentech Co Ltd
Amogreentech Co Ltd holds 7 patent records, focused on H05K 9 (printed circuit assemblies) and H05K 7, with a secondary position in D01D 5 (man-made filament spinning), suggesting an integration of fiber-level and assembly-level shielding approaches. As a South Korea-based challenger, Amogreentech is well-placed in the leading filing jurisdiction. Nextiles Inc is the only applicant with a recorded momentum signal, flagged as a new entrant with 2 recent records in garment and diagnostic applications.
records: 7Frequently asked questions
The corpus covers 14 patent families in scope. This is a small but growing field, and recent-year family counts are understated due to publication lag.
Parker Hannifin Corp holds the largest position with 11 patent records, concentrated in EMI-shielding assemblies, conductive cables and insulators, and laser-processing technologies. Its affiliate Parker Intangibles LLC holds an additional 4 records.
South Korea leads with 13 patent records, followed by Japan with 10. China, Europe (EPO), and the United States each show 6 records, with WIPO PCT filings indicating multi-market protection intent from select applicants.
H05K (printed circuits and assemblies) is the largest IPC class, reflecting origins in EMI shielding. H01B (cables, conductors and insulators) and A41D (outerwear and garments) are the next largest, showing that application scope now extends into wearable and garment contexts.
The field is classified as Growth: the recent three-year filing window sits 400% above the prior three-year window. However, annual volume has eased from its 2017 peak, and the most recent filing years are further understated by publication lag, so the true growth rate is likely higher than raw counts suggest.
Nextiles Inc is flagged as a new entrant, with 2 recent patent records focused on outerwear and diagnostic applications (A41D and A61B). Its garment-and-biosensing angle is technically distinct from the incumbent EMI-shielding leaders, making it a differentiated actor to watch.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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