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Run your analysis now →https://www.patsnap.com/resources/blog/rd-blog/conductive-shielding-films-and-gaskets-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Shielding & Absorbing MaterialsConductive Shielding Films and Gaskets Patents: Who Leads and Where the Filing Concentrates
- 31.5% sits with five firms. The top five assignees combined account for 391 of 1,241 records in scope, while the ranked field runs 100 companies deep with a long single-filing tail.
- H05K dominates claim scope. 63.3% of records touch printed circuits & assemblies (H05K), far ahead of gasket-specific F16J at 11.8% and connector-class H01R at 9.9%.
- Filing has cooled, not collapsed. Annual filings ran 44 in 2021 down to 39 in 2024, an 11% pullback over three years, with the peak year still 2020 at 56.
1,241
Published Records
32%
Top-5 Share of All Records
-11%
Filing Growth 2021→2024
US
Leading Jurisdiction
Filing growth compares 2021 (44 records) with 2024 (39) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,241 records in scope (CR5), not by the ranked leaders only.
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview
What this landscape covers
Conductive shielding films and gaskets sit at the intersection of electromagnetic compatibility engineering and materials science: thin conductive layers, elastomer gaskets and composite films designed to block or absorb electromagnetic interference while sealing an enclosure. The search set spans records filed and published between 2015 and mid-2026 that combine shielding hardware terms (shielding gasket, conductive elastomer, shielding film) with performance or qualification language such as shielding effectiveness, compression force deflection and environmental sealing.
That combination narrows the corpus to records where a shielding structure is claimed alongside a measurable performance or reliability criterion, rather than incidental mentions of EMI shielding in a broader electronics filing. The result is 1,241 records in scope, ranked across 100 assignees, with United States, EPO and China the three largest receiving offices.
Filing activity and technology mix, 2015-2026
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Conductive Shielding Films and Gaskets covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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The data
Filing trend and technology composition
Two views of the same 1,241 records: how filing activity has moved year over year, and which IPC subclasses carry the claim language.
Filing trend, 2017-2026
Filings climbed from 33 in 2017 to a peak of 56 in 2020, then eased to 44 in 2021 and 39 in 2024, an 11% decline over that span. 2025 and 2026 counts are still incomplete because publication typically lags filing by around 18 months, so the most recent two years understate actual activity rather than signal a further drop.
Technology composition by IPC subclass
H05K (printed circuits & assemblies) appears on 63.3% of the 1,241 records, making it the dominant class by a wide margin. F16J (seals & gaskets) and H01R (connectors) each sit near 10%, with polymer-composition classes C08K and C08L close behind — evidence that most claims are written around the electronics assembly context rather than the gasket or elastomer alone. Because records can carry multiple classes, these shares sum to well over 100%.
Shares are the percentage of the 1,241 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Conductive Shielding Films and Gaskets covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.
Go deeper on Conductive Shielding Films and Gaskets with Eureka
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Representative and most-cited filings
Representative filing
US20150030878A1 — Ultrathin shielding film of high shielding effectiveness and manufacturing method thereof
GUANGZHOU FANG BANG ELECTRONICS CO., LTD.
The application covers an ultrathin shielding film built from two or more solid shielding layers, with a conductive adhesive layer on one face and insulation film layers plus a carrier film on the other, protected by a removable film over the adhesive. A manufacturing method for the layered structure is also disclosed.Filed by Guangzhou Fang Bang Electronics, dated 2015-01-29 — one of the earliest records in scope defining a multilayer thin-film shielding architecture rather than a bulk gasket.
Most-cited records in this landscape
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US4857668A | Multi-function gasket | 322 |
| 2 | US6483719B1 | Conforming shielded form for electronic component assemblies | 240 |
| 3 | US20040020674A1 | Composite EMI shield | 225 |
| 4 | US5351176A | Panel for a computer including a hinged door with integral display | 225 |
| 5 | US20100321758A1 | Vehicular Rearview Mirror Elements and Assemblies Incorporating These Elements | 217 |
| 6 | US6713672B1 | Compliant shaped EMI shield | 208 |
| 7 | US5045635A | Conductive gasket with flame and abrasion resistant conductive coating | 194 |
| 8 | US20130292808A1 | Semiconductor package integrated with conformal shield and antenna | 187 |
| 9 | US7019391B2 | NANO IC packaging | 186 |
| 10 | US8169684B2 | Vehicular rearview mirror elements and assemblies incorporating these elements | 178 |
Citation counts reflect influence within this searched corpus and skew toward older filings; treat them as a signal of historical importance rather than current relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Conductive Shielding Films and Gaskets covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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What the numbers say
Reading the concentration, trend and citation data together points to where claim space is crowded and where it is still open.
Concentration
31.5% / 5 firms
of 1,241 records
Filing is concentrated but not locked up
The top five assignees combined hold 391 of 1,241 records (31.5%), and the top ten hold 526 (42.4%). That leaves well over half the corpus spread across a long tail of single- and low-filing entrants, including the 90 assignees below tenth place.
Ranking covers 100 assignees total
Technology mix
63.3% H05K
of records
Claims cluster around the assembly, not the material
Two-thirds of records touch H05K (printed circuits & assemblies), while gasket-specific F16J sits at just 11.8%. That gap suggests most applicants are protecting the shielding structure as installed in an electronic assembly rather than the elastomer or film composition standing alone.
IPC subclass shares, record-level
Momentum
-11% 2021→2024
filings
Activity has eased from its 2020 peak
Filings peaked at 56 in 2020, then settled to 44 in 2021 and 39 in 2024 — an 11% pullback over that three-year window. The leading assignees show flat or negative year-over-year filing counts in the latest tracked year, consistent with a maturing rather than expanding filing wave.
2025-2026 figures still incomplete due to publication lag
Collaboration
10 pairs
co-assignee links
Co-filing is rare and mostly inventor-linked
Only 10 co-assignee pairs appear across the corpus. The strongest is an individual inventor pairing filing 15 times together, alongside one Chinese corporate pairing at 14 joint filings — evidence that most shielding IP here is developed and held by single entities rather than through joint ventures.
Strongest pair: 15 joint filings
Eureka AI Agent
Looking for what nobody has claimed yet?
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to conductive shielding films and gaskets, with the prior art for and against each one.
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Conductive Shielding Films and Gaskets covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players
Who is filing, and what is still open
The ranked leaders account for less than a third of the field individually, and recent-year momentum has cooled even among the largest filers.
Leader
157 records
single largest assignee
One filer leads by a wide margin
The top-ranked assignee holds 157 records, well ahead of fifth place at 42 and tenth place at 18. That gap between first and fifth signals a genuine leader rather than a tightly bunched top group.
Leader vs. fifth place: 157 vs. 42
Momentum
0 in latest year
several top filers
Recent-year activity has gone quiet at the top
Several of the historically largest assignees show zero filings in the latest tracked year, and one major Chinese filer shows an 80% year-over-year drop. That does not necessarily mean exit from the space — publication lag means the most recent year is always undercounted — but it does mark a visible pause among established players.
Latest-year filing counts by assignee
Geography
423 US filings
largest receiving office
Filing is US and Europe-weighted, with China rising
The United States receives the largest share of filings at 423, ahead of the EPO at 192 and China at 174. WIPO/PCT filings at 118 indicate a meaningful share of applicants are seeking multi-jurisdiction protection rather than filing nationally only.
US 423 · EPO 192 · China 174 · PCT 118
Recent-year filing momentum by assignee
| Assignee | Recent year | YoY |
|---|---|---|
| Guangzhou Fang Bang Electronics Co., Ltd. | 1 | -80% |
| Parker Hannifin Corp | 0 | — |
| Laird Technologies Inc | 0 | — |
| PRC DeSoto International Inc | 0 | — |
| 3M Innovative Properties Co | 0 | — |
| BlackBerry Limited | 0 | — |
| BALSELLS PETER J | 0 | — |
| Oerlikon Metco (Canada) Inc | 0 | — |
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Conductive Shielding Films and Gaskets covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next
Where to take this
The dataset points to specific next steps depending on whether the goal is freedom-to-operate, competitive tracking or identifying open claim space.
Map claims against the H05K cluster
With 63.3% of records touching printed circuits & assemblies, a freedom-to-operate check should start there before assuming a gasket-only search clears the field.
Explore the technology mapTrack the leader's recent filings
The top assignee's 157-record position and its recent slowdown are both worth monitoring for signs of a strategy shift or a shift to trade secret.
Set up assignee trackingTest the under-claimed branches
Galvanic compatibility and low compression-set formulations show thinner filing density than the core assembly claims — worth a closer prior-art pass before drafting.
Run a white space searchSource: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Conductive Shielding Films and Gaskets covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ
Common questions
Filing is concentrated at the top of a 100-company ranked field: the leading assignee holds 157 records, and the top five combined account for 391 of 1,241 records in scope, or 31.5%. Beyond the top ten, which together hold 42.4% of records, the field spreads into a long tail of companies with far fewer filings each. This pattern is typical of a mature component category — a handful of established suppliers with deep portfolios, and many smaller or newer entrants filing narrowly around specific applications.
Filings peaked at 56 in 2020 and have since eased to 39 in 2024, an 11% decline over that three-year window, so growth has slowed rather than accelerated recently. The 2025-2026 figures in any dataset will look lower still, but that reflects publication lag of roughly 18 months rather than an actual drop in filing activity. Judged on the last complete year, 2024, activity remains substantial even if below the 2020 peak.
Most records combine electromagnetic shielding claims with a materials or assembly context: 63.3% of the 1,241 records touch H05K (printed circuits & assemblies), while gasket-specific claims under F16J appear in 11.8%. Connector and cable-related classes (H01R, H01B) each sit near 9.9%, and polymer additive and composition classes (C08K, C08L) appear in roughly 8% of records. The pattern indicates that most applicants are protecting shielding as integrated into an electronic assembly rather than as a standalone elastomer or film material.
Relative to the dominant H05K assembly claims, sub-areas like galvanic compatibility coatings, low compression-set gasket formulations and ultrathin multilayer film adhesion show thinner filing density in this dataset. That does not guarantee those areas are unclaimed, but it does mean the claim space is less crowded than the core assembly-integration filings. A prior-art search focused specifically on those terms, rather than the broader shielding-gasket space, is the practical way to confirm before drafting.
Citation counts in this corpus favour older filings simply because they have had more time to accumulate citations, so the most-cited records skew toward patents from earlier in the coverage window. They are a reasonable signal of historical influence on later filings, but a poor proxy for which technology is most commercially relevant today. For current relevance, filing trend and recent-year assignee activity are more useful than raw citation counts.
Answers are grounded in the same dataset. Derived from a Patsnap search on Conductive Shielding Films and Gaskets covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.