DED Dissimilar-Metal Interface Patent Snapshot 2026
The patent corpus for directed energy deposition (DED) at dissimilar-metal interfaces is nascent, comprising 9 patent families, all filed in India and all held by Indian academic institutions. Activity is concentrated in the 2025–2026 window, signalling very early-stage formalisation of research output rather than an established competitive field.
Nine families, all academic, all Indian — a field at its very earliest stage
Every one of the 9 patent families in scope is held by an Indian academic institution, with Delhi Technological University, NIT Calicut, PDPM IIITDM, Asansol Engineering College, Easwari Engineering College, Swami Vivekananda University, IIT (ISM) Dhanbad, Chennai Institute of Technology, and SRM Institute of Science and Technology each holding one family.
The top five filers account for 56% of the combined total among the ranked applicants visible in this query — a high share that reflects the field’s extreme smallness rather than deliberate strategic concentration by any commercial player.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Delhi Technological University | 1 | |
| 2 | National Institute of Technology Calicut | 1 | |
| 3 | PDPM INDIAN INST OF INFORMATION TECH DESIGN & MFG … | 1 | |
| 4 | Asansol Engineering College | 1 | |
| 5 | Easwari Engineering College | 1 | |
| 6 | Swami Vivekananda University | 1 | |
| 7 | Indian Institute of Technology (Indian School of Mines) Dhanbad | 1 | |
| 8 | Chennai Institute of Technology | 1 | |
| 9 | SRM INST OF SCI & TECH (RAMAPURAM CAMPUS) | 1 |
The absence of industrial or multinational assignees suggests that DED dissimilar-metal interface innovation has not yet attracted corporate patent activity; the evidence snapshot is effectively an academic pre-competitive research zone, presenting both an open entry path and a signal that commercial development remains early.
Filings from 2025 and 2026 are subject to publication lag and likely undercount activity in those years; the true recent volume may be higher than the indexed figures reflect. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
All filing activity concentrated in 2025–2026; welding-process classes dominate the technology mix
The annual trend and IPC composition together describe a field that produced no indexed output before 2025 and whose technology framing is anchored firmly in welding and brazing process science, with additive manufacturing and powder metallurgy classes appearing as secondary branches.
Annual filing trend
Zero filings appear for 2017 through 2024; 5 families are indexed in 2025 and 4 in 2026. Because both years sit within the publication-lag window, these counts should be treated as floor estimates. The step-change from zero to non-zero output marks the emergence of formal patenting in this niche.
↗ Hover for values · click a bar to ask EurekaTechnology composition
B23K (welding, soldering, and brazing) covers all 9 families, confirming that process-level joining science is the primary framing. B22F (powder metallurgy) and B33Y (additive manufacturing) each appear in 3 families, reflecting the DED process context. B23P, C22C, and G01N each appear in only 1 family, identifying the thinnest technical branches in the corpus.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Intelligent wire arc additive manufacturing system…
An intelligent wire arc additive manufacturing system (100) with adaptive energy input and in-situ diagnostics is described herein for scalable fabrication and repair of metallic components via layer by layer deposition. The system (100) includes: an arc-based deposition unit (10) operating at 80-350 A current and 15-35 V voltage for stable molten pool… (excerpt from the patent abstract)
Open this patent in Eureka →Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Delhi Technological University
Delhi Technological University holds 1 patent family, classified across B22F 10 (powder metallurgy processing), B23K 103 (welding material classification), and B23K 20 (pressure welding), indicating a focus on solid-state and powder-based dissimilar-metal joining. Applicant momentum data is not available; the filing is part of the 2025–2026 emergence cluster.
Families: 1National Institute of Technology Calicut
NIT Calicut holds 1 patent family spanning B23K 9 (arc welding), B33Y 10 (additive manufacturing processes), and B33Y 30 (additive manufacturing apparatus), making it one of the few applicants that explicitly bridges DED process equipment with welding science. Applicant momentum data is not available.
Families: 1Frequently asked questions
The current corpus contains 9 patent families. All were filed in India, and all are held by Indian academic institutions, making this one of the smallest and most geographically concentrated niches in advanced manufacturing patenting.
Every applicant in the ranking holds exactly 1 patent family. Delhi Technological University appears first in the ranking but is tied with all other eight applicants. There is no visible leader by count.
No families are indexed for 2017 through 2024. The first recorded filings appear in 2025 (5 families) and 2026 (4 families). Both years fall within the publication-lag window, so actual activity may be modestly higher.
Not in the current corpus. All 9 applicants are Indian universities or engineering colleges. No private companies, multinationals, or government research laboratories appear as assignees, indicating that commercial patenting has not yet begun in this specific niche.
B23K (welding, soldering, and brazing) covers all 9 families. B22F (powder metallurgy) and B33Y (additive manufacturing) each appear in 3 families. B23P, C22C, and G01N are the thinnest branches, each appearing in only 1 family.
Based on the current corpus, no patent protection has been sought outside India. There are no PCT, EPO, USPTO, or other foreign counterpart filings in scope. Organisations operating in other jurisdictions should still conduct their own freedom-to-operate analysis, as broader DED or welding patents held by industrial players in other corpora may be relevant.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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