Deep UV LED Packaging Patents: Leaders, Trends & White Space 2026
A patent landscape review of deep UV LED packaging: filing trends since 2017, the leading assignees, technology composition across IPC classes, and where claim space remains open.
Filing growth = 2021 (6 records) → 2024 (1); 2024 is the last year we treat as complete.
What this landscape covers
Deep UV LED packaging sits at the intersection of semiconductor device engineering and materials science: getting a UVC die to survive its own light output without degrading the encapsulant, submount, or hermetic seal around it. This landscape tracks 42 published records filed between 2015 and 2026 that combine deep UV LED terminology with packaging, encapsulation, submount or hermetic-sealing language, restricted to semiconductor and electronics IPC classes. Publication lags filing by roughly 18 months, so the 2025-2026 counts in any trend chart are still filling in and should not be read as a slowdown.
The scope is deliberately narrow: it is not general LED packaging, and not deep UV emission technology broadly, but the specific overlap where packaging materials and methods are claimed against UVC or deep UV LED devices.
Filing trends and technology composition
Two views of the same 42-record set: how filing activity has moved year over year, and how those records distribute across IPC subclasses.
A short, sharp filing wave
Filings rose from 5 in 2017 to a peak of 10 in 2020, then declined; the -83% move from 6 filings in 2021 to 1 in 2024 is the clearest complete-year signal in the dataset. Years after 2024 are still incomplete due to publication lag and should not be read against this decline.
Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.
Concentrated in semiconductor devices, with application spillover
All 42 records classify under H01L (semiconductor devices), which is the anchor class for this search. Smaller but notable shares sit in C02F (water treatment, 14.3%), A61L (sterilising, 7.1%) and B01J (catalysis, 7.1%) — evidence that UVC packaging claims are increasingly written alongside disinfection and water-treatment end uses rather than as standalone device claims.
Shares are the percentage of the 42 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
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Try EurekaRepresentative filing and most-cited records
CN108257928A — a hinged, hermetically-sealed transparent enclosure for deep UV LED
The filing describes a packaging structure built around a transparent base and a transparent surrounding dam, joined to a hinged transparent upper cover fitted with a sealing gasket and mating latches. The LED substrate sits above the base with a locking rod-and-block mechanism running through the base, allowing the substrate to be released and re-secured without breaking the enclosure apart.Filed 2018-07-06. The mechanism targets a specific practical problem: fixed LED substrates in conventional deep UV packages are difficult to open for testing or rework.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | CN110197865A | 一种液体封装的深紫外LED封装器件及其制备方法 | 17 |
| 2 | JP2018125368A | Ultraviolet emitting device and ultraviolet irradiating device | 16 |
| 3 | JP2017147432A | Ultraviolet light emitting device and ultraviolet light irradiation device | 16 |
| 4 | CN111640845A | 深紫外LED光源及其封装方法 | 9 |
| 5 | CN114695622A | 一种深紫外LED封装结构及其封装方法 | 8 |
| 6 | TW202032811A | Deep ultraviolet led device and manufacturing method therefor | 6 |
| 7 | JP2017103351A | Ultraviolet light emitting device and ultraviolet light irradiating device | 6 |
| 8 | JP2020107778A | Deep ultraviolet LED device and manufacturing method thereof | 5 |
| 9 | CN112086550A | 一种带内腔的LED封装用石英聚焦透镜 | 4 |
| 10 | CN111640846A | 深紫外LED封装及灯具 | 4 |
Citation counts favour older records in any searched corpus; treat them as a signal of influence within this dataset, not of current technical importance.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for a filing decision
Three findings a claims strategist would want before deciding where to file next in deep UV LED packaging.
The claim-staking rush has cooled
Filings dropped from 6 in 2021 to 1 in 2024, the last year with complete publication coverage. Combined with a 2020 peak of 10, the pattern reads as an early land-grab phase that has largely run its course for this specific claim combination — packaging language layered onto deep UV LED devices.
No single company controls the field
The ranking covers 35 companies, and the leader holds 6 filings with fifth place already down to 5 and tenth place at 2. That is a shallow gradient, not a fortress — useful context before assuming any one assignee's claims block a given approach.
China is the primary filing venue by volume
Of the receiving offices tracked, China accounts for 22 filings against 7 in Japan, 6 in the United States, 3 in Taiwan, and 2 each in Europe and via WIPO. A strategy built only around US or EPO prior art will miss most of this landscape.
Packaging claims are drifting toward end-use
Beyond the universal H01L anchor, 14.3% of the 42 records also carry a water-treatment classification (C02F) and 7.1% a sterilising classification (A61L). That suggests packaging innovation here is increasingly written for a specific downstream use — disinfection or water treatment — rather than as a general-purpose device claim.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to deep uv led packaging patent landscape, with the prior art for and against each one.
Where to take this analysis
The dataset points to a field with shallow assignee concentration and a cooling filing rate — which changes how a freedom-to-operate or whitespace search should be scoped from here.
Map the application-specific overlaps
The C02F and A61L overlaps suggest packaging claims written for disinfection or water treatment use cases may carry different prior art than pure device packaging. Worth a separate pull before filing.
Explore adjacent claim space →Watch co-assignee clusters, not just solo leaders
Several of the strongest co-assignee pairs in this dataset link a research institute with materials and equipment suppliers, a pattern worth tracking for licensing or partnership signals.
Review assignee relationships →Common questions about deep UV LED packaging patents
The dataset shows filings rising from 5 in 2017 to a peak of 10 in 2020, then falling sharply, with a documented -83% move from 6 filings in 2021 to 1 in 2024. This pattern is typical of a narrow claim combination going through an early land-grab phase: once the obvious packaging-plus-deep-UV-LED combinations are claimed, filing volume naturally thins. It does not mean the underlying technology has stalled, only that this specific intersection of packaging and deep UV LED terms has fewer new combinations left to claim under current classification. Readers should also note that 2025 and later years are still filling in due to publication lag, so the true 2025-2026 picture is not yet visible.
The ranking covers 35 companies, and the leading assignee holds 6 filings, with fifth place at 5 and tenth place down to 2. That is a shallow gradient rather than one company holding a dominant share, so freedom-to-operate work in this space needs to look across a longer list of assignees rather than assuming one or two players control the field. Cross-referencing the co-assignee pairs in the dataset is also useful, since several filings involve joint research-institute-and-supplier arrangements rather than single-owner claims.
China is by far the largest receiving office in this dataset with 22 filings, ahead of Japan at 7, the United States at 6, Taiwan at 3, and Europe and WIPO at 2 each. This means most of the recent prior art in this specific claim combination is written in Chinese-language filings, and a search or clearance exercise limited to US and EPO databases will miss the majority of the documented activity. It also suggests that manufacturing and supply-chain activity for deep UV LED packaging is concentrated in the same region as the filing volume.
Every record in this dataset classifies under H01L, the semiconductor devices class, since that is the anchor for the search. Beyond that, 14.3% of the 42 records also carry a water-treatment classification (C02F) and 7.1% a sterilising and disinfecting classification (A61L), with smaller overlaps in catalysis, nanotechnology, adhesives and optical elements. This tells a filer that packaging claims in this space are frequently written alongside a specific end application — disinfection or water treatment — rather than as standalone, application-agnostic device packaging.
Based on complete-year data, filing activity has cooled from a 2020 peak of 10 down to 1 filing in 2024, a documented -83% decline from 2021's 6 filings. That said, 2025 and 2026 counts are understated because publication typically lags filing by around 18 months, so it would be premature to call the technology closed. The more accurate read is that the initial wave of broad packaging-plus-deep-UV-LED claims has thinned, while more specific combinations — particularly around application-specific end uses — may still be open.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.