Die-to-Die Interface Patents: Who Leads, Where Filings Cooled 2026
- Filings peaked in 2022 at 1,022 and have since declined, with the most recent full year sitting well below that mark — a maturing filing cycle rather than a growing one.
- The ranked leaders hold only 8.4% of all 114,847 records between the top five, so no single assignee controls the field; claim space is fragmented across a long tail.
- Momentum among the largest filers is falling sharply year-on-year, with drops of 79% to 97% among the most active named assignees in the latest year alone.
Filing growth compares 2021 (925 records) with 2024 (719) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 114,847 records in scope (CR5), not by the ranked leaders only.
What the die-to-die interface energy efficiency filing record shows
Die-to-die interface energy efficiency covers the circuits, protocols and packaging choices that let separate silicon dies exchange data without the power cost of a traditional monolithic bus — clock forwarding schemes, lane repair logic, and the packaging techniques that keep signal reach short. The dataset behind this page spans 114,847 published records filed between 2015 and mid-2026, drawn from a search string built around die and chiplet interconnect PHY terms combined with energy, latency-budget and protocol-overhead qualifiers.
Because publication typically lags filing by around eighteen months, the most recent year in any trend line understates real filing activity — 2026's count is a partial year, not a collapse. Read the trend as a multi-year arc rather than a single data point.
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Filing trend and technology composition
Two views of the same 114,847-record dataset: how filing activity has moved year over year, and which IPC subclasses carry the claim density.
A filing cycle that peaked in 2022
Annual filings rose from 700 in 2017 to a peak of 1,022 in 2022, then declined toward 46 in the most recent, still-partial year. The midpoint sits at the 2022 peak, meaning the second half of the window shows flat-to-declining activity rather than continued growth — a signal that the core interconnect approaches have largely been staked out.
Semiconductor devices dominate, but the tail is wide
H01L (semiconductor devices) leads at 5.6% of the 114,847 records in scope, with H10W following at 2.5%. Because a single record can carry several IPC classes, these shares add up to more than 100% and should be read as relative claim density across subclasses, not as a partition of the dataset. Notably, packaging and mechanical classes — B29C, B21D, B22D — each carry more filing weight than G11C, pointing to how much of this field's patent activity sits in physical assembly rather than pure logic design.
Shares are the percentage of the 114,847 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Die-to-Die Interface Energy Efficiency with Eureka
This page is one run against one query. Ask Eureka your own question about die-to-die interface energy efficiency and every answer comes back with the patent numbers behind it.
Try EurekaA recent claim worth reading in full
Configurable die-to-die lane repair in multi-die systems coupled using link macros
Systems and methods for configurable die-to-die lane repair in multi-die systems are described. A multi-die system includes a first die and a second die, each comprising modular D2D link macros with M data lanes. The method forms repair groups spanning D data lanes, fewer than or equal to M, associated with one or more link macros, with D independently configurable per repair group, and designates R redundant lanes per repair group, R being independently configurable.Filed by Microsoft Technology Licensing, LLC — abstract trimmed for length.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6271469B1 | Direct build-up layer on an encapsulated die package | 918 |
| 2 | US20060022214A1 | LED package methods and systems | 853 |
| 3 | US20110219208A1 | Multi-petascale highly efficient parallel supercomputer | 826 |
| 4 | US20110027458A1 | Continuous analyte sensors and methods of making same | 647 |
| 5 | US20110024043A1 | Continuous analyte sensors and methods of making same | 633 |
| 6 | US20110027453A1 | Continuous analyte sensors and methods of making same | 629 |
| 7 | US6405733B1 | Device for accurately marking tissue | 609 |
| 8 | US6155699A | Efficient phosphor-conversion led structure | 577 |
| 9 | US6908784B1 | Method for fabricating encapsulated semiconductor components | 427 |
| 10 | US5374245A | Reinforced multiple-lumen catheter and apparatus and method for making the same | 425 |
Citation counts favour older filings simply because they have had more time to accumulate citations within this corpus — treat them as a signal of influence on the field, not of current technical importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Three figures matter more than the headline record count: how thin the leadership concentration actually is, how fast the largest filers are pulling back, and where the packaging-heavy IPC mix points next.
No single assignee controls the space
The top five ranked assignees combined account for 8.4% of all 114,847 records in scope, and the top ten only reach 11.2%. For a field with this much filing volume, that is a thin concentration — most of the claim space sits with entities outside the ranked leaders.
The largest filers are pulling back sharply
Every one of the most active assignees tracked for recent-year momentum shows a steep year-on-year decline, with drops as large as 97%. Combined with the 2022 peak in the overall trend, this suggests the core technical approaches in this generation of die-to-die interfaces have already been claimed by their originators.
Packaging classes carry real weight
H01L leads IPC composition, but B29C, B21D and B22D — plastics shaping, sheet-metal working and metal casting — each out-rank G11C memory classifications. That points to how much of the patented value in this space sits in the physical packaging and assembly of dies, not only in logic or protocol design.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to die-to-die interface energy efficiency, with the prior art for and against each one.
Who is filing, and where the field is still open
The ranked leaders are large semiconductor and systems companies, but their combined share of the dataset is small, and momentum data shows even the most active among them slowing sharply in the latest year.
A clear leader, but not a dominant one
The leading assignee holds 3,740 records against a fifth-place figure of 852 and a tenth-place figure of 522 — a steep drop-off after the leader, then a long, gradually declining tail across the remaining ranked companies.
Collaboration is limited and concentrated
Only ten co-assignee pairs appear in the dataset, and the strongest of them links two related entities under a shared corporate umbrella. Cross-company collaboration on filings is the exception here, not the norm.
Filing activity is US-centric with a European and PCT tail
The United States receives more than three times the filings of the next-largest office, Europe (EPO) at 3,118, with WIPO's PCT route, the United Kingdom, Canada and Australia trailing behind. Strategy built around US prosecution alone would miss a meaningful share of the activity captured through PCT and EPO routes.
| Assignee | Recent year | YoY |
|---|---|---|
| Intel Corporation | 9 | -79% |
| Micron Technology, Inc. | 5 | -91% |
| Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) | 4 | -91% |
| Texas Instruments Incorporated | 1 | -86% |
| Samsung Electronics Co., Ltd. | 1 | -97% |
| Hewlett Packard Development Company, LP | 0 | — |
| LG Energy Solution, Ltd. | 0 | -100% |
| Qualcomm Incorporated | 0 | -100% |
Where to take this next
The dataset points to a field with declining top-line filing activity but thin leadership concentration — which changes how a freedom-to-operate or whitespace exercise should be scoped.
Check packaging classes, not just logic
Given how much filing weight sits in B29C, B21D and B22D, a search limited to G06F and G11C will miss a large share of relevant prior art in physical die assembly and packaging.
Explore packaging-class filings in EurekaRead the momentum data before assuming a leader is still active
The steep year-on-year declines among the most active assignees suggest some of the largest historical filers may be de-prioritising this exact claim space — worth confirming before treating them as blocking competitors.
Track assignee momentum in EurekaCommon questions about die-to-die interface energy efficiency patents
The dataset behind this page contains 114,847 published records filed between 2015 and mid-2026 that match a search built around die and chiplet interconnect PHY terms combined with energy, latency-budget and protocol-overhead qualifiers. This is a records count, not a granted-patent count, and it includes applications at various stages of prosecution. Because publication lags filing by roughly eighteen months, the most recent year is a partial figure and will rise as later filings publish.
The assignee ranking covers 100 companies, with the leader holding 3,740 records, fifth place at 852, and tenth place at 522 — a sharp drop after the leader followed by a long, gradually thinning tail. Even so, the top five combined account for only 8.4% of all 114,847 records in scope, so no single company controls this claim space. Recent-year momentum data also shows the largest filers pulling back sharply, with year-on-year declines in the range of 79% to 97% among the most active named assignees.
Filing activity peaked in 2022 at 1,022 records after rising from 700 in 2017, and has declined since, dropping toward 46 in the most recent, still-partial year. Read that decline cautiously: publication lag means the last one to two years will always look lower than they eventually turn out to be. Still, the flat-to-declining pattern from the 2022 midpoint onward, combined with falling momentum among top filers, points to a technology area where core approaches have largely been staked out.
IPC composition shows the field's claim density concentrated in H01L (semiconductor devices) at 5.6% of the 114,847 records in scope and H10W at 2.5%, with packaging-related classes like B29C, B21D and B22D also carrying meaningful weight. Areas like static memory interconnect coupling (G11C, at just 0.6%) and protocol-layer overhead reduction show comparatively thin density relative to those core classes. That pattern suggests an opening for claims that combine energy-efficiency mechanisms with less-crowded packaging or protocol-layer approaches rather than competing directly in the densest semiconductor-device classes.
A representative 2026 filing from Microsoft Technology Licensing describes configurable die-to-die lane repair in multi-die systems, where dies with modular link macros form repair groups of independently configurable size and designate a configurable number of redundant lanes per group. The claim structure is built around flexibility — independent configuration of group size and redundant-lane count — rather than a single fixed repair scheme. Anyone designing lane-repair logic for multi-die interconnects should read the granted claims closely to see how narrowly or broadly that configurability language is drawn, since it will determine how much of the surrounding design space remains open.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.