Die to Wafer Bonding Patents: Who Leads, Where the Gaps Are 2026
Die to Wafer Bonding and Collective Processing Patents
47.2% of all 460 records sit with just five assignees, so the claim space at the top is already dense before you count the long tail of 67 ranked companies. Annual publications ran from 18 in 2017 to a peak of 44 in 2023. The 2021-to-2024 span, the last stretch unaffected by publication lag, rose 3% (30 to 31) — read as steady, not slowing. Years from 2025 onward will fill in as later publications catch up.
- 1CUFER ASSET LTD LLC98
- 2MONOLITHIC 3D INC37
- 3TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD29
- 4WUHAN XINXIN SEMICON MFG CO LTD28
- 5CUBIC WAFER25
See the full die to wafer bonding and collective processing analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on this landscape
Who holds the most patents in die to wafer bonding and collective processing?
One assignee leads with 98 of the 460 records in scope, well ahead of the fifth-ranked holder at 25. The top five assignees combined hold 217 records, or 47.2% of the field, and the top ten hold 328, or 71.3%. Beyond the top ten the ranking spreads across a long tail drawn from a 67-company list, many holding only a handful of filings each, so most competitive activity outside the leaders is fragmented rather than concentrated in a second tier.
Is patent filing in this field slowing down?
Not on the evidence available. The last fully comparable window, 2021 to 2024, shows filings rising 3%, from 30 to 31, after a 2023 peak of 44. Filings recorded for 2025 and 2026 look lower, but publication typically lags actual filing by around 18 months, so those years are still filling in rather than showing a genuine drop. Treat any year-over-year comparison that includes 2025 or 2026 with caution.
What does EP3029725A1 actually claim, and does it block new bonding-chuck designs?
EP3029725A1, filed by IMEC VZW, claims a chuck for collectively bonding semiconductor dies to a target wafer, where carbon nanotube films are grown on die placement sites and sit in etched recesses of varying depth to compensate for height differences between dies. It is specific to CNT-based compensation structures on the chuck surface, not to collective bonding chucks generally. A design using a different compensation mechanism, such as compliant polymer layers or mechanical shims, would sit outside this particular claim scope, though it should still be checked against the wider set of chuck and carrier patents in the dataset.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Die to Wafer Bonding and Collective Processing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.