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Directed Energy Deposition (DED) Patent Landscape 2026

Directed Energy Deposition (DED) Patent Landscape 2026
Competitive Landscape
Directed Energy Deposition (DED) Patent Landscape in 2026

The DED patent space has reached a maturing phase, with annual filings plateaued near their 2023 peak and a moderately concentrated field led by Norsk Titanium AS. The United States dominates jurisdictional coverage, and the technology mix is anchored by additive manufacturing, welding, and powder metallurgy — with several challenger entrants emerging in recent years.

205
Patent families in scope
25%
Top-5 share of top-100 filers
+23%
3-yr filing growth (lag-adj.)
United States
Leading jurisdiction
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Published byPatSnap Insights Team··7 min readVerified by PatSnap Eureka data
Overview

Norsk Titanium leads a moderately concentrated field of aerospace and industrial players

Norsk Titanium AS holds the top position with 19 patent families, followed by Relativity Space Inc (15) and Owens Corning Intellectual Capital LLC (9). The top five filers collectively account for 25% of the combined total among the hundred largest filers, indicating a moderately concentrated but not monopolized competitive landscape.

A meaningful tier gap separates the top two from the rest: Norsk Titanium and Relativity Space each hold notably more patent families than any filer ranked third or below. From rank three onward, portfolios cluster tightly between 6 and 9 patent families, suggesting a broad second tier with no dominant challenger yet.

Leading applicants
#ApplicantPatent familiesShare
1Norsk Titanium AS19
2Relativity Space Inc15
3Owens Corning Intellectual Capital LLC9
4Siemens AG8
5Rolls-Royce Corp7
6Linde AG7
7RTX Corp6
8Directed Metal 3D SL6
9Rosemount Aerospace Inc6
10DMG Mori Co Ltd6
#ApplicantPatent familiesShare
11Fluid Handling LLC6
12Siemens Energy Inc6
13Divergent Technologies Inc5
14GE Avio SRL5
15BAE Systems PLC5
16Nanjing Enigma Industrial Automation Technology Co Ltd4
17The Boeing Company4
18Illinois Tool Works Inc3
19Ebara Corporation3
20Hankaisi Intelligent Technology Co Ltd (Guizhou)3
↗ Hover a row · click a company to ask Eureka

Norsk Titanium’s position, built largely on wire-arc and laser deposition for titanium structures, reflects a focused strategy in aerospace-grade DED. Relativity Space’s rapid accumulation — characterized as a new entrant — points to aggressive early-stage coverage aimed at space-launch component manufacturing. This divergence between established process specialists and new application-driven entrants defines the competitive dynamic.

Filings from 2025 and 2026 are subject to publication lag and are likely under-counted; apparent softness in those years should not be interpreted as a real decline in activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope.Explore deeper in Eureka →
Trends & Structure

Filing volume peaked in 2023; additive manufacturing, welding, and powder metallurgy dominate the technology mix

Two complementary views frame the field’s evolution: the annual filing trend reveals a multi-year growth arc that has plateaued near its 2023 peak, while the IPC branch breakdown shows how tightly the portfolio clusters around a core trio of process classes.

Annual filing trend

Filings grew from 7 in 2017 to a peak of 36 in 2023, reflecting strong expansion across the prior decade. The subsequent figures for 2024 (29) and 2025–2026 are partially affected by publication lag and should be read as provisional rather than indicative of a sustained decline.

Annual filing trendAnnual values from 2017 to 2026, peaking at 36 in 2023.7201714201816201922202033202122202236202329202421202552026↗ Hover for values · click a bar to ask Eureka

Technology composition

B33Y (additive manufacturing, 160 records), B23K (welding and brazing, 144 records), and B22F (powder metallurgy, 139 records) together account for the overwhelming majority of coverage, confirming that DED IP is process-centric. Adjacent classes — including C22C (alloys), B29C (plastics shaping), B23P (general metal working), and F01D (turbines) — hold materially smaller counts, marking the outer edges of the current innovation frontier.

Technology compositionB33Y · Additive manufacturing (3D printing) leads with 160; B23K · Welding, soldering & brazing 144.B33Y · Additive manufact…160B23K · Welding, solderin…144B22F · Powder metallurgy139C22C · Alloys26B29C · Shaping of plastics22B23P · Metal working (ge…21F01D · Turbines & non-po…15C03B · Glass manufacture…7↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US11890696B2Published 2024-02-06

Laser metal deposition with inoculation

Siemens Aktiengesellschaft

Systems and methods for additively manufacturing or repairing a component from a base material. The system may include an inoculation source to direct inoculation materials and a laser metal deposition (LMD) system to direct laser energy during laser processing of additive materials deposited in a melt pool on the base material. The LMD system includes a… (excerpt from the patent abstract)

Laser metal deposition with inoculation — patent drawingLaser metal deposition with inoculation — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1一种提高激光增材制造薄壁件成形质量的方法及装置37
2Composite member and method for manufacturing comp…35
3Systems and methods for global thermal control of …28
4Wire arc additive manufacturing method for high-st…21
5DED arc three-dimensional alloy metal powder print…20
6一种采用等离子热源进行双金属电弧增材制造的方法15
7Additive-manufacturing head, manufacturing machine…15
8Method for preparing multiple-material variable-ri…14

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the competitive structure means for R&D investment

The combination of a maturing filing curve, a two-tier applicant structure, limited formal collaboration, and US-dominant jurisdiction points to both consolidation pressures and selective entry opportunities for well-positioned new filers.

Maturity

Field is at the boundary of growth and maturity

Annual filings plateaued near their 2023 peak of 36 patent families, placing the field in a mature growth phase. The multi-year window still shows a 23% recent growth figure, but annual volume has eased from that peak. New entrants must offer clear process differentiation or application specificity to carve out defensible positions against established portfolios.

Lifecycle: Maturing
Concentration

Two-tier structure with a tight cluster in the mid-ranks

The top five filers hold 25% of the combined total among the hundred largest filers, with Norsk Titanium and Relativity Space clearly separated from the pack. Mid-tier filers — including Siemens AG (8), Rolls Royce Corp (7), and Linde AG (7) — are closely bunched, suggesting competitive pressure for rank differentiation. Portfolio consolidation or targeted filing in adjacent branches could shift the tier structure.

Concentration: Moderate
Collaboration

No co-applicant activity detected in the evidence

The collaboration data returned no co-filing relationships within this corpus. This absence suggests that DED innovation is currently developed in-house or through supplier relationships that do not produce joint patent filings. The lack of consortium-driven IP may indicate licensing rather than co-development as the preferred technology transfer mechanism, or simply that collaboration occurs at earlier TRL stages not yet captured in filings.

Collaboration: Isolated
Geography

US leads decisively; Europe and WIPO are secondary targets

The United States accounts for 82 patent records, well ahead of Europe via the EPO (46) and WIPO PCT filings (26). India (19) ranks fourth — notably ahead of China (14) — reflecting active filing by both domestic institutions and multinationals seeking Indian manufacturing coverage. Japan (4) and South Korea (2) trail significantly, an observation worth monitoring given both countries’ established metal additive manufacturing industries.

Geography: US-centric
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Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: PatSnap Eureka. Jurisdiction counts are at the patent-record level; a single family may be counted in multiple offices.Explore insights →
Leaders

Norsk Titanium anchors the field; Relativity Space and Owens Corning emerge as fast-moving challengers

The top two filers represent contrasting trajectories: an established process leader showing recent deceleration and a new entrant with rapid portfolio accumulation. Below them, a cluster of aerospace, energy, and industrial-gas firms competes for the mid-tier.

Leader · Norsk Titanium AS

Norsk Titanium AS

Norsk Titanium AS holds 19 patent families, concentrated in laser and arc welding processes (B23K26, B23K37, B23K9), consistent with its proprietary Rapid Plasma Deposition wire-arc technology for aerospace titanium structures. Momentum has declined sharply (trend: ▼ –81% recent vs. prior period), suggesting the core platform has matured and new filing activity has slowed — a signal that the existing portfolio may be near its filing ceiling without a next-generation process pivot.

families: 19
Challenger · Relativity Space Inc

Relativity Space Inc

Relativity Space Inc has built 15 patent families as a new entrant, with filings spanning powder metallurgy (B22F10), arc welding (B23K9), and additive manufacturing process control (B33Y10). Its recent activity count of 13 families in the most recent window confirms that virtually its entire portfolio was assembled rapidly, pointing to an aggressive IP coverage strategy aimed at protecting its large-format DED rocket manufacturing platform from early-stage replication.

families: 15
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Owens Corning Intellectual Capital LLCSiemens AG+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
Norsk Titanium AS3▼ -81%
Relativity Space Inc13▲ new entrant
Owens Corning Intellectual Capital LLC8▲ new entrant
Linde AG6▲ new entrant
RTX Corp4▲ new entrant
Directed Metal 3D SL6▲ new entrant
Source: PatSnap Eureka. Applicant rankings and momentum are measured at the patent-family level.Explore players →
Adjacent Branches

Under-served adjacent branches worth watching in DED

Several IPC classes sit at the periphery of the dominant DED core — sparse relative to B33Y, B23K, and B22F — and carry plausible technical relevance for next-generation DED applications. These are observations of relative sparsity, not validated commercial opportunities.

F01D · Turbines & non-positive engines

With only 15 patent records, turbine-component DED represents a modest fraction of the corpus despite being one of the most commercially cited applications for the technology. High-temperature superalloy repair, blade tip restoration, and near-net-shape vane fabrication are technically within DED’s scope. The relatively small count — compared to the dominant process classes — suggests either that turbine OEMs are relying on process patents already captured in B23K/B22F or that specific component geometry claims remain underfiled. Players with existing gas-turbine relationships, such as Rolls Royce Corp or Siemens Energy, could extend coverage here.

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G05B · Control & regulating systems

Only 6 patent records fall under G05B (control and regulating systems), despite closed-loop process control being widely cited as the key technical barrier to DED quality assurance and certification. In-situ monitoring, adaptive layer correction, and feedback-driven parameter adjustment are active research areas that have not yet generated a proportionate IP footprint. This sparsity, combined with the evident focus on manufacturing process claims, suggests an entry path for control-system specialists or AI-integration teams targeting real-time DED process supervision — particularly relevant given the 4 records in G06N (AI-based computing).

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Unlock the full white-space map
See all adjacent IPC branches ranked by sparsity, technical adjacency, and filer coverage gaps.
C03B · Glass manufacture & shapingC23C · Coating & surface deposition+ more
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Source: PatSnap Eureka. Branch counts are at the patent-record level; sparsity is relative to the dominant IPC classes in this corpus.Explore emerging →
Route Matrix

How leading applicants differ by technology route

Route coverage across the main technology branches in the current evidence set.

PlayerB33Y 10 · Additive manufacturing (3D printing)B22F 10 · Powder metallurgyB33Y 30 · Additive manufacturing (3D printing)B23K 26 · Welding, soldering & brazingB23K 9 · Welding, soldering & brazing
Norsk Titanium ASStrong · 12Strong · 11Strong · 12Strong · 15Strong · 12
Owens Corning Intellectual Capital LLCStrong · 7Strong · 9AbsentStrong · 6Strong · 7
Relativity Space IncStrong · 8Strong · 9AbsentAbsentStrong · 9
Directed Metal 3D SLStrong · 6Strong · 6Strong · 6Strong · 6Absent
Siemens Energy IncStrong · 7AbsentStrong · 5Strong · 7Absent
DMG Mori Co LtdStrong · 6AbsentStrong · 5Strong · 6Absent
Rosemount Aerospace IncStrong · 5AbsentStrong · 5Strong · 5Absent
Source: PatSnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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