Book a demo

GaN HEMT Trapping Patents: Who Leads, Where the Gaps Are 2026

GaN HEMT Trapping Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/dynamic-on-resistance-and-trapping-in-gan-hemts-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Discrete & Analog Devices
Dynamic On-Resistance and Trapping in GaN HEMTs: A Patent Landscape
  • No single filer dominates. the leader holds 93 records and the top 5 combined account for only 5.1% of the 7,463 records in scope.
  • Filing kept climbing through the last complete year, up 24% from 388 records in 2021 to 481 in 2024, before publication lag thins out 2025-2026.
  • China dominates the filing venues, with 3,646 receiving-office filings against 1,367 in the United States and 757 at the EPO.
Get a prior-art report on your approach
7,463
Published Records
5%
Top-5 Share of All Records
+24%
Filing Growth 2021→2024
CN
Leading Jurisdiction

Filing growth compares 2021 (388 records) with 2024 (481) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 7,463 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This landscape tracks patent activity around dynamic on-resistance and charge trapping in GaN HEMTs — the recovery-time-constant measurements, surface-passivation schemes, virtual-gate modelling and qualification-test methods that separate a device datasheet number from what actually happens under hard switching. The search spans both trapping-specific claim language and the broader measurement-method and buffer-trapping vocabulary that surrounds it, which is why the IPC composition below pulls in metrology and data-processing classes as heavily as device physics.

7,463 records sit in scope from 2015 through the 2026-07-31 cut-off. Because publication trails filing by roughly 18 months, the 2025 and 2026 counts in the trend chart understate real activity and should be read as provisional, not as a slowdown.

Filing activity and technology composition
  1. 1DOLBY LABORATORIES LICENSING CORP93
  2. 2DOLBY INTERNATIONAL AB78
  3. 3ZHEJIANG UNIV76
  4. 4XI AN JIAOTONG UNIV70
  5. 5CANON KK65
  6. 6BEIHANG UNIV63
  7. 7TORAY INDUSTRIES INC52
  8. 8STATE GRID CORPORATION OF CHINA49
  9. 9TOYOBO CO LTD48
  10. 10NORTH CHINA ELECTRIC POWER UNIV48
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Dynamic On-Resistance and Trapping in GaN HEMTs covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Let an AI agent run this analysis on your own technology

Pick a task. Every answer cites the patents behind it.

10,000 free credits to start
The Data

Filing trends and technology composition

Family counts, filing-year trend and IPC composition for the 7,463 records in scope, drawn directly from the underlying dataset.

Filing trend, 2017-2026

Annual filings rose from 416 in 2017 to a peak of 890 in 2025, with the 2021-2024 span alone up 24% (388 to 481). The 2026 figure of 152 reflects a partial year plus publication lag, not a drop in activity.

Filing trend, 2017-202602505007501,0004162017201820192020202120222023202489020251522026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

Material analysis and testing (G01N, 14.8%) and dimensional measurement (G01B, 13.4%) lead the composition, ahead of digital data processing (G06F, 10.1%) and electric/magnetic measurement (G01R, 8.5%) — a profile that reflects how much of this field is characterisation and test methodology rather than device structure claims alone.

IPC subclass compositionG01N · Material analysis & testing1,10314.8%G01B · Measuring length & dimensions99813.4%G06F · Electric digital data processi…75710.1%G01R · Electric & magnetic measurement6348.5%G01M · Testing machine & structure ba…4656.2%G06T · Image data processing & genera…4395.9%A61B · Diagnosis & surgery3795.1%G01C · Distance, navigation & gyrosco…3644.9%Other6,55187.8%

Shares are the percentage of the 7,463 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Dynamic On-Resistance and Trapping in GaN HEMTs covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Dynamic On-Resistance and Trapping in GaN HEMTs with Eureka

This page is one run against one query. Ask Eureka your own question about dynamic on-resistance and trapping in gan hemts and every answer comes back with the patent numbers behind it.

Try Eureka
Key Patents

Most-cited records and a representative filing

Representative Filing
US20230375455A12023-11-23

US20230375455A1 — Dynamic light scattering measurement method and dynamic light scattering measurement device

FUJIFILM CORPORATION

Provided are a dynamic light scattering measurement method and a dynamic light scattering measurement device with which a particle size distribution of each type of particle included in a dispersion liquid including particles is obtained. A dynamic light scattering measurement method for a dispersion liquid including a plurality of types of particles includes a measurement step of measuring a scattering intensity of the dispersion liquid a plurality of times to obtain a plurality of pieces of scattering intensity data while changing a value of any one of at least a scattering angle or a measurement wavelength among measurement parameters, a calculation step of calculating a plurality of piecFiled by Fujifilm Corporation, published 2023-11-23. Abstract truncated as supplied in the source record.

US20230375455A1 — patent drawing 1US20230375455A1 — patent drawing 2
View full record
Highest-cited records in the corpus
#Publication no.Patent titleCitations
1US7621893B2Methods and apparatuses for detecting occlusions in an ambulatory infusion pump649
2US20040207836A1High dynamic range optical inspection system and method621
3US20020188723A1Dynamic frequency selection scheme for IEEE 802.11 WLANs614
4US6677258B2Breathable composite sheet structure and absorbent articles utilizing same589
5US20060020177A1Apparatus and method for measuring quantity of physical exercise using acceleration sensor526
6US20100191391A1multiobject fusion module for collision preparation system501
7US5170374ASemiconductor memory333
8US20060184154A1Methods and apparatuses for detecting occlusions in an ambulatory infusion pump320
9US20110025629A1Dynamic Mode Switching for Fast Touch Response317
10US6605172B1Method of making a breathable and liquid impermeable web285

Citation counts favour older filings simply because they have had longer to accumulate them; treat this table as a signal of influence within the searched corpus, not a ranking of current technical importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Dynamic On-Resistance and Trapping in GaN HEMTs covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Run it yourself

Put your own technology through the same analysis

 
Where to run it
Fastest

Eureka on the web

When you want the answer in the next five minutes.

The agent works the prompt against patents and technical literature, citing every source.

Run your analysis now →
For builders

MCP server & REST API

When it has to run inside your own pipeline.

Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.

Browse MCP servers →
Insights

What the numbers say

Three patterns stand out once the filing trend, assignee concentration and technology composition are read together.

Concentration
5.1%
of 7,463 records held by top 5

No single assignee controls the field

The leader holds 93 records out of 7,463 in scope, and the top 5 combined reach only 5.1% of all records. Tenth place still holds 48. This is a fragmented field with a long tail of single- and few-filing entrants rather than one built around a handful of blocking portfolios.

Assignee ranking, 100 companies
Momentum
+24%
growth 2021 → 2024

Filing kept rising through the last complete year

Records grew from 388 in 2021 to 481 in 2024, a 24% increase over that span, with 2025 posting the highest raw count so far at 890. Because publication lags filing by about 18 months, the apparent tail-off in 2026 is an artefact of the data cut-off, not evidence that filing activity is cooling.

Filing-year trend, 2017-2026
Geography
3,646
China receiving-office filings

China is the dominant filing venue by a wide margin

China's receiving office recorded 3,646 filings against 1,367 in the United States, 757 at the EPO, 401 in Japan and 325 via WIPO/PCT. Any freedom-to-operate check on this technology needs a China-first search strategy, not a US-centric one.

Receiving-office counts
Composition
14.8%
of records in G01N

Measurement and test methodology outweigh device-structure claims

G01N (material analysis and testing) and G01B (dimensional measurement) together cover more of the corpus than any device-physics class, with G06F and G01R close behind. That mix says the claim activity is concentrated on how trapping and dynamic Ron are measured and qualified, not solely on how the device itself is built.

IPC subclass shares, record-level, sums exceed 100%
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to dynamic on-resistance and trapping in gan hemts, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Dynamic On-Resistance and Trapping in GaN HEMTs covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and how it clusters

The ranking covers 100 companies returned by the data endpoint, not a curated top tier. Reading it alongside the co-assignee pairs and recent-year momentum shows where activity is institutional versus academic, and where it is already cooling.

Leader
93
records

A modest lead, not a dominant one

The top-ranked assignee holds 93 records against a fifth-place figure of 65 and a tenth-place figure of 48 — a gentle slope rather than a cliff. That shape typically means licensing leverage is limited to specific claim families rather than the field as a whole.

Assignee ranking
Collaboration
66
co-filed records, strongest pair

Cross-entity filing is concentrated in a few pairs

Of 10 identified co-assignee pairs, one licensing-affiliate pair co-files far more heavily than the rest (66 records), while grid-research pairings in China co-file in the single digits. Co-assignee structures here look more like corporate affiliate filing than open industry consortia.

Co-assignee pairs, n=10
Momentum
-75% to -91%
YoY, leading academic filers

Recent-year academic filing is pulling back sharply

University assignees that were active in prior years show steep year-on-year declines in the latest year — several down 75% or more. Combined with the publication-lag effect, this looks more like a reporting gap than a genuine retreat from the technology, but it is worth revisiting once later filing years fully publish.

Recent-year momentum by assignee
🔍
Under-claimed sub-areas worth checking before filing
These branches sit adjacent to the dense measurement-and-passivation core but carry noticeably lower filing density in this corpus.
virtual-gate compensation circuitsbuffer-trap qualification protocolsin-situ recovery-time-constant sensorshard-switching loss attribution methods
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Xi'an Jiaotong University2-75%
Beihang University2-80%
Southeast University2-75%
Dolby Laboratories Licensing Corporation1-50%
Dolby International AB1-67%
Zhejiang University1-91%
Canon Inc.0
Toray Industries, Inc.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Dynamic On-Resistance and Trapping in GaN HEMTs covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this from here

The dataset points to a few concrete next steps depending on whether the goal is freedom-to-operate, licensing or R&D scoping.

Check China-first freedom-to-operate

With 3,646 of 7,463 records filed through China's receiving office, any clearance search that starts and ends with US and EPO filings will miss most of the field.

Run a freedom-to-operate search in Eureka →

Watch the fragmented leaderboard for consolidation

A top 5 holding only 5.1% of records can shift quickly if one filer accelerates. Track the ranked leaders' quarterly filing rate rather than relying on a static snapshot.

Set up assignee monitoring in Eureka →

Scope claims around the under-claimed branches

Virtual-gate compensation and in-situ recovery-time sensing show thinner filing density than core measurement-method claims, which may leave room for a first-mover claim.

Explore white space in Eureka →
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Dynamic On-Resistance and Trapping in GaN HEMTs covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Dynamic On-Resistance and Trapping in GaN HEMTs covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Research Dynamic On-Resistance and Trapping in GaN HEMTs in depth with Eureka

Go past this page: query the whole dynamic on-resistance and trapping in gan hemts corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.

Try Eureka

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

Help us improve this page

Found incorrect or outdated information? Let us know and we'll get it fixed.