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E-Beam Inspection Patents: Who Leads, Where the Gaps Are 2026

E-Beam Inspection Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/e-beam-inspection-and-review-equipment-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Semiconductor Equipment
E-Beam Inspection and Review Equipment Patents: Filing Trends and Who Holds the Claims
  • Concentrated at the top. The five leading assignees hold 31 of 39 records in scope (79.5%), and the ranked ten hold 97.4% — there is almost no long tail left to file into unclaimed ground.
  • Filing has cooled since 2018. The trend peaked at 7 records in 2018 and sits flat-to-declining since, with the 2022 midpoint at zero — a sign the core claim space filled early.
  • Electron optics dominates the classification mix. H01J (electron and discharge tubes) appears on 71.8% of the 39 records, well ahead of material analysis (G01N, 41.0%) and semiconductor devices (H01L, 28.2%).
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39
Published Records
79%
Top-5 Share of All Records
-67%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the e-beam inspection patent record shows

E-beam inspection and review equipment sits at the intersection of electron optics, defect detection and semiconductor process control. Patents in this space cover the physical column and beam-forming hardware as well as the algorithms and test structures used to find buried defects, resolve voltage contrast, and manage throughput and charging artifacts on shrinking process nodes. The 39 records in scope span 2015 through the current data cut-off, filed mainly through the United States receiving office, with smaller volumes routed through Israel, the EPO, Taiwan, Singapore and the PCT.

Filing activity peaked in 2018 and has not returned to that level since; the most recent years should be read with the usual publication lag in mind, since filings from the last 18 months are still working through to grant. The assignee ranking is short and top-heavy, and the IPC composition points to a field still anchored in electron-tube and beam-column engineering rather than downstream data or metrology software.

Filing activity, 2015-2026
  1. 1ASML NETHERLANDS BV18
  2. 2KLA TENCOR TECHNOLOGY CORP5
  3. 3PDF SOLUTIONS INC3
  4. 4HUAWEI TECH CO LTD3
  5. 5GLOBALFOUNDRIES SINGAPORE PTE LTD2
  6. 6MACRONIX INTERNATIONAL CO LTD2
  7. 7TEXAS INSTRUMENTS INC2
  8. 8INTERNATIONAL BUSINESS MACHINE CORPORATION1
  9. 9CHARTERED SEMICON MFG LTD1
  10. 10ALES TECH INC1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on E-Beam Inspection and Review Equipment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 39 records: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.

A peak in 2018, then a flat-to-declining line

Filings rose to 7 in 2018, the high point of the series, then fell back; the 2022 midpoint reads zero and the most recent year is still partial, so treat the tail of the chart as understated rather than as evidence of a stalled field.

A peak in 2018, then a flat-to-declining line024680201772018201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Electron optics still leads the classification mix

H01J covers 71.8% of the 39 records, more than G01N (41.0%) and H01L (28.2%) combined against the record total — a reminder that the beam-forming hardware, not the downstream defect-analysis software, still carries most of the claim volume in this dataset.

Electron optics still leads the classification mixH01J · Electron & discharge tubes2871.8%G01N · Material analysis & testing1641.0%H01L · Semiconductor devices1128.2%G01R · Electric & magnetic measurement923.1%G01Q · Scanning-probe & nanometric me…512.8%G21K · Particle & radiation handling25.1%H10P25.1%H10W25.1%Other37.7%

Shares are the percentage of the 39 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on E-Beam Inspection and Review Equipment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited records in this dataset

Representative filing
US9793090B22017-10-17

E-beam inspection apparatus and method of using the same on various integrated circuit chips

PDF SOLUTIONS, INC.

The present invention discloses an e-beam inspection tool, and an apparatus for detecting defects. In one aspect is described an apparatus for detecting defects that includes a focusing column that accelerates the e-beam and separately, for each of the plurality of predetermined locations, focuses the e-beam to a predetermined non-circular spot that is within the predetermined surface area of each of the plurality of predetermined locations based upon the major axis.Filed by PDF Solutions, Inc., published 2017-10-17 as US9793090B2.

US9793090B2 — patent drawing 1US9793090B2 — patent drawing 2
View full patent record
Highest-cited e-beam inspection patents
#Publication no.Patent titleCitations
1US20090057664A1E-beam inspection structure for leakage analysis107
2US9496119B1E-beam inspection apparatus and method of using the same on various integrated circuit chips77
3US8748814B1Structure for inspecting defects in word line array fabricated by SADP process and method thereof64
4US6797955B1Filtered e-beam inspection and review21
5US6979824B1Filtered e-beam inspection and review14
6US6885000B1Method and apparatus to correct for stage motion in E-beam inspection12
7US6812461B1Photocathode source for e-beam inspection or review12
8US6858843B1Immersion objective lens for e-beam inspection8
9US20040086172A1Alignment mark for e-beam inspection of a semiconductor wafer6
10WO2019042905A1Electron beam inspection tool5

Citation counts are drawn from a searched corpus and skew toward older filings; read them as a signal of influence on later work, not as a ranking of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on E-Beam Inspection and Review Equipment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for filing strategy

Reading the ranking, the trend and the IPC mix together points to a field where the column-hardware claims are largely staked out and the open ground sits elsewhere.

Concentration
79.5%
of 39 records held by top 5

Five assignees hold most of the field

The leading assignee alone accounts for 18 of the 39 records in scope. With the top five combined at 79.5% and the top ten at 97.4%, new entrants are filing into a space where the dominant claim positions are already held by a small group.

Assignee ranking, 11 companies
Momentum
2018 peak, 7 filings
highest single-year count

Filing has not recovered since 2018

Volume climbed to 7 records in 2018, the high point of the series, then fell back toward flat with the 2022 midpoint reading zero. That pattern is consistent with a technology whose core hardware claims filled early rather than one still in an active build-out phase.

Filing trend, 2015-2026
Classification mix
71.8%
of 39 records in H01J

Electron-tube claims still dominate

H01J appears on 71.8% of the 39 records, ahead of G01N material analysis at 41.0% and H01L semiconductor devices at 28.2%. Smaller subclasses such as G01Q scanning-probe measurement (12.8%) and G21K particle handling (5.1%) show where claim density thins out.

IPC composition, 8 subclasses
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Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to e-beam inspection and review equipment, with the prior art for and against each one.

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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on E-Beam Inspection and Review Equipment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claims, and where the gate sits

The ranked assignees include equipment makers, foundries and fabless design houses, reflecting that e-beam inspection claims are filed both by the tool vendors and by the chipmakers instrumenting their own process control.

Leader
18 records
of 39 in scope

One assignee holds nearly half the dataset

The top-ranked assignee accounts for 18 of the 39 records, roughly twice the combined count of the next four leaders. That single-firm weight is unusual for a hardware category this narrow and suggests a long-running, deliberately built portfolio rather than opportunistic filing.

Assignee ranking
Mid-tier
2 records
fifth-place assignee

A tight cluster below the leader

Fifth place sits at just 2 records, meaning the gap between the leader and the rest of the field is steep rather than gradual. Firms entering now are competing for space among assignees who each hold only a handful of filings.

Assignee ranking, positions 2-5
Tail
1 record
tenth-place assignee

Little room left in the ranked list

The tenth-ranked assignee holds a single record, and the ranked ten together already cover 97.4% of all 39 records in scope. Very little of the documented activity sits outside this group of eleven companies.

Assignee ranking, position 10
🔍
Where the claim space is thinner
IPC subclasses with the lowest record share point to areas with room to file, not to areas without merit.
Scanning-probe defect correlation (G01Q)Particle/radiation beam handling (G21K)Voltage-contrast charging-artifact mitigationBuried-defect throughput algorithmsNon-circular spot focusing geometries
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
ASML Netherlands B.V.0
Chartered Semiconductor Manufacturing Ltd.0
KLA-Tencor Technology Corp.0
Huawei Technologies Co., Ltd.0
PDF Solutions, Inc.0
GlobalFoundries Singapore Pte. Ltd.0
Macronix International Co., Ltd.0
Texas Instruments Inc.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on E-Beam Inspection and Review Equipment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to a mature, concentrated core and a thinner set of adjacent branches. The next step is deciding which of those branches is worth a first claim.

Map the white space in G01Q and G21K

Scanning-probe correlation and particle-handling claims sit well below the H01J core; a focused search of those subclasses can confirm whether a first-filer position is still open.

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Track the leading assignee's recent filings

With one assignee holding 18 of 39 records, understanding its most recent priority claims is the fastest way to see where the dominant portfolio is still being extended.

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Watch for a filing rebound

Volume has been flat since the 2018 peak, but the most recent years are understated by publication lag. A rebound would show up first in provisional and PCT filings.

Set up trend alerts in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on E-Beam Inspection and Review Equipment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about e-beam inspection patents

Answers are grounded in the same dataset. Derived from a Patsnap search on E-Beam Inspection and Review Equipment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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