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EDA & Chip Design Patents: Who Leads, Where the Gaps Are 2026

EDA & Chip Design Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/eda-and-chip-design-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Semiconductors & Microelectronics
EDA and Chip Design Patents: Filing Trends and the Assignees Holding the Ground
  • 45.4% of everything filed sits with just five assignees out of the 18,397 records in scope, so the core claim territory is already crowded before you look at anyone else.
  • Filing volume grew 10% from 768 records in 2021 to 846 in 2024 — the last year the dataset treats as complete, since publication lags filing by about 18 months.
  • G06F dominates at 70.2% of records, while narrower classes like G01R and H10W each sit near 4.6%, marking the areas still open for a first mover.
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18.4K
Published Records
45%
Top-5 Share of All Records
+10%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (768 records) with 2024 (846) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 18,397 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the EDA and chip design patent record actually shows

Electronic design automation and chip design patenting spans the software that synthesizes logic, checks timing and verifies layout, and the physical transistor structures those tools describe. The search string behind this dataset pairs design-automation terms — logic synthesis, timing analysis, design rule check, layout verification — with the underlying hardware they act on, which is why the technology composition leans so heavily toward G06F data processing classes even in a semiconductor-adjacent field.

18,397 records published between 2015 and the 2026 data cut give a workable picture of where claim density sits and where it doesn't. Family-level counting in the assignee ranking neutralises continuation filings and multi-jurisdiction duplicates, so the concentration figures below reflect distinct inventions rather than paperwork volume.

Filing activity and technology composition, 2015-2026
  1. 1INTERNATIONAL BUSINESS MACHINE CORPORATION3,502
  2. 2TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD1,306
  3. 3SYNOPSYS INC1,238
  4. 4GLOBALFOUNDRIES INC1,195
  5. 5ARM LTD1,120
  6. 6GLOBALFOUNDRIES US INC928
  7. 7CADENCE DESIGN SYST INC852
  8. 8ALTERA CORP665
  9. 9INTEL CORP528
  10. 10SIEMENS INDUSTRY SOFTWARE INC359
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on EDA & Chip Design Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 18,397 records: how filing activity has moved year over year, and which IPC subclasses carry the claim volume today.

Filing trend, 2017-2026

Recorded filings ran from 758 in 2017 to a peak of 855 in 2023. The 2021-to-2024 span shows +10% growth (768 to 846) — the clearest complete-year read available, since 2025 and 2026 are still filling in under publication lag and should not be read as a slowdown.

Filing trend, 2017-202602505007501,000758201720182019202020212022855202320242025872026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass distribution

G06F carries 70.2% of records, consistent with the search string's emphasis on automation logic; H01L and H10D (24.6% and 9.5%) cover the semiconductor-device side. Smaller subclasses — G01R, H10W, H03K, G11C and H10P, each in the 3.7%-4.6% range — mark narrower, less contested claim territory. Shares add to more than 100% because a single record can carry several IPC classes.

IPC subclass distributionG06F · Electric digital data processi…12,90670.2%H01L · Semiconductor devices4,51824.6%H10D · Semiconductor devices (general)1,7409.5%G01R · Electric & magnetic measurement8454.6%H10W8454.6%H03K · Pulse technique & logic circui…7824.3%G11C · Static & digital memories7544.1%H10P6823.7%Other5,24628.5%

Shares are the percentage of the 18,397 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on EDA & Chip Design Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative filing and the most-cited prior art

Representative Record
US5727187A1998-03-10

US5727187A — Method of using logical names in post-synthesis electronic design automation systems

UNISYS CORPORATION

A method used by an electronic design automation system for allowing the use of logical names from a register transfer level description of an integrated circuit design in timing notes and simulation tests written for timing analysis and simulation programs. A synthesis program generates a state map file containing an entry for the logical name for each state defined in the register transfer level description of the integrated circuit. The gate level name generated by the synthesis program corresponding to the logical state name is stored in the entry, providing a one-to-one mapping between logical state names and gate-level state names.Filed by Unisys Corporation; granted 1998-03-10. The mapping technique it describes — tying human-readable logical names through to gate-level names for timing and simulation — sits upstream of most modern synthesis-to-verification flows.

US5727187A — patent drawing 1US5727187A — patent drawing 2
View full record
Most-cited records in the dataset
#Publication no.Patent titleCitations
1US6534395B2Method of forming graded thin films using alternating pulses of vapor phase reactants1,323
2US20010041250A1Graded thin films985
3US20020115252A1Dielectric interface films and methods therefor804
4US20050023656A1Vertical system integration785
5US6209123B1Methods of placing transistors in a circuit layout and semiconductor device with automatically placed transis…632
6US20050181555A1Thin films622
7US6509217B1Inexpensive, reliable, planar RFID tag structure and method for making same582
8US6470489B1Design rule checking system and method528
9US20050251771A1Integrated circuit layout design methodology with process variation bands508
10US6370679B1Data hierarchy layout correction and verification method and apparatus502

Citation counts favor older filings simply because they have had more time to be cited within this corpus; treat them as a signal of influence on the field, not of current filing activity.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on EDA & Chip Design Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three patterns recur across the assignee ranking, the filing trend and the class breakdown — each has a direct bearing on where a new filing is likely to land clean.

Concentration
45.4%
of 18,397 records held by top 5

The top of the field is genuinely crowded

Five assignees hold 8,361 of the 18,397 records in scope, and the top ten extend that to 63.6% (11,693 records). That is concentration at the very top of the ranking, not an even spread across the 100 ranked companies — a new entrant filing in the same core synthesis and timing-analysis claims is filing directly against that density.

Based on the full 100-company assignee ranking
Growth
+10%
2021 to 2024 (768 → 846 records)

Filing activity is still rising, not cooling

The complete-year data runs through 2024, where volume sits above both 2021 and the earlier-decade baseline, with 2023 the peak year recorded so far at 855. The apparent drop into 2025-2026 is a publication-lag artefact — those years are still being filled in and should not be read as declining interest.

2025-2026 figures understated by design
Composition
70.2%
of records carry a G06F class

Software-side claims dominate the class mix

G06F digital data processing appears on 70.2% of records, well ahead of the hardware-side H01L (24.6%) and H10D (9.5%). Because records carry multiple classes, this says claim space is occupied in the automation-logic layer specifically, not that the whole field is saturated — the narrower classes below 5% look comparatively open.

Class shares sum to more than 100% by design
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on EDA & Chip Design Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the ground, and where momentum has cooled

The ranked leaders account for most of the volume, but the latest-year momentum figures show even the largest filers pulling back sharply from their own recent pace — a pattern worth separating from long-run share.

Leader
3,502
records for the top-ranked assignee

One filer sits well ahead of the field

The leading assignee's 3,502 records dwarf the fifth-place figure of 1,120 and the tenth-place figure of 359, which is the steep drop-off typical of a field anchored by a handful of large EDA and foundry players rather than a flat distribution.

Counted in patent families
Momentum
-88% to -100%
YoY change, latest year, across several top filers

Recent-year filing counts have dropped sharply across the board

Several of the largest assignees show latest-year filing counts far below their prior year — declines in the -88% to -100% range are consistent across multiple leaders. This should be read alongside the 18-month publication lag rather than as a sudden retreat from the field; the complete-year trend through 2024 still shows growth.

Latest-year figures are provisional
Collaboration
10
co-assignee pairs identified

Co-filing is concentrated within corporate families

The strongest co-assignee pairs link a parent company to its own regional IP or subsidiary entities rather than to external partners, suggesting most joint filings in this dataset reflect internal corporate structure rather than cross-company collaboration.

10 pairs identified across the dataset
🔍
Under-claimed sub-areas worth a closer look
These narrower IPC subclasses sit well below the 70.2% G06F share, and the technical routes within them are less contested by the leading assignees.
Electric and magnetic measurement for die-level test (G01R)Pulse technique and logic-circuit primitives (H03K)Static and dynamic memory verification (G11C)Emerging semiconductor device subtypes (H10W, H10P)
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Latest-year filing momentum by assignee
AssigneeRecent yearYoY
ARM Ltd17-88%
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)5-91%
Intel Corporation2-88%
International Business Machines Corporation (IBM)0-100%
Synopsys, Inc.0-100%
Cadence Design Systems, Inc.0
Altera Corporation0-100%
LSI Corporation0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on EDA & Chip Design Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this next

The dataset points to specific follow-up questions rather than a single conclusion — each depends on what the reader is trying to decide.

Check freedom-to-operate against the top filers

With 45.4% of records held by five assignees, a freedom-to-operate review for any core synthesis, timing-analysis or layout-verification claim should start with those portfolios before looking further down the ranking.

Run a freedom-to-operate check in Eureka

Watch the under-5%-share classes for openings

G01R, H10W, H03K, G11C and H10P each sit near or below 4.6% of records — narrow enough that a well-drafted claim may still find clear space, particularly at the measurement and memory-verification boundary.

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Re-run the trend once 2025-2026 fills in

Because publication lags filing by roughly 18 months, the apparent drop-off after 2024 is not yet reliable evidence of a slowdown; revisit the filing trend once those years mature before drawing conclusions about momentum.

Track filing trends in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on EDA & Chip Design Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about EDA and chip design patents

Answers are grounded in the same dataset. Derived from a Patsnap search on EDA & Chip Design Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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