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Edge AI Accelerators Patent Landscape 2026

Edge AI Accelerators Patent Landscape 2026
Competitive Landscape

Edge AI Accelerators Patent Landscape in 2026

Samsung Electronics commands the largest position among the top hundred filers and, together with Qualcomm, accounts for a dominant share of the concentrated leader tier. The field is in active growth — annual filings have risen consistently since 2017, with the most recent years still accumulating under publication lag.

11,282
Patent families in scope
63%
Top-5 share of top-100 filers
+42%
3-yr filing growth (lag-adj.)
United States
Leading jurisdiction
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Published byPatSnap Insights Team··7 min readVerified by PatSnap Eureka data
Overview

Samsung and Qualcomm anchor a steeply concentrated leader tier

Samsung Electronics ranks first with 2,689 patent families, more than 1.5 times the second-ranked Qualcomm (1,773 patent families). Together they represent by far the largest individual positions in the corpus of 11,282 patent families in scope.

The top five filers — Samsung, Qualcomm, Huawei, Intel, and DeepX — account for 63% of the combined output of the hundred largest filers. This degree of concentration is characteristic of a field where foundational hardware and algorithm IP has consolidated early around a small set of semiconductor and platform companies.

Leading applicants
#ApplicantPatent familiesShare
1Samsung Electronics Co., Ltd.2,689
2Qualcomm Incorporated1,773
3Huawei Technologies Co., Ltd.416
4Intel Corporation314
5DeepX Co., Ltd.275
6ARM Ltd.195
7VIA Alliance Semiconductor Co., Ltd.160
8D5AI LLC153
9Digital Global Systems Inc.140
10Microsoft Technology Licensing LLC132
#ApplicantPatent familiesShare
11SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION108
12SAS Institute Inc.93
13Siemens AG83
14Google LLC80
15Huawei Cloud Computing Technologies Co., Ltd.78
16Qualcomm Technologies Inc.76
17Micron Technology Inc.72
18NVIDIA Corporation71
19Rebellions Inc.57
20Meta Platforms Technologies LLC56
↗ Hover a row · click a company to ask Eureka

Samsung’s scale reflects both its broad semiconductor portfolio and an active co-filing program with Korean universities, while Qualcomm’s 122% momentum surge signals a recent strategic acceleration. The tier gap between these two leaders and the rest of the top ten is large enough that new entrants face a significant catch-up challenge in core neural-network compute IP.

Filings from approximately the last 18–24 months are under-counted due to patent-publication lag; the apparent 2026 figure in particular understates true activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: PatSnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope.Explore deeper in Eureka →
Trends & Structure

Consistent annual growth with AI-model compute as the dominant technology class

The filing trend and technology composition charts together show a field still in expansion, anchored by neural-network compute IP but extending into adjacent application domains at the periphery.

Annual filing trend

Annual filings grew from 112 in 2017 to a recorded high of 1,994 in 2025, reflecting a 42% increase over the recent window. The 2026 bar is materially incomplete due to publication lag and should not be read as a slowdown; the growth trajectory established since 2017 remains intact.

Annual filing trendAnnual values from 2017 to 2026, peaking at 1,994 in 2025.1122017306201870520191,23520201,51820211,51720221,58020231,82320241,99420254922026↗ Hover for values · click a bar to ask Eureka

Technology composition

G06N (AI-model computing) is overwhelmingly dominant. G06F (digital data processing) is the second-largest branch, followed at some distance by G06T (image processing), G06V (image/video recognition), and H04L (digital transmission) — reflecting the deployment of accelerators in vision and connectivity pipelines. Lower-volume branches such as G11C (memory), H03K (logic circuits), and H01L (semiconductor devices) mark hardware-layer activity that remains relatively sparse compared to the algorithm-layer core.

Technology compositionG06N · Computing based on AI models leads with 10,905; G06F · Electric digital data processing 4,558.G06N · Computing based o…10,905G06F · Electric digital …4,558G06T · Image data proces…1,439G06V · Image/video recog…1,229H04L · Digital informati…909G06K · Data recognition …706H04N · Pictorial communi…556H04W · Wireless communic…472↗ Hover for values · click a bar to ask Eureka
Source: PatSnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20250238656A1Published 2025-07-24

Multiomoal emotion recognition system with edge ai…

Intelligent Information Security Technology INC.

The present invention relates a multimodal emotion recognition system with edge AI accelerator. The system employs a Fuzzy Long-Short Recurrent Convolutional Network (Fuzzy LRCN) for multiple emotion classifications. The algorithm strategically utilizes only eight channels of electroencephalogram (EEG) signals and combines electrocardiogram (ECG) and… (excerpt from the patent abstract)

Multiomoal emotion recognition system with edge ai… — patent drawingMultiomoal emotion recognition system with edge ai… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1Technologies for distributing iterative computatio…363
2Technologies for distributing gradient descent com…332
3System, method, and apparatus for providing dynami…298
4Fixed point neural network based on floating point…260
5Adaptive selection of artificial neural networks251
6Bit width selection for fixed point neural networks249
7Application Development Platform and Software Deve…243
8Method and apparatus for automated design of compl…241

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents.

Source: PatSnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Insights

What the competitive structure means for R&D strategy

The combination of high concentration, a growth life-cycle stage, active industry–university collaboration, and US-led jurisdiction coverage defines the strategic landscape for an entrant or challenger.

Growth

Growth stage with publication lag masking true pace

The field is classified as Growth: annual filings have risen consistently and the most recent years remain understated by publication lag. This means the window for establishing foundational positions is not closed, but the pace of incumbents’ filings is high enough that differentiated technical angles — rather than broad AI-compute coverage — are the realistic entry path for new filers.

Life-cycle: Growth
Concentration

Two-tier structure with a wide gap below the top pair

Samsung and Qualcomm together hold a position that no single challenger replicates. Huawei (416 patent families), Intel (314), and DeepX (275) form a mid-tier that is active but substantially smaller. Below rank five, portfolio sizes fall sharply, suggesting that targeted sub-domain strategies — rather than broad portfolio buildout — are more realistic for mid-tier and emerging players.

Top-5 share: 63%
Collaboration

Samsung anchors a dense industry–university co-filing network

Samsung Electronics co-files most actively with the Seoul National University R&DB Foundation (95 joint patent families), followed by KAIST (35) and Sungkyunkwan University (18). ARM co-files with an entity translating as ‘Top Company’ (16 joint families). This pattern shows that academic partnerships are a meaningful source of novel IP in this space, particularly for hardware-algorithm co-design, and that Korean universities are disproportionately embedded in the ecosystem.

Co-filing network active
Geography

US leads filings; India and EPO are the next-largest jurisdictions

The United States is the primary filing jurisdiction, followed by India and Europe (EPO). WIPO (PCT) filings indicate broad international protection strategies by leading applicants. China, Germany, Taiwan, and Japan form a secondary tier. The relatively high India count reflects both domestic filers and international applicants extending protection into a fast-growing deployment market. Coverage across Southeast Asia (Vietnam, Philippines, Singapore) is present but thin.

US-led, global reach
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Top collaboration links
ApplicantCollaboratorCo-filings
Samsung Electronics Co., Ltd.Seoul National University R&DB Foundation95
Samsung Electronics Co., Ltd.Korea Advanced Institute of Science and Technology (KAIST)35
Samsung Electronics Co., Ltd.Research & Business Foundation Sungkyunkwan University18
Samsung Electronics Co., Ltd.Industry Academic Cooperation Foundation Yonsei University18
ARM Ltd.Top Company16
Samsung Electronics Co., Ltd.Nota Inc.12
Samsung Electronics Co., Ltd.POSTECH Academy-Industry Foundation10
Samsung Electronics Co., Ltd.Ulsan National Institute of Science and Technology (UNIST)8
Samsung Electronics Co., Ltd.University of Zurich8
Samsung Electronics Co., Ltd.高丽大学校产学协力团6

Co-filing pairs, ranked by the number of jointly-filed patent families.

Source: PatSnap Eureka. Collaboration counts reflect co-applicant patent families; jurisdiction counts are at the patent-record level.Explore insights →
Leaders

Samsung and Qualcomm lead on volume; DeepX stands out on momentum

The top applicants differ in portfolio breadth, technology emphasis, and recent trajectory. Samsung leads on absolute volume; Qualcomm has accelerated sharply; DeepX shows the fastest growth rate from a specialist base.

Leader · Samsung Electronics

Samsung Electronics

Samsung holds 2,689 patent families — the largest position in the field — with its portfolio concentrated in G06N 3 (neural-network computing), G06T 7 (image processing), and G06F 3 (digital data processing). Recent momentum is positive at +19%, and a co-filing program spanning at least seven Korean university partners reinforces its foundational coverage across both algorithm and hardware-adjacent layers.

families: 2,689
Challenger · Qualcomm

Qualcomm

Qualcomm ranks second with 1,773 patent families and has recorded the strongest momentum among established leaders at +122% in the recent period, signalling a deliberate strategic acceleration. Its technical focus sits in G06N 3 (neural-network computing), G06N 20 (machine learning), and G06V 10 (image/video recognition), consistent with on-device inference use cases in mobile and automotive platforms.

families: 1,773
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DeepX Co. Ltd.ARM Ltd.+ more
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Leading-applicant momentum (recent 3 yrs, lag-adjusted)
ApplicantRecent (3 yrs)Trend
Samsung Electronics Co., Ltd.1,283▲ +19%
Qualcomm Incorporated903▲ +122%
Huawei Technologies Co., Ltd.156▬ +1%
Intel Corporation118▬ -3%
DeepX Co., Ltd.189▲ 6.5× vs prior 3-yr
ARM Ltd.81▼ -10%
D5AI LLC46▼ -21%
Digital Global Systems Inc.71▲ new entrant
Source: PatSnap Eureka. Player counts are at the patent-family level; momentum compares recent three-year filings to the prior three-year period.Explore players →
Adjacent Branches

Under-served branches adjacent to the dominant compute core

Several IPC branches sit at the periphery of the core G06N cluster with relatively modest patent-record counts. These are observations of relative sparsity; where a branch also has clear technical relevance and a plausible entry path, it may represent an actionable adjacent area.

G06T · Image data processing & generation

With 1,439 patent records, image processing is the third-largest branch but holds only a 6% share of the technology composition — notably sparse given that vision inference is one of the primary edge-AI use cases. The technical gap between accelerator architecture and real-time image-pipeline optimization (super-resolution, low-light enhancement, hardware-aware compression) is well-defined, and the entry path via existing computer-vision IP frameworks is realistic for both semiconductor and system-level filers.

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H04L · Digital information transmission

H04L covers digital transmission protocols and network-layer processing and appears in 909 patent records — a 4% share — despite edge AI deployments being inherently communication-dependent (federated learning, model synchronization, telemetry). The intersection of accelerator design with communication-efficient inference and on-device model aggregation is technically active but remains under-filed relative to pure compute IP, offering a differentiated angle for filers operating at the edge–network boundary.

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Access branch-level filing gaps across the full IPC taxonomy for Edge AI Accelerators.
G06K · Data recognition & presentationH04N · Pictorial communication (video/TV)+ more
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Source: PatSnap Eureka. Branch share figures are computed against the patent-record total for the top IPC classes in scope.Explore emerging →
Route Matrix

How leading filers differ across technology sub-routes

Strength of each leader across the main technology routes.

PlayerG06N 3 · Computing based on AI modelsG06N 20 · Computing based on AI modelsG06F 9 · Electric digital data processingG06V 10 · Image/video recognitionG06F 15 · Electric digital data processing
Samsung Electronics Co., Ltd.Strong · 2,496Emerging · 238Emerging · 189Emerging · 206Emerging · 128
Qualcomm IncorporatedStrong · 1,725Emerging · 190Emerging · 54Emerging · 123Emerging · 51
Huawei Technologies Co., Ltd.Strong · 321AbsentEmerging · 32Emerging · 26Emerging · 36
Intel CorporationStrong · 260AbsentModerate · 69Emerging · 18Emerging · 41
DeepX Co., Ltd.Strong · 260Emerging · 17Emerging · 24Emerging · 18Emerging · 28
Digital Global Systems Inc.Strong · 140Strong · 140AbsentAbsentAbsent
VIA Alliance Semiconductor Co., Ltd. (Shanghai Zhaoxin Integrated Circuit)Strong · 158AbsentModerate · 62AbsentEmerging · 20
Source: PatSnap Eureka. Matrix values are measured in patent records and should not be compared directly with family-level applicant totals.Compare in Eureka →
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. PatSnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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