Electrochemical Copper Deposition Patents: Top Companies & Trends 2026
Electrochemical Deposition of Copper Patents: Who Leads and Where the Field Is Still Open
61.4% concentration at the top. The top 5 of 32 ranked assignees hold 43 of 70 records in scope — a field with a clear leading cluster rather than a long flat tail. Filings peaked at 7 in 2017. The most recent complete comparison point runs 2021 = 7 to 2024 = 0, a -100% change over that three-year span. Counts for 2025 and 2026 are not yet comparable — publication typically lags filing by around 18 months, so the newest years understate real activity.
- 1INTERNATIONAL BUSINESS MACHINE CORPORATION10
- 2LAM RES CORP10
- 3TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD10
- 4MACDERMID ENTHONE INC7
- 5APPLIED MATERIALS INC6
See the full electrochemical deposition of copper analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on this landscape
Who are the leading patent holders in electrochemical copper deposition?
The assignee ranking for this dataset covers 32 companies, with the leading assignee holding 10 of the 70 records in scope. The top five assignees combined hold 43 records, 61.4% of the field, and the top ten reach 88.6%. This is a concentrated field: most of the remaining ranked companies hold only one or two records each, so due-diligence work should prioritize the leading cluster first.
Is filing activity in copper electroplating patents increasing or decreasing?
The documented trend shows a peak of 7 filings in 2017 and a drop from 7 in 2021 to 0 in 2024, a -100% change over that span. However, patent publication typically lags filing by around 18 months, so the 2025-2026 figures in this dataset are not yet complete and should not be read as a real decline. Treat 2024 as the most recent year with a reliable count.
What technology areas overlap most in this patent space?
Semiconductor device claims (IPC class H01L) appear on 62.9% of the 70 records in scope, and electroplating/electroforming claims (C25D) appear on 52.9%. Because a single patent can carry both classifications, the two areas overlap heavily rather than sitting as separate silos. This means most competitive filings combine a device-structure claim with a bath-chemistry or process claim rather than isolating one.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Electrochemical Deposition of Copper covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.