Electromagnetic Compatibility Patents: Top Companies & Trends 2026
- 11.9% concentration at the top. The five leading assignees together account for 3,816 of 32,054 records in scope, leaving a long tail of single- and few-filing entrants.
- Filing has cooled from its 2019 peak. Filings ran from 990 in 2019 down through 913 in 2021 to 679 in 2024, a 26% decline over that three-year span, before the most recent, still-incomplete years.
- Printed circuits carry the claim density. H05K (printed circuits & assemblies) touches 20.4% of all 32,054 records, more than any other IPC subclass in the dataset.
Filing growth compares 2021 (913 records) with 2024 (679) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 32,054 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This landscape tracks patent filings at the intersection of electromagnetic compatibility and interference control with the materials and structures used to build it — flexible substrates, conductive ink, EMI shielding, bonding interfaces and conductive traces. The scope spans 2015 through the 2026 data cut-off, covering 32,054 published records across major receiving offices including the United States, the EPO, WIPO/PCT, Canada, Australia and the United Kingdom.
Because publication lags filing by roughly 18 months, the most recent one to two years in any trend chart understate real filing activity; treat 2024 as the last year with a reasonably complete count and read anything after it as a floor, not a ceiling.
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Filing trend and technology composition
Two views of the same 32,054-record corpus: how filing volume has moved year over year, and which IPC subclasses carry the claim density that decides where new filings will run into prior art.
Filing trend, 2017–2026
Annual filings rose to a peak of 990 in 2019, held near that level through 2021 at 913, then fell to 679 by 2024 — a 26% decline across that three-year window. Counts for 2025 and 2026 are still filling in under the publication lag and should not be read as a continued drop.
IPC subclass composition
H05K (printed circuits & assemblies) appears in 20.4% of the 32,054 records in scope, well ahead of H01L (semiconductor devices) at 11.3% and H10W at 8.0%. Because records can carry multiple IPC codes, these shares sum to more than 100% and should be read as claim density per subclass, not as a partition of the field.
Shares are the percentage of the 32,054 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Electromagnetic Compatibility Patent Landscape with Eureka
This page is one run against one query. Ask Eureka your own question about electromagnetic compatibility patent landscape and every answer comes back with the patent numbers behind it.
Try EurekaRepresentative and most-cited filings
US20170179041A1 — Semiconductor package with trenched molding-based EMI shielding
Filed by Intel Corporation, this application discloses semiconductor packages with EMI shielding formed from cured conductive ink or paste applied to the sidewalls of the molding that encapsulates the package's electronic components, with vertical shielding portions built by filling ink into trenches formed in that molding.Abstract trimmed for length; see the full record for complete claim language.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20110022032A1 | Battery ejection design for a surgical device | 2,086 |
| 2 | US20090096413A1 | System and method for inductive charging of portable devices | 1,904 |
| 3 | US9113880B2 | Internal backbone structural chassis for a surgical device | 1,782 |
| 4 | US6184521B1 | Photodiode detector with integrated noise shielding | 1,486 |
| 5 | US6985764B2 | Flex circuit shielded optical sensor | 1,430 |
| 6 | US5890929A | Shielded medical connector | 1,393 |
| 7 | US10041822B2 | Methods to shorten calibration times for powered devices | 1,342 |
| 8 | US6152754A | Circuit board based cable connector | 1,313 |
| 9 | US20080170982A1 | Fabrication and Application of Nanofiber Ribbons and Sheets and Twisted and Non-Twisted Nanofiber Yarns | 1,266 |
| 10 | US20180132850A1 | Surgical instrument comprising a sensor system | 1,144 |
Citation counts favour older filings that have had more time to accumulate forward references inside this corpus; treat them as a signal of influence on the field, not as a ranking of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for a filing decision
Three read-throughs from the trend, composition and citation data that matter more for strategy than the raw counts themselves.
Leadership is real but not dominant
The five leading assignees combine for 3,816 of 32,054 records — 11.9% of the field. That leaves the large majority of filings spread across a long tail, which means freedom-to-operate analysis here cannot rely on clearing a handful of large portfolios; it has to account for many smaller, scattered filers.
Volume has pulled back from its 2019 peak
Filings peaked at 990 in 2019 and eased to 679 by 2024, a 26% decline over that span. That is a cooling from a high point, not a collapse — and the 2025–2026 figures are still incomplete under the usual publication lag, so it is too early to call a continued slide.
Printed-circuit structures carry the densest prior art
H05K, covering printed circuits and assemblies, touches one in five records in scope — more than any other subclass tracked here. Semiconductor devices (H01L, 11.3%) and H10W (8.0%) follow some distance behind, marking where new claims are most likely to collide with existing filings.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to electromagnetic compatibility patent landscape, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Parker Hannifin Corporation | LIONETTA WILLIAM G | 11 |
| 3M Innovative Properties Co. | FREY MATTHEW H | 9 |
| Laird Technologies, Inc. | ENGLISH GERALD ROBERT | 9 |
| 3M Innovative Properties Co. | YU TA HUA | 8 |
| 3M Innovative Properties Co. | BRIGHT CLARK I | 8 |
| Parker Hannifin Corporation | BUNYAN MICHAEL H | 8 |
| Laird Technologies, Inc. | VAN HAASTER PHILIP | 7 |
| 3M Innovative Properties Co. | LE JOHN D | 6 |
Co-assignee pairings in this dataset are shallow — only 10 pairs recur at all, and the strongest pairing appears 11 times — indicating this field is driven mostly by single-assignee filing rather than joint development programmes.
Who is filing, and where activity is slowing
The ranked leaders span device makers, materials suppliers and semiconductor packaging houses, but recent-year momentum data shows filing pace easing across the board rather than concentrating further.
A single leader well ahead of the field
The top-ranked assignee holds 1,001 records, roughly double the fifth-place count of 572 and well clear of tenth place at 267. The gap between first and fifth suggests one portfolio anchors the space more than any coalition of firms.
A steep drop-off after the leader
Filing counts fall sharply from the leader to fifth place and again by tenth, which is typical of a field with one dominant early filer surrounded by a broader set of moderate, steady contributors rather than several co-equal giants.
Even established filers have slowed sharply
Recent-year momentum among several previously active assignees shows steep drops — some down 84% to 86% year over year, others down to zero filings in the latest year. This mirrors the broader 2021↓2024 pullback and is consistent with the publication lag understating the very latest activity rather than a sudden exit from the space.
| Assignee | Recent year | YoY |
|---|---|---|
| Samsung Electronics Co., Ltd. | 3 | -84% |
| Advanced Semiconductor Engineering, Inc. | 3 | -25% |
| STATS ChipPAC Pte. Ltd. | 1 | -86% |
| 3M Innovative Properties Co. | 0 | -100% |
| Apple Inc. | 0 | -100% |
| Laird Technologies, Inc. | 0 | -100% |
| Intel Corporation | 0 | -100% |
| Parker Hannifin Corporation | 0 | — |
Where to take this analysis
The published record only shows where claims already sit. Turning that into a filing or freedom-to-operate decision means going deeper on specific assignees, subclasses or claim language.
Map a specific assignee's active claims
Pull the full claim set behind any one of the ranked leaders to see exactly which shielding, substrate or bonding structures they have locked down versus what has lapsed.
Explore assignee portfolios in EurekaCheck a draft claim against this corpus
Run a candidate claim on conductive trace or ink-based shielding through the full-text corpus before filing, rather than relying on subclass-level density alone.
Run a claim check in EurekaTrack momentum past the publication lag
Set an alert on the under-claimed sub-areas identified here so new filings surface as soon as they publish, rather than waiting for the next annual dataset refresh.
Set up monitoring in EurekaCommon questions on the EMC patent landscape
The assignee ranking behind this landscape covers 100 companies, with a single leader holding 1,001 records — well ahead of the fifth-ranked firm at 572 and the tenth at 267. The field is not evenly split among a handful of giants: the top five combined account for 11.9% of the 32,054 records in scope, so most filings sit with a long tail of smaller players. Anyone doing a competitive scan should look past the leader to that tail, since a meaningful share of the claim space is held outside the largest portfolios.
Filings peaked at 990 in 2019 and fell to 679 by 2024, a 26% decline over that three-year span. That is a genuine pullback from the peak rather than a rounding error, but it should not be read as the field dying out: publication typically lags filing by around 18 months, so 2025 and 2026 counts are still incomplete and will rise as more records publish. 2024 is the most recent year that can be treated as a reliable data point.
H05K, covering printed circuits and assemblies, is the densest single subclass at 20.4% of the 32,054 records in scope. H01L (semiconductor devices) follows at 11.3%, and H10W at 8.0%. Connectors and current collectors (H01R) and digital data processing (G06F) also show meaningful overlap. Because a single record can carry several IPC codes, these percentages sum to more than 100% and should be read as density per subclass, not as slices of a single pie.
US20170179041A1, filed by Intel Corporation, discloses semiconductor packages shielded with cured conductive ink or paste applied to the sidewalls of the encapsulating molding, with vertical shielding sections built by filling ink into trenches cut into that molding. It is a manufacturing-process and structure claim specific to trench-fill ink application on package sidewalls, not a claim over conductive-ink EMI shielding in general. Work using different deposition methods, different trench geometries, or shielding placed elsewhere on the package is less likely to fall inside its scope, but any team using a trenched sidewall ink-fill approach should read the full claim set carefully.
Filing density is comparatively thin in areas like flexible substrate bonding interfaces, environmental stress testing of conductive traces, and EMI shielding built specifically for optical sensor packages, relative to the dense core claims around printed-circuit shielding and semiconductor packaging. These are not unclaimed fields, but they carry far less prior art than H05K or H01L, which makes them a more realistic place to stake a first claim than the crowded shielding-structure space. Any white-space read should be confirmed against a full-text search before committing to a filing strategy.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.