https://www.patsnap.com/resources/blog/rd-blog/electron-beam-and-maskless-lithography-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Lithography
Electron Beam and Maskless Lithography Patents: Who Holds the Core Claims
  • Filing has cooled since a 2017 peak of 13 records a year, with the 2022 midpoint sitting at 7 — the field is consolidating around known claim territory rather than expanding into it.
  • The most-cited records are all pre-2005 maskless writer patents, meaning the field's influence still traces back to foundational architecture, not recent refinements.
  • Momentum has largely stalled across the named incumbents, with most tracked assignees showing zero filings in the latest year — only one shows any recent activity.
Get a prior-art report on your approach
348
Published Records
28%
Top-5 Share of All Records
-78%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

Electron beam and maskless lithography patents span the machines that write patterns directly onto a substrate without a physical mask, and the software and beam-control methods that make that writing fast and accurate enough for production. This dataset pulls 348 patent families published between 2015 and mid-2026, filtered to records that combine core lithography terms — electron beam lithography, maskless lithography, multi-beam writer — with the specific technical vocabulary of the field: writing speed, proximity effect correction, resist sensitivity, beam blur and stitching error.

The IPC composition confirms this is a cross-disciplinary claim space: G03F (photolithography) and H01J (electron and discharge tubes) dominate, but H01L semiconductor-device claims and G03C photosensitive-material claims sit close behind, showing that beam-writer patents rarely stand alone — they are claimed alongside the resist chemistry or the device structure they are meant to produce.

Filing activity, 2017–2026
  1. 1APPLIED MATERIALS INC24
  2. 2HITACHI LTD19
  3. 3TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD19
  4. 4INTERNATIONAL BUSINESS MACHINE CORPORATION18
  5. 5ASML HLDG NV17
  6. 6ASML NETHERLANDS BV16
  7. 7MAPPER LITHOGRAPHY IP15
  8. 8KK TOSHIBA15
  9. 9IMS NANOFABTION12
  10. 10VISTEC ELECTRON BEAM11
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Electron Beam and Maskless Lithography covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trends and technology composition

Publication data lags filing by roughly 18 months, so 2026 figures are necessarily incomplete — the real test is the multi-year trend, not the most recent single year.

A field past its filing peak

Filings ran at 13 a year in 2017, the peak so far, and had fallen to a midpoint of 7 by 2022. That trajectory reads as flat-to-declining rather than growing, consistent with a technology whose core claim territory was staked out early and is now being maintained rather than expanded.

A field past its filing peak04811151320172018201920202021202220232024202512026Most recent year is partial — publication lag means later filings are not yet visible.

Claims split across writer, resist and device

G03F (252 records) and H01J (220) anchor the space as expected for a beam-writing technology, but H01L (154), G03C (23) and B82Y (13) show that a meaningful share of filings tie the beam-writer method to a specific downstream device, resist material or nanoscale application rather than claiming the writer in isolation.

Claims split across writer, resist and deviceG03F · Photolithography & photomechan…25272.4%H01J · Electron & discharge tubes22063.2%H01L · Semiconductor devices15444.3%H10P3510.1%G03C · Photosensitive materials236.6%G03B · Photographic apparatus185.2%B82Y · Nanotechnology applications133.7%G06F · Electric digital data processi…133.7%Other8825.3%

Shares are the percentage of the 348 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Electron Beam and Maskless Lithography covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Electron Beam and Maskless Lithography with Eureka

This page is one run against one query. Ask Eureka your own question about electron beam and maskless lithography and every answer comes back with the patent numbers behind it.

Try Eureka
Key Patents

The records other filings build on

Representative Filing
US6288406B12001-09-11

US6288406B1 — Electron beam lithography system having variable writing speed

DUPONT PHOTOMASKS, INC.

The system identifies minimum and maximum valid writing speeds from resist sensitivity, maximum beam current density and requested write address size, then a pattern-data-conversion stage picks how many stripes of figure data to combine per output bitmap for the selected speed, with timing-logic and blanking hardware clocking the bitmap to the serializer accordingly.Filed by DuPont Photomasks; granted 2001-09-11.

US6288406B1 — patent drawing 1US6288406B1 — patent drawing 2
View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US5870176AMaskless lithography254
2US20020001964A1Method for fabricating a stencil mask250
3US6238852B1Maskless lithography system and method with doubled throughput243
4US20050250052A1Maskless lithography using UV absorbing nano particle160
5US5900637AMaskless lithography using a multiplexed array of fresnel zone plates151
6US6709880B2Semiconductor device and a manufacturing method of the same130
7US6060224AMethod for maskless lithography130
8US5432714ASystem and method for preparing shape data for proximity correction127
9US20030085360A1Electron optics for multi-beam electron beam lithography tool116
10US6617587B2Electron optics for multi-beam electron beam lithography tool110

Citation counts reward age inside a searched corpus — treat this table as a map of foundational influence, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Electron Beam and Maskless Lithography covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Run it yourself

Put your own technology through the same analysis


  
Where to run it
Fastest

Eureka on the web

When you want the answer in the next five minutes.

The agent works the prompt against patents and technical literature, citing every source.

Run your analysis now →
For builders

MCP server & REST API

When it has to run inside your own pipeline.

Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.

Browse MCP servers →
Insights

What the numbers say about where this field stands

Three patterns stand out once the filing trend and the citation table are read together.

Filing Trend
13 → 1
peak year (2017) vs. latest year

Growth has stalled, not accelerated

The 2017 peak of 13 filings a year has not been repeated; the 2022 midpoint of 7 confirms a downward or flat trajectory rather than a technology still being built out.

Read as consolidation, not decline in relevance.
Citation Concentration
254 citations
top-cited record (US5870176A)

Influence sits with pre-2000 architecture

The five most-cited records in this corpus were all published before 2005, and the top record carries 254 citations — new entrants are still building on maskless-writer fundamentals laid down two decades ago.

Citation counts favour older records inside any searched corpus.
Filing Geography
154 US filings
of 348 total families

US receiving office dominates, Japan a distant second

United States filings (154) outnumber the next-largest office, Japan (59), by more than two to one, with Europe (48), WIPO (26), China (14) and the UK (8) trailing further behind.

Filing office signals where litigation and prosecution risk concentrates.
Assignee Momentum
0 in latest year
for five of six tracked incumbents

Named incumbents have gone quiet

Of the assignees tracked for recent-year momentum, only one shows any filing in the latest year; the rest — including major lithography and semiconductor names — show zero, consistent with the broader flat trend.

A quiet incumbent is not necessarily an exited one; check family continuations before assuming abandonment.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to electron beam and maskless lithography, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Electron Beam and Maskless Lithography covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claim territory

Filing activity concentrates among a small set of lithography equipment makers and semiconductor manufacturers, with co-assignee pairs pointing to individual inventor teams as much as corporate alliances.

Equipment Specialists
4 co-filings
strongest co-assignee pair

Mapper Lithography's inventor pairs

The strongest co-assignee links in the dataset connect Mapper Lithography IP with named individual inventors, appearing four times each — a pattern typical of a specialist equipment maker whose patent output tracks a small, stable engineering team.

Co-filing strength here reflects inventor continuity, not joint ventures.
Conglomerate Pairs
3 co-filings
Toshiba + Toshiba Machine

Toshiba's internal cross-filing

Toshiba and Toshiba Machine appear together three times, showing how a large conglomerate splits beam-writer claims across group entities rather than filing under one name.

Group-entity splits can mask true assignee concentration in ranking tables.
Recent Momentum
1 filing
TSMC, latest year

TSMC is the one incumbent still filing

Among the six assignees tracked for recent-year momentum, TSMC is the only one with a filing in the latest year; Hitachi, Mapper Lithography, IBM, ASML Holding and Applied Materials all show zero, suggesting the active edge of this field has narrowed to fewer players.

Zero recent filings does not rule out pending applications not yet published.
🔍
Under-claimed sub-areas worth a fresh claim
These branches show thinner filing density relative to the core writer and resist claims, based on the IPC spread and citation table above.
Multi-beam blanker array calibrationReal-time proximity effect correction algorithmsResist sensitivity tuning for high-throughput writersStitching-error compensation across write fieldsBeam blur correction at variable writing speed
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Taiwan Semiconductor Manufacturing Company (TSMC)1
Hitachi, Ltd.0
Mapper Lithography IP B.V.0
International Business Machines Corporation (IBM)0
ASML Holding N.V.0
Applied Materials, Inc.0
Toshiba Corporation0
IMS NANOFABTION0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Electron Beam and Maskless Lithography covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

How to use this landscape

The filing trend and citation table point to a mature but still-active claim space. The next step is usually narrower than a landscape view.

Check freedom-to-operate against the top-cited records

Because the most-cited patents predate 2005, any new writer or resist-control claim should be checked against those foundational filings before drafting.

Run an FTO search in Eureka

Track the quiet incumbents for continuations

Zero recent filings from most named assignees may mean pending applications not yet published rather than exit — worth monitoring rather than assuming.

Set up assignee monitoring in Eureka

Explore the under-claimed sub-areas

Proximity effect correction algorithms and stitching-error compensation show thinner density than the core writer claims — a starting point for a novelty search.

Search white space in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Electron Beam and Maskless Lithography covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this patent landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Electron Beam and Maskless Lithography covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Research Electron Beam and Maskless Lithography in depth with Eureka

Go past this page: query the whole electron beam and maskless lithography corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.

Try Eureka

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.