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Run your analysis now →Electron beam and maskless lithography patents span the machines that write patterns directly onto a substrate without a physical mask, and the software and beam-control methods that make that writing fast and accurate enough for production. This dataset pulls 348 patent families published between 2015 and mid-2026, filtered to records that combine core lithography terms — electron beam lithography, maskless lithography, multi-beam writer — with the specific technical vocabulary of the field: writing speed, proximity effect correction, resist sensitivity, beam blur and stitching error.
The IPC composition confirms this is a cross-disciplinary claim space: G03F (photolithography) and H01J (electron and discharge tubes) dominate, but H01L semiconductor-device claims and G03C photosensitive-material claims sit close behind, showing that beam-writer patents rarely stand alone — they are claimed alongside the resist chemistry or the device structure they are meant to produce.
Publication data lags filing by roughly 18 months, so 2026 figures are necessarily incomplete — the real test is the multi-year trend, not the most recent single year.
Filings ran at 13 a year in 2017, the peak so far, and had fallen to a midpoint of 7 by 2022. That trajectory reads as flat-to-declining rather than growing, consistent with a technology whose core claim territory was staked out early and is now being maintained rather than expanded.
G03F (252 records) and H01J (220) anchor the space as expected for a beam-writing technology, but H01L (154), G03C (23) and B82Y (13) show that a meaningful share of filings tie the beam-writer method to a specific downstream device, resist material or nanoscale application rather than claiming the writer in isolation.
Shares are the percentage of the 348 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about electron beam and maskless lithography and every answer comes back with the patent numbers behind it.
Try EurekaThe system identifies minimum and maximum valid writing speeds from resist sensitivity, maximum beam current density and requested write address size, then a pattern-data-conversion stage picks how many stripes of figure data to combine per output bitmap for the selected speed, with timing-logic and blanking hardware clocking the bitmap to the serializer accordingly.Filed by DuPont Photomasks; granted 2001-09-11.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US5870176A | Maskless lithography | 254 |
| 2 | US20020001964A1 | Method for fabricating a stencil mask | 250 |
| 3 | US6238852B1 | Maskless lithography system and method with doubled throughput | 243 |
| 4 | US20050250052A1 | Maskless lithography using UV absorbing nano particle | 160 |
| 5 | US5900637A | Maskless lithography using a multiplexed array of fresnel zone plates | 151 |
| 6 | US6709880B2 | Semiconductor device and a manufacturing method of the same | 130 |
| 7 | US6060224A | Method for maskless lithography | 130 |
| 8 | US5432714A | System and method for preparing shape data for proximity correction | 127 |
| 9 | US20030085360A1 | Electron optics for multi-beam electron beam lithography tool | 116 |
| 10 | US6617587B2 | Electron optics for multi-beam electron beam lithography tool | 110 |
Citation counts reward age inside a searched corpus — treat this table as a map of foundational influence, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three patterns stand out once the filing trend and the citation table are read together.
The 2017 peak of 13 filings a year has not been repeated; the 2022 midpoint of 7 confirms a downward or flat trajectory rather than a technology still being built out.
The five most-cited records in this corpus were all published before 2005, and the top record carries 254 citations — new entrants are still building on maskless-writer fundamentals laid down two decades ago.
United States filings (154) outnumber the next-largest office, Japan (59), by more than two to one, with Europe (48), WIPO (26), China (14) and the UK (8) trailing further behind.
Of the assignees tracked for recent-year momentum, only one shows any filing in the latest year; the rest — including major lithography and semiconductor names — show zero, consistent with the broader flat trend.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to electron beam and maskless lithography, with the prior art for and against each one.
Filing activity concentrates among a small set of lithography equipment makers and semiconductor manufacturers, with co-assignee pairs pointing to individual inventor teams as much as corporate alliances.
The strongest co-assignee links in the dataset connect Mapper Lithography IP with named individual inventors, appearing four times each — a pattern typical of a specialist equipment maker whose patent output tracks a small, stable engineering team.
Toshiba and Toshiba Machine appear together three times, showing how a large conglomerate splits beam-writer claims across group entities rather than filing under one name.
Among the six assignees tracked for recent-year momentum, TSMC is the only one with a filing in the latest year; Hitachi, Mapper Lithography, IBM, ASML Holding and Applied Materials all show zero, suggesting the active edge of this field has narrowed to fewer players.
| Assignee | Recent year | YoY |
|---|---|---|
| Taiwan Semiconductor Manufacturing Company (TSMC) | 1 | — |
| Hitachi, Ltd. | 0 | — |
| Mapper Lithography IP B.V. | 0 | — |
| International Business Machines Corporation (IBM) | 0 | — |
| ASML Holding N.V. | 0 | — |
| Applied Materials, Inc. | 0 | — |
| Toshiba Corporation | 0 | — |
| IMS NANOFABTION | 0 | — |
The filing trend and citation table point to a mature but still-active claim space. The next step is usually narrower than a landscape view.
Because the most-cited patents predate 2005, any new writer or resist-control claim should be checked against those foundational filings before drafting.
Run an FTO search in EurekaZero recent filings from most named assignees may mean pending applications not yet published rather than exit — worth monitoring rather than assuming.
Set up assignee monitoring in EurekaProximity effect correction algorithms and stitching-error compensation show thinner density than the core writer claims — a starting point for a novelty search.
Search white space in EurekaThe most-cited records in this corpus, such as US5870176A and US6238852B1, date from the late 1990s and describe core maskless writing architectures including doubled-throughput writer systems and stencil mask fabrication. These records carry the highest citation counts in the dataset, meaning later filings across the industry still build on them. Newer entrants should treat these as the baseline prior art to search against before drafting writer-architecture claims.
Filing activity peaked in 2017 at 13 records and had fallen to a midpoint of 7 by 2022, which reads as flat or declining rather than growing. This does not mean the technology is abandoned — publication lags filing by around 18 months, so the most recent years are always undercounted. But the multi-year trend across this dataset does not support a growth narrative for new entrants.
Among the assignees tracked for recent-year momentum, only one — a major semiconductor manufacturer — shows a filing in the latest year, while the others tracked show none. This narrowing suggests the active edge of the field has consolidated to fewer players even as the overall patent base remains substantial at 348 families. Anyone assessing competitive risk should verify pending, unpublished applications rather than relying on published counts alone.
US6288406B1 claims a system for variable writing speed in electron beam lithography, combining job-control software that selects valid writing speeds from resist sensitivity and beam current density, a pattern-data-conversion stage that determines how figure data is bundled per output bitmap, and hardware that clocks the resulting bitmap to a serializer. It was filed by DuPont Photomasks and granted in 2001. Anyone building variable-speed writing control should map their approach against this claim structure specifically, not just the general concept of adjustable writing speed.
Based on the IPC composition and citation data, sub-areas like real-time proximity effect correction algorithms, stitching-error compensation across write fields, and resist sensitivity tuning for high-throughput writers show thinner filing density relative to the core writer and resist claims. These are not unclaimed, but they carry fewer dominant, heavily-cited patents than the foundational writer architectures. A first claim in these areas should be checked against the existing corpus rather than assumed to be open.
Go past this page: query the whole electron beam and maskless lithography corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.