Book a demo

Electron Beam Melting Patents: Leaders, Trends & White Space 2026

Electron Beam Melting Patents: Leaders, Trends & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/electron-beam-melting-testing-and-inspection-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Additive Manufacturing
Electron Beam Melting Testing and Inspection Patents
  • Filing already peaked. 2017 recorded 23 filings against a dataset of 62 families total; by the 2022 midpoint annual filing had fallen to 6, and the trend has not recovered.
  • Powder metallurgy dominates the claim set. B22F (powder metallurgy) appears in 43 of 62 families and B33Y (additive manufacturing) in 34, while inspection-specific classes like G01N (material analysis) sit at just 5.
  • No single assignee is pulling ahead now. Every tracked assignee with prior activity — from Arcam to Honeywell to QuesTek — shows zero filings in the latest year, pointing to a fragmented, cooled field rather than a consolidating one.
Get a prior-art report on your approach
62
Published Records
68%
Top-5 Share of All Records
-85%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (13 records) with 2024 (2) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 62 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks patent families at the intersection of electron beam melting (and related electron beam powder bed fusion processes) with testing and inspection methods — CT inspection, porosity analysis and mechanical property testing applied to parts built by these processes. It spans publications from 2015 through the 2026 cut-off, covering 62 total families across major receiving offices including the United States, the EPO and WIPO.

Because publication typically lags filing by around 18 months, the most recent one to two years in any trend chart will understate real filing activity. That lag does not change the shape of the longer trend already visible here, which shows a clear early peak followed by a decline.

Annual filing trend, 2017-2026
  1. 1ALCOA INC15
  2. 2BAE SYSTEMS PLC9
  3. 3EOS GMBH ELECTRO OPTICAL SYST7
  4. 4HOWMET AEROSPACE INC6
  5. 5XEROX CORP5
  6. 6QUESTEK INNOVATIONS LLC3
  7. 7HONEYWELL INTERNATIONAL INC3
  8. 8SHIMIZU YOSHIYUKI3
  9. 9POLYVALOR LP2
  10. 10LEGOR GRP2
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Electron Beam Melting Testing and Inspection covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Numbers

Filing trend and technology composition

Two views of the same 62-family dataset: how filing activity has moved year over year, and which technology classes carry the claim volume.

A front-loaded filing curve

Filings peaked at 23 in 2017 and declined toward the dataset midpoint, where 2022 recorded just 6. That pattern is consistent with an early wave of foundational filings around electron beam melting inspection methods, followed by a market that has not generated a comparable second wave — at least not one visible yet given publication lag on the most recent years.

A front-loaded filing curve061319252320172018201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Powder and additive classes carry the volume

B22F (powder metallurgy, 43 records) and B33Y (additive manufacturing, 34) account for the bulk of filings, with C22C (alloys, 25) close behind. Inspection- and control-specific classes — G06T (image processing, 10), G05B (control systems, 9) and G01N (material analysis, 5) — are present but thin, suggesting inspection methodology itself is less heavily claimed than the materials and processes being inspected.

Powder and additive classes carry the volumeB22F · Powder metallurgy4369.4%B33Y · Additive manufacturing (3D pri…3454.8%C22C · Alloys2540.3%B29C · Shaping of plastics1219.4%G06T · Image data processing & genera…1016.1%G05B · Control & regulating systems914.5%G01N · Material analysis & testing58.1%H10N · Other electric solid-state dev…58.1%Other2540.3%

Shares are the percentage of the 62 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Electron Beam Melting Testing and Inspection covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Electron Beam Melting Testing and Inspection with Eureka

This page is one run against one query. Ask Eureka your own question about electron beam melting testing and inspection and every answer comes back with the patent numbers behind it.

Try Eureka
Key Patents

Most-cited records in the corpus

Representative Filing
US20240077395A12024-03-07

Autonomous mechanical performance characterization of three-dimensional articles on a build plate

THE JOHNS HOPKINS UNIVERSITY

A process for autonomous mechanical property testing of specimens on a build plate includes fabricating a plurality of the specimens on a build plate, wherein each of the specimens comprises an upper portion and a lower portion integral to the build plate. Each of the upper portions of the specimens on the build plate are sequentially engaged with an end effector on a terminal end of a multi-linked robotic arm, wherein the end effector is configured to engage the upper portion and apply a uni- or multi-modal load, wherein intermediate the end effector and the multi-linked robotic arm comprises a multi-axis load cell for measuring an applied load.Filed by The Johns Hopkins University, published 2024-03-07 as US20240077395A1.

US20240077395A1 — patent drawing 1US20240077395A1 — patent drawing 2
View full filing
Highest-citation records
#Publication no.Patent titleCitations
1US20160224017A1Systems and methods for modelling additively manufactured bodies75
2WO2013128416A2Silver-based alloy powder for manufacturing of 3-dimensional metal objects50
3US20040042926A1High-silicon stainless31
4US20190054536A13D printing of metallic inks and subsequent heat-treatments27
5US20160279708A1Net-shape or near-net shape powder metal components and methods for producing the same23
6EP3072611A2Net-shape or near-net shape powder metal components and methods for producing the same20
7WO2016123549A1Systems and methods for modelling additively manufactured bodies19
8EP1352980A1High silicon stainless18
9US20230264264A1Structural simulation of additively manufactured components13
10US20170306448A1Alpha-beta titanium alloys having aluminum and molybdenum, and products made therefrom12

Citation counts reflect influence inside this searched corpus and skew toward older filings; treat them as a signal of what shaped the field, not of what matters most today.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Electron Beam Melting Testing and Inspection covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Run it yourself

Put your own technology through the same analysis

 
Where to run it
Fastest

Eureka on the web

When you want the answer in the next five minutes.

The agent works the prompt against patents and technical literature, citing every source.

Run your analysis now →
For builders

MCP server & REST API

When it has to run inside your own pipeline.

Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.

Browse MCP servers →
Insights

What the data means for filing strategy

Read together, the filing trend and the IPC composition point to a field where the foundational claim space closed early and inspection methodology remains comparatively open.

Filing Momentum
23 → 6
2017 peak vs 2022 midpoint

The early wave has not repeated

A peak of 23 filings in 2017 followed by a decline to 6 by 2022 suggests the initial round of foundational patents around electron beam melting inspection has largely been filed. New entrants are not filling that gap at the same pace.

Trend: 2017-2026
Claim Concentration
43 of 62
records in B22F

Powder metallurgy claims dominate

Two-thirds of the dataset sits in B22F, with B33Y close behind. That density means claims on the powder and build-process side are crowded; freedom to operate is tighter there than in inspection-specific classes.

IPC: B22F, B33Y
Inspection Methods
5 of 62
records in G01N

Material analysis and testing is thin

G01N, the class most directly tied to material analysis and testing methods, carries only 5 records against 43 in powder metallurgy. Testing and inspection is present as an application context far more often than as the subject of the claims themselves.

IPC: G01N
Assignee Activity
0
latest-year filings across tracked assignees

No assignee shows current momentum

Every assignee with prior filing history in this dataset — spanning powder atomization, aerospace and materials-informatics players — shows zero filings in the most recent tracked year, consistent with the broader decline rather than any single company pulling back.

Momentum: latest year
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to electron beam melting testing and inspection, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Electron Beam Melting Testing and Inspection covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who has filed, and where the gaps sit

The assignee base spans powder producers, aerospace manufacturers, additive equipment makers and at least one materials-informatics specialist, but recent-year filing activity is flat across the board.

Co-Filing Pattern
2
co-assigned records

One clear internal collaboration

The strongest co-assignee pair in the dataset links a GE aviation entity with its parent, General Electric — evidence of internal cross-filing between a business unit and its parent rather than external partnership.

Co-assignee pairs
Receiving Offices
21
US filings, the largest single office

US and EPO lead filing venues

The United States (21) and the EPO (19) account for the large majority of filings, with WIPO PCT applications (8) trailing. Canada, the UK and Austria each show single-digit counts, indicating this is primarily a US/Europe-contested space.

Offices: US, EPO, WIPO
Field Composition
62
total families tracked

A fragmented assignee base

No assignee shows current-year momentum, and the co-assignment data reveals only one meaningful collaborative link. That combination points to a field of independent filers rather than a small number of firms building layered portfolios.

Assignee ranking: 62 families
🔍
Under-claimed sub-areas to watch
Branches where filing density is low relative to the core powder and process classes.
In-situ CT porosity thresholdingReal-time melt-pool defect classificationAutonomous build-plate mechanical testingMachine-vision porosity scoring for EBM partsClosed-loop control tied to inspection data
Rank all filers by momentum →
Recent-year filing momentum
AssigneeRecent yearYoY
Arcam0
BAE Systems plc0
EOS GmbH Electro Optical Systems0
Xerox Corporation0
Honeywell International Inc.0
QuesTek Innovations LLC0
SHIMIZU YOSHIYUKI0
GE Avio S.r.l.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Electron Beam Melting Testing and Inspection covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this next

The filing trend and class composition point to specific next steps for teams deciding where to file or where to watch.

Map freedom to operate in B22F and B33Y

With 43 and 34 records respectively, these classes carry the densest prior art. A claim drafted here needs a tight novelty search against the powder-process and additive-manufacturing filings already in force.

Explore claim density in Eureka

Test the G01N gap directly

Only 5 of 62 records sit in material analysis and testing proper. That is a smaller set to design around if the claim is built around the inspection method itself rather than the powder or build process.

Run a white space search in Eureka

Watch for a second filing wave

Given the 18-month publication lag, 2025-2026 filings are still arriving. Assignees with prior activity but no recent filings may resume, or new entrants may fill the gap left since the 2017 peak.

Track new filings in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Electron Beam Melting Testing and Inspection covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions

Answers are grounded in the same dataset. Derived from a Patsnap search on Electron Beam Melting Testing and Inspection covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Research Electron Beam Melting Testing and Inspection in depth with Eureka

Go past this page: query the whole electron beam melting testing and inspection corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.

Try Eureka

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

Help us improve this page

Found incorrect or outdated information? Let us know and we'll get it fixed.