Electronic Component Packaging Patents: Leaders & Filing Trends 2026
- 21.5% concentration at the top. The five leading assignees hold 1,124 of the 5,239 records in scope, but the other 78.5% is spread across a long tail of filers.
- Filing growth cooled through 2021-2024. Recorded filings fell from 257 in 2021 to 165 in 2024, a 36% decline over that span, even as the field passed a 2019 peak of 279.
- H01L dominates, but coverage is uneven. 58.9% of records sit in semiconductor devices (H01L), while connectors, magnetics and measurement classes each hold single-digit shares.
Filing growth compares 2021 (257 records) with 2024 (165) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 5,239 records in scope (CR5), not by the ranked leaders only.
What counts as an electronic component packaging patent here
This landscape covers records that combine packaging terms — electronic component packaging, component package, electronic device package — with structural or functional elements such as bonding pad, package substrate, thermal interface, electrical connection, and adjacent identifier or handling-unit terms. The scope spans 2015-01-01 through the 2026-08-31 data cut-off, drawing on 5,239 published records.
Publication lags filing by roughly 18 months, so the most recent one or two years in any trend chart will always look thinner than they will once the backlog clears. Treat 2025 and 2026 figures as provisional rather than as evidence of a slowdown.
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Filing trend and technology composition
Two views of the same 5,239 records: how filing volume has moved year over year, and which IPC subclasses carry the claim density.
Filing trend, 2017-2026
Filings rose from 178 in 2017 to a peak of 279 in 2019, then eased to 257 in 2021 and 165 in 2024 — a 36% decline over that three-year span. The 2025-2026 figures are still filling in under the publication lag and should not be read as a continued fall.
Technology composition by IPC subclass
H01L (semiconductor devices) covers 58.9% of the 5,239 records, well ahead of H10W at 34.5% and H05K (printed circuits & assemblies) at 30.0%. Connectors (H01R, 6.4%), measurement (G01R, 3.1%) and magnetics (H01F, 2.3%) each represent a materially smaller share of claim activity. A record can carry more than one class, so these shares add to more than 100%.
Shares are the percentage of the 5,239 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Electronic Component Packaging Patent Landscape with Eureka
This page is one run against one query. Ask Eureka your own question about electronic component packaging patent landscape and every answer comes back with the patent numbers behind it.
Try EurekaA representative filing and the most-cited prior art
Electronic device package and package substrate for the same (US20140306261A1)
Filed by Samsung Electronics, this application describes an electronic device package where the device's two electrodes connect to matching electrode patterns on a package substrate. The substrate carries a via hole positioned outside the device-mounting region and an irregular surface portion adjacent to that via, aimed at the electrical connection scheme between device and substrate.Abstract condensed from the original filing for length.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20010051766A1 | Endoscopic smart probe and method | 1,285 |
| 2 | US9089338B2 | Medical device packaging with window for insertion of reusable component | 684 |
| 3 | US4956694A | Integrated circuit chip stacking | 421 |
| 4 | US5532512A | Direct stacked and flip chip power semiconductor device structures | 389 |
| 5 | US6639360B2 | High power radiation emitter device and heat dissipating package for electronic components | 344 |
| 6 | US5477933A | Electronic device interconnection techniques | 340 |
| 7 | US20080143954A1 | Biologically fit wearable electronics apparatus and methods | 328 |
| 8 | US6885107B2 | Flip-chip image sensor packages and methods of fabrication | 293 |
| 9 | US6054198A | Conformal thermal interface material for electronic components | 284 |
| 10 | US20090016716A1 | Fiber array unit with integrated optical power monitor | 281 |
Citation counts inside a searched corpus favour older filings that have had more time to accumulate references — read them as a signal of influence on the field, not as a ranking of current relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for filing strategy
Three patterns stand out once you set the record counts against the classes and the timeline.
The top of the field is concentrated, the rest is not
The leading five assignees combine for 1,124 records, 21.5% of everything in scope, and the top ten reach 31.7%. That leaves more than two-thirds of filings spread across a long tail of single- and few-filing entrants, which is where freedom-to-operate searches need the most care rather than the least.
Volume is off its 2019 peak, not accelerating
Filings peaked at 279 in 2019 and had fallen to 165 by 2024, a 36% decline over the 2021-2024 window. That is a real cooling in recorded activity through the last complete filing year, not a data artefact — though the 2025-2026 counts will still rise as publications catch up.
Semiconductor device claims dominate the class mix
H01L alone touches 58.9% of the 5,239 records, with H10W and H05K each covering roughly a third. Connectors, measurement and magnetics subclasses sit in the single digits, which is a narrower claim base relative to how much packaging hardware actually depends on those functions.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to electronic component packaging patent landscape, with the prior art for and against each one.
Assignee concentration and where activity is slowing
The ranked list covers 100 companies by record count. It is not a top-50 or top-100 filtered view — it is the full ranking the dataset returns, and even the leader holds well under a third of all records.
No single company owns the field
The leading assignee holds 307 of the 5,239 records in scope. Fifth place holds 136 and tenth place holds 86 — a steep drop-off that shows scale advantages exist but do not extend into anything like majority control.
Recent-year activity has cooled sharply among top filers
Several of the most active historical assignees show sharp year-on-year drops in the latest tracked year, including declines described as -83% and -100% against prior-year counts. Given the roughly 18-month publication lag, some of this reflects filings still working through to publication rather than a genuine stop in R&D.
Joint filing is rare and concentrated in a few pairs
Only 10 co-assignee pairs appear across the dataset, with the strongest pairing recorded at 8 joint filings. Co-filing is the exception in this field, not the norm, which suggests packaging IP here is mostly built and held in-house rather than through formal filing partnerships.
| Assignee | Recent year | YoY |
|---|---|---|
| Texas Instruments Inc. | 2 | -83% |
| Samsung Electro-Mechanics Co., Ltd. | 0 | -100% |
| Intel Corporation | 0 | — |
| Samsung Electronics Co., Ltd. | 0 | -100% |
| International Business Machines Corporation | 0 | — |
| Micron Technology, Inc. | 0 | — |
| Taiwan Semiconductor Manufacturing Co., Ltd. | 0 | -100% |
| Parker Hannifin Corporation | 0 | -100% |
Where to take this analysis
The dataset points to specific follow-up work depending on whether you are clearing a design, scouting acquisition targets, or mapping white space.
Run a freedom-to-operate check against the long tail
With 78.5% of records held outside the top five assignees, a clearance search needs to look past the obvious leaders into the many smaller filers holding narrow but active claims.
Search assignees in Eureka →Watch the connector and magnetics classes
H01R, G01R and H01F each cover under 7% of records despite being functionally essential to packaging — thin coverage there is worth tracking before someone consolidates it.
Track IPC classes in Eureka →Re-run the trend once 2025-2026 fills in
Because publication lags filing by about 18 months, the true 2025 and 2026 filing counts will only become visible over the next year or two.
Set a monitoring alert in Eureka →Common questions about this landscape
The leading assignee in this dataset holds 307 of the 5,239 records in scope, with the second through fifth-ranked companies trailing behind it down to 136 at fifth place. That leadership does not amount to control of the field: the top five combined account for only 21.5% of all records, and the top ten reach 31.7%. The remaining two-thirds plus of filings are spread across a long tail of companies each holding a much smaller share, so competitive mapping needs to look well beyond the largest names.
Filings peaked at 279 in 2019, then declined to 257 by 2021 and to 165 by 2024, a 36% drop over that three-year span. That decline covers the most recent years that can be treated as complete, since publication lags filing by roughly 18 months. The 2025 and 2026 counts in the raw data will look even lower, but that reflects the publication backlog rather than a further collapse in real filing activity, so they should not be read as continuing the downward trend on their own.
H01L, covering semiconductor devices, appears in 58.9% of the 5,239 records and is by far the largest single class. H10W and H05K (printed circuits and assemblies) follow at 34.5% and 30.0% respectively, meaning most packaging filings touch at least one of these three areas. Smaller classes, including connectors (H01R), general semiconductor devices (H10D) and magnetics (H01F), each cover under 7% of records, marking them as narrower but potentially less contested claim spaces.
The evidence points to under-claimed branches around thermal interface handling, item-identifier and handling-unit integration, and magnetics or in-package measurement functions, all of which sit in single-digit shares of the record base despite being functionally core to packaging hardware. This does not mean those areas are technically unsolved, only that fewer patents have staked claims there relative to how much hardware depends on them. A close reading of the specific claims already filed in those classes is the necessary next step before assuming any space is truly open.
Concentration is moderate rather than extreme: the top five assignees hold 21.5% of the 5,239 records and the top ten hold 31.7%, while the ranked list covers 100 companies in total. That leaves the majority of filings distributed across many smaller players, which is typical of a hardware field with many component sub-systems rather than one dominated by a handful of platform holders. Co-filing between assignees is also rare, with only 10 co-assignee pairs identified across the whole dataset.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.