Jet Impingement Cooling Patents: Leaders, Trends & White Space 2026
A patent landscape for jet impingement cooling in electronics thermal management: filing trends 2015-2026, leading assignees, IPC technology composition and the most-cited prior art, with white-space and freedom-to-opera
Filing growth = 2021 (7 records) → 2024 (31); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 219 records in scope (CR5), not the ranked leaders only.
What the jet impingement cooling patent record shows
Jet impingement cooling directs a fluid stream, liquid or air, at a target surface to strip heat far faster than natural or forced convection over a heat sink. In electronics, that target is increasingly the die itself or the package immediately around it, as power density in high-performance computing and power electronics has outrun what finned air-cooled heat sinks can dissipate. The 219 records in scope span 2015 through the 2026 cut-off and cover both the mechanical delivery hardware — nozzles, manifolds, jet arrays — and its integration into semiconductor packages, circuit assemblies and immersion systems.
Filing activity is recent and steep rather than steady: single digits through the late 2010s, a sharp climb from 2021, and a peak in 2023. Publication lags filing by roughly 18 months, so 2025 and 2026 figures in any trend chart understate what has actually been filed; treat the most recent one to two years as a floor, not a ceiling.
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Filing trend, receiving offices and technology composition
The underlying dataset behind every chart on this page: annual filing counts, where applicants are filing, and how records distribute across IPC subclasses.
Filings climbed sharply from 2021, peaking in 2023
From 7 filings in 2021 to 31 in 2024 — a +343% increase over three years — before the count for 2025-2026 begins its expected downward drift from publication lag. The United States (91 records) and China (45) are the dominant receiving offices, well ahead of the EPO (24), WIPO/PCT (23), India (13) and South Korea (6).
Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.
Semiconductor and circuit-board integration dominate the classification mix
H01L, H05K and H10W each appear on 40.2% of the 219 records, confirming that most applicants claim jet impingement as part of a package or board-level cooling architecture rather than as a standalone heat-exchanger. Heat-exchanger apparatus classes (F28F, F28D) and refrigeration (F25D) sit well behind at single-digit-to-low-teens shares, and niche overlaps with surgical/diagnostic (A61B) and fusion-reactor (G21B) cooling point to adjacent domains borrowing the same jet-impingement mechanics.
Shares are the percentage of the 219 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
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Try EurekaThe most-cited prior art and the newest claim on the field
US20260197968A1 — Multi-chip jet impingement cooling for heat dissipation and methods of use thereof
The invention generally relates to multi-chip jet impingement cooling for heat dissipation and methods of use thereof. In certain aspects, the invention provides a high performance computing (HPC) system comprising: a logic chip; a plurality of high bandwidth memory (HBM) chips; and a jet impingement cooling arrangement; wherein the HPC is arranged such that incoming fluid from the jet impingement cooling arrangement first impinges over the HBMs and is then redirected towards the logic chip to impinge again, thus cooling the HBMs and logic chip in series.Filed by Purdue Research Foundation, published 2026-07-09 — the newest record in this landscape.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US5083194A | Air jet impingement on miniature pin-fin heat sinks for cooling electronic components | 165 |
| 2 | US5063476A | Apparatus for controlled air-impingement module cooling | 125 |
| 3 | US6650542B1 | Piezoelectric actuated jet impingement cooling | 124 |
| 4 | US7885070B2 | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and cool… | 102 |
| 5 | US20100103614A1 | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and cool… | 99 |
| 6 | US20150043164A1 | Jet impingement cooling apparatuses having enhanced heat transfer assemblies | 89 |
| 7 | US20070295480A1 | Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof | 89 |
| 8 | US5228502A | Cooling by use of multiple parallel convective surfaces | 85 |
| 9 | US7362574B2 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus | 70 |
| 10 | US7375962B2 | Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus | 66 |
Citation counts favour older filings simply because they have had longer to accumulate citations within this corpus; treat them as a signal of foundational influence, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Three patterns worth acting on: a growth curve tied to a real thermal-design inflection, a leadership position that is strong but not dominant, and a classification mix that tells you where claims are actually being anchored.
The curve tracks a real design inflection, not hype
Filings rose from 7 in 2021 to 31 in 2024 as chip power density pushed past what finned air-cooled sinks and simple cold plates could handle. That growth rate is measured against 2024, the last year publication lag lets us treat as complete — treat 2025-2026 counts as still filling in, not as a slowdown.
A strong leader, but no lock on the field
The leading assignee holds 26 of 219 records, and the top 5 combined reach 32.4% of all records in scope. The top 10 combined reach 49.3% — just under half the field — which means more than 100 records sit with entrants outside the ranked leaders, a genuine long tail rather than a two-player race.
Claims are written at the package and board level
H01L (semiconductor devices), H05K (printed circuits) and H10W each cover 40.2% of the 219 records — identical shares that show applicants routinely claim the cooling jet as integrated into the package or assembly, not as a bolt-on heat exchanger. Dedicated heat-exchanger classes (F28F, F28D) trail well behind.
US and China lead receiving offices by a wide margin
The United States receives 91 of the tracked filings and China 45, together well ahead of the EPO (24), WIPO/PCT (23), India (13) and South Korea (6). Filing strategy in this field is still concentrated in two jurisdictions rather than spread evenly across the major offices.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to electronics thermal management: jet impingement cooling patent landscape, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Toyota Motor Engineering & Manufacturing North America, Inc. | Purdue University | 2 |
| Xi'an Jiaotong University | Shaoxing Tongyue Wide Bandgap Semiconductor Research Institute | 1 |
Only 2 co-assignee pairs appear across the corpus, the strongest being a joint automotive-and-university filing pair — most jet impingement cooling patents are filed by a single assignee working alone rather than through joint ventures or research partnerships.
Where to take this analysis
The trend and concentration figures above answer what happened. The questions below — viable routes, white space, and freedom to operate — need claim-level reading that a static chart cannot give you.
Map the technical routes still open at commercial scale
Filing density in H01L/H05K/H10W tells you where claim space is occupied, not which routes are commercially viable. Screen the same corpus for claim language, not just class codes.
Explore routes in EurekaCheck freedom to operate against the newest filings
US20260197968A1 and the most-cited prior art define what a new HPC or power-electronics cooling design has to avoid or design around today.
Run an FTO check in EurekaTrack the long tail before it consolidates
With the top 10 assignees holding only 49.3% of records, most of this field's activity sits outside the ranked leaders — worth monitoring for acquisition or licensing targets.
Watch the field in EurekaFrequently asked questions
Jet impingement cooling fires a fluid stream, either air or a dielectric/water-based liquid, directly at a hot surface such as a die, package lid or heat-spreader, rather than relying on convection over a finned heat sink. The direct impact of the jet strips the boundary layer at the surface, giving much higher heat transfer coefficients than passive or fan-driven air cooling. In this patent landscape it appears both as standalone cooling hardware (nozzles, manifolds, jet arrays) and as an integrated feature of semiconductor packages and circuit assemblies, reflected in the high share of H01L and H05K classifications.
The dataset ranks 100 assignees by record count, with the leader holding 26 of the 219 records in scope. The top 5 assignees combined account for 32.4% of all records and the top 10 combined account for 49.3%, meaning slightly over half of the field's activity sits with assignees outside the top 10. This is a moderately concentrated field with a genuine long tail rather than a two- or three-player market.
It is growing sharply on the numbers that can be trusted. Filings rose from 7 in 2021 to 31 in 2024, a +343% increase, with a peak of 33 records in 2023. Counts for 2025 and 2026 appear lower only because patent publication lags filing by roughly 18 months, so those years are still being filled in and should not be read as a slowdown.
The classification mix shows heavy concentration in package- and board-level integration (H01L, H05K, H10W each at 40.2% of records) with dedicated heat-exchanger apparatus classes (F28F at 7.3%, F28D at 4.1%) and refrigeration (F25D at 3.7%) trailing well behind. That gap suggests standalone jet-impingement heat-exchanger hardware, as opposed to package-integrated claims, is comparatively under-claimed relative to how central it is to system performance. Co-assignee filing is also rare — only 2 pairs across the whole corpus — leaving joint development and licensing structures largely untested.
The United States leads with 91 filings, followed by China at 45, then the EPO at 24, WIPO/PCT at 23, India at 13 and South Korea at 6. Any freedom-to-operate or filing-strategy review for this technology should prioritise the US and Chinese patent offices first, since together they account for the large majority of the tracked activity, before extending to Europe and PCT-routed applications.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.